29 January 2014Manufacturing / Production Technology, Hardware & Services
AIM Solder’s NC259 is a low-cost, lead- and halogen-free solder paste that the manufacturer claims offers performance comparable to that of tin/lead and high-silver lead-free solder pastes, serving as a virtual drop-in for costly SAC305.
Developed in response to many issues that manufacturers face daily, the paste was specifically formulated to match the chemistry of low-silver/no-silver alloys, such as SN100C and SAC0307. Having properly matched chemistry to these alloy types, NC259 effectively mitigates head-in-pillow defects, offers extremely low post-process residue, reduces graping and provides overall heightened performance proving to be a viable alternative for SAC305.
A recipient of Circuit Assembly magazine’s NPI Award in soldering materials, NC259 provides excellent print definition and sustainable solder volume transfer. It has a nine month shelf life when stored at 4°C – 12°C or four months when stored at room temperature.
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printer friendly version