Harsh environments that are dusty can be very detrimental to embedded computer systems where fans and heatsinks become clogged and inefficient, causing overheating and system failures.
If these embedded systems are controlling production machines in factories, the cost of such a system failure can be very high. Where the embedded system is in a remote location, the cost of travel to maintain or replace the system can also be very high. Whatever the situation, the cost of the failure outweighs the cost of a system that has a chassis that is fanless.
Fanless chassis are constructed with cooling veins on the outside of the chassis and the CPU boards often have the CPU of the system in contact with the chassis to provide conduction cooling for the CPU. There are several variations on this method of cooling and excluding dust from the interior of the chassis.
Centurion Microelectronics (CME) represents several manufacturers who have fanless embedded systems in their range of chassis; these include IEI (one of which is pictured), Advantech, Quanmax and DFI, among others.
CPU power is one of the factors affecting the selection of a fanless embedded system. Currently CME can offer fanless embedded systems with CPUs ranging from Intel Atom to Intel i3/5/7 systems. For applications that require low CPU power, the Intel Atom processors are more than adequate and for applications requiring more processing power the i-Series CPUs can be used.
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