High-speed edgecard connector

14 February 2001 Interconnection

The HiSpecGS connector features Molex's patented Ground by Design contact system with two mating levels: longer power/ground contacts and shorter high-speed signal contacts. This design offers low insertion force, a shorter signal electrical path, lower inductance and speeds over 400 MHz.

Molex's HiSpecGS connector features a 0,76 mm pitch with 32 high-speed signals and 34 power/ground contacts per linear inch, enabling its fast edge rate, low crosstalk and high performance capabilities. The 330 circuit HiSpecGS connector is used in the Alpha Slot B 21264 processor WTX platform workstations. Molex and Alpha Processor, the maker of the Alphas 21264 processor, worked together to develop this interconnect. The 108-circuit and 242-circuit HiSpecGS connectors will be used as the memory expansion card connector (MECC) for Rambus-based memory cards. The 108-circuit connector is for single-channel Rambus applications; the 242-circuit connector is for dual-channel Rambus applications.

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