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Fluid-resistant wire sleeves
31 January 2017, Interconnection

TE Connectivity’s D-SCE markers are used to identify wires and cables where exposure to organic fluids, especially oils, is required. The identification sleeves are designed to operate in elevated temperatures for extended periods of time, making them ideal in aerospace, rail and marine industries.

Composed of thin-wall, thermally-stabilised radiation cross-linked polyolefine heat-shrinkable tubing, they are assembled as organised cut sleeves in a ladder configuration. Identification of wires and cables is made possible by computer-based printing onto the sleeves.

D-SCE markers are suitable for use in environments with temperatures of –55°C to +135°C, and will provide strain relief, insulation and protection from mechanical abuse.


Credit(s)
Supplied By: Electrocomp
Tel: +27 11 458 9000
Fax: +27 11 458 9034/5
Email: andrew@electrocomp.co.za
www: www.electrocomp.co.za
       

Further reading:

  • FTDI spins out MCU, HMI divisions
    31 January 2017, Electrocomp, News
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  • How to tell category data cables apart
    31 January 2017, Helukabel SA, Interconnection
    Customers often ask about data cable categories and what they mean. For many end users, engineers and purchasing agents, who don’t work with these types of cables on a daily basis, the different categories ...
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    31 January 2017, Avnet South Africa, Interconnection
    Now available from AVX are the 5236 Series micro SIM memory card connectors from Kyocera Connector Products. Available in both single- and dual-card versions, both of which share a common PCB layout and ...
  • Otto Marketing appointed to distribute waterproof circular connectors
    31 January 2017, Otto Marketing, Interconnection
    After working together closely on a number of key projects, Holin-Tech has partnered with Otto Marketing in order to develop the local market and product range in South Africa. Holin-Tech is a leading ...
  • High-current PCB connectors
    31 January 2017, TRX Electronics, Interconnection
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    31 January 2017, Hiconnex, Interconnection
    Souriau has released a new range of 38999 Series III connectors with integrated backshell, answering the growing need in the aviation and defence industries for smaller, lighter components. The new ...
  • High-current FPC connector
    31 January 2017, Avnet South Africa, Interconnection
    AVX, authorised supplier of Kyocera Electronic Devices, has introduced the high-current, low-profile 6808 series of right-angle FPC connector from Kyocera Connector Products. It is suitable for both ...
  • FPC connectors for high-speed data transmission
    31 January 2017, Otto Marketing, Interconnection
    Hirose has introduced the FH53 range of flat printed circuit (FPC) connectors for small portable electronic devices that require high-speed transmission. The connectors offer excellent impedance characteristics ...
  • Surge arrestors for base stations
    31 January 2017, Electrocomp, Circuit & System Protection
    TDK has developed new gas-filled EPCOS surge arrestors especially for use in base stations. The components have three terminals and are able to extinguish over-voltages both from L to PE as well as N ...
  • HMI development modules
    31 January 2017, Electrocomp, Computer/Embedded Technology
    Bridgetek has introduced a series of development modules to assist engineering professionals as they strive to implement more sophisticated and functionality-rich human machine interfaces (HMIs) and ensure ...
  • MCUs for USB bridging
    31 January 2017, Electrocomp, DSP, Micros & Memory
    Bridgetek has introduced a new series of Super-Bridge microcontroller units (MCUs) to complement the company’s existing FT90x series. The new FT93x devices are able to offer identical performance levels, ...
  • HID-class USB bridges
    9 November 2016, Electrocomp, Telecoms, Datacoms, Wireless
    The FT260 from FTDI Chip is a human interface device (HID) class interface controller IC which can provide USB 2.0 Full Speed (12 Mbps) connectivity to a broad range of application scenarios. These include ...

 
 
         
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