VIA Technologies announced the VIA EPIA PX mainboard, the first commercial mainboard based on VIA's Pico-ITX form factor measuring just 10 cm x 7,2 cm.
Powered by the 1 GHz VIA C7 processor and supporting up to 1 GB of DDR2 533 SO-DIMM system memory, the tiny 10-layer VIA EPIA PX mainboard is based around the single-chip VIA VX700 system media processor, which features the VIA UniChrome Pro II IGP 3D/2D graphics core, MPEG-2/-4 and WMV9 hardware decoding acceleration and display flexibility, including support for higher display resolutions up to HDTV for HD DVD playback.
Power efficiency is integral to the platform, with the maximum power (TDP) of the processor and chipset at 9 W and 3,5 W respectively, combined with low power DDR2 memory enabling the VIA EPIA PX to run standard productivity and multimedia applications at under 13 W.
This scale of platform miniaturisation was made possible by the reduction in size of the core silicon; the 21 mm square nanoBGA2 package of the VIA C7 processor and 35 mm square VIA VX700 system media processor have a combined area of just 16,7 cm², a board real estate saving of over 50% from previous generation EBGA processors plus twin-chip core logic solutions, and more than that over competing solutions.
Microsoft Windows IoT on ARM Altron Arrow
Computer/Embedded Technology
This expansion means that the Windows IoT ecosystem can now harness the power of ARM processors, known for their energy efficiency and versatility.
Read more...Hardened-grade network switches CST Electronics
Computer/Embedded Technology
Lantronix’s hardened switches provide Layer 2 or Layer 3 networking, and are available as Power-over-Ethernet (PoE) or Power-over-Ethernet Plus (PoE+).
Read more...Ryzen V3000 computer on module Altron Arrow
Computer/Embedded Technology
SolidRun has recently announced the launch of its new Ryzen V3000 CX7 Com module, configurable with the eight-core/16-thread Ryzen Embedded V3C48 processor.
Read more...1.6T Ethernet IP solution to drive AI and hyperscale data centre chips
Computer/Embedded Technology
As artificial intelligence (AI) workloads continue to grow exponentially, and hyperscale data centres become the backbone of our digital infrastructure, the need for faster and more efficient communication technologies becomes imperative. 1.6T Ethernet will rapidly be replacing 400G and 800G Ethernet as the backbone of hyperscale data centres.
Read more...Maximising edge computing
Computer/Embedded Technology
Senao Networks has announced its launch of its SX904 SmartNIC based on the Intel NetSec Accelerator Reference Design.
Read more...UFS Ver. 4.0 embedded Flash memory devices EBV Electrolink
Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.
Read more...Powering factory automation into the future Rugged Interconnect Technologies
Computer/Embedded Technology
Powered by the newest 13th Gen Intel processors, ADLINK Technology’s COM-HPC-cRLS module is a future-proof edge AI solution.
Read more...Linux OS with immutable file system
Computer/Embedded Technology
What really sets VanillaOS apart from others, however, is in security, where it takes a new approach to computing by using an immutable file system for improved security and stability.