Interconnection


Highly rugged Micro-D connector system

6 August 2008 Interconnection

The MIL-DTL-83513 and MIL-DTL-32139 specifications define the minimum acceptable performance levels for Micro-D and nanominiature connectors.

While the specifications are rigid in their performance benchmarks, manufacturers are given considerable leeway when it comes to contact design, crimp fabrication, contact finish and material selection. Stamped and formed contacts, for example, are widely used in Micro-D connectors due to their low cost and ease of manufacture. According to Glenair, testing has shown that TwistPin style contacts provide superior performance in such areas as high temperature tolerance, contact retention and crimp strength.

The accompanying photograph shows important differences between the TwistPin and stamped pins.

1. A better crimp joint. Micro-D connectors are factory-terminated to wire. Board mount and insulated wire pigtails have crimp joints where the wire attaches to the contact. Micro-D crimp joints are concealed with epoxy potting. The Micro-D is unique among high reliability mil spec connectors because the mil spec allows stamped crimp barrels and does not specify that the crimping process must use mil spec crimp tools. The thin sheet metal in the stamped pin cannot produce a satisfactory gas-tight crimp joint, so spot welding is required to reduce the chance of failure.

2. A stronger front end. Both types of contacts meet the requirements of MIL-DTL-83513, but only the TwistPin offers a stronger front-end with its seven points of contact, high normal force and better resistance to vibration.



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