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ARM-based MCUs
31 August 2011, DSP, Micros & Memory

Atmel added five new devices to the SAM9 ARM926-based family of microcontrollers (MCUs).

The new devices target applications in industrial and building control, HVAC, point of sale (POS) terminals, printers and medical devices, smart grid with data concentrators, human machine interfaces (HMI) and machine-to-machine (M2M) market segments.

The new SAM9G15, SAM9G25, SAM9G35, SAM9X25 and SAM9X35 devices expand Atmel’s existing ARM-based portfolio by supporting a range of key technology features required for today’s applications. These features include replacing SDRAM with DDR2 memory for more memory-intensive applications; NAND Flash support with 24-bit ECC for reduced system cost; and more communication channels including dual 10/100 Mbps Ethernet, dual CAN and up to three USB ports for a variety of application requirements.

Atmel has also teamed with Conexant to enable soft modem implementation on the new SAM9 devices to lower the overall bill of materials by eliminating external components. The five new ARM926-based microcontrollers operate at up to 400 MHz and the core and peripherals consume only 100 mW at maximum performance.

The new SAM9 devices also include an advanced graphics LCD controller with hardware acceleration for more modern user interfaces in today’s industrial applications. The enhanced LCD controller includes overlays, alpha blending, image scaling, rotating and colour space conversion to enable a more intuitive interface, while offloading the CPU.

For more information contact EBV Electrolink, +27 (0)21 402 1940, capetown@ebv.com, www.ebv.com


Credit(s)
Supplied By: EBV Electrolink
Tel: +27 11 236 1900
Fax: +27 11 236 1913
Email: saro.murabito@ebv.com
www: www.ebv.com
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Further reading:

  • BLE and energy harvesting development boards
    21 February 2018, EBV Electrolink, Computer/Embedded Technology
    ON Semiconductor has released two new boards, or shields, further extending its recently launched Internet of Things (IoT) Development Kit (IDK) platform’s capabilities. With the addition of two new shields ...
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  • Amplifiers for tiny spaces
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    Texas Instruments has introduced the industry’s smallest op-amp and low-power comparators at 0,64 mm², housed in the compact X2SON package. With a high gain bandwidth of 10 MHz, fast slew rate of 6,5 ...
  • Single-wire serial EEPROM
    31 January 2018, Tempe Technologies, DSP, Micros & Memory
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  • Non-volatile memory ICs
    31 January 2018, Arrow Altech Distribution (AAD), DSP, Micros & Memory
    Adesto Technologies’ DataFlash is a family of non-volatile memory devices with low power requirements and smart features for higher system efficiency and lower system costs. The DataFlash E-series offers ...
  • Development kit for smart passive sensors
    31 January 2018, EBV Electrolink, Telecoms, Datacoms, Wireless
    A complete wireless battery-free sensing solution kit (SPSDEVK1) from ON Semiconductor allows the company’s innovative Smart Passive Sensors (SPS) portfolio to be rapidly integrated into Internet of Things ...
  • Zero-drift nanopower op-amp
    31 January 2018, EBV Electrolink, Analogue, Mixed Signal, LSI
    Texas Instruments has introduced an operational amplifier (op-amp) combining ultra-high precision with the industry’s lowest supply current. Boasting exceptional power-to-precision performance, the ...
  • Low-power SRAM
    31 January 2018, KH Distributors, DSP, Micros & Memory
    To meet the demand for low-power SRAMs with higher densities, Alliance Memory has introduced a new 64 Mb (4M x 16 bit) device in 48-pin, 12 by 20 mm TSOP-I and 48-ball TFBGA packages. The AS6C6416-55 ...

 
 
         
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