29 January 2014Manufacturing / Production Technology, Hardware & Services
Nordson YESTECH’s new high-speed FX SL AOI inspection system for populated printed circuit boards offers high-speed ‘capture on the fly’ inspection and utilises a flexible and comprehensive set of inspection tools, including angled cameras, a 3D height sensor, advanced lighting, full colour digital image processing technology and both image- and rule-based algorithms.
Configurable for all line positions, the FX series is equally effective for paste, pre-/post-reflow and final assembly inspection. Off-line programming maximises machine utilisation and real-time SPC monitoring provides a valuable yield enhancement solution.
With its advanced colour camera imaging technology, the system offers high-speed PCB inspection with exceptional defect coverage. With one top-down viewing camera and four side-viewing cameras, the FX SL inspects solder joints and verifies correct part assembly, enabling users to improve quality and increase throughput.
Revolutionising clean air in electronics manufacturing Allan McKinnon & Associates
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Designed to prioritise clean air in the electronics manufacturing industry, the ZeroSmog Shield Pro sets a new standard for workplace health and safety.
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The D-VIS and DL-VIS from GKG SMT printer specialists are high-speed dispensing systems that can handle multiple scenarios.
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The Xpection 1860 from Scienscope is a versatile X-ray inspection machine that offers comprehensive circuit board defect detection and quality assurance for the SMT industry.
Read more...Yamaha introduces upgrades to its 3D AOI systems Truth Electronic Manufacturing
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Yamaha Robotics SMT section has revealed performance-boosting upgrades for the YRi-V 3D AOI system, including faster board handling, multi-component alignment checking, and enhanced LED coplanarity measurement.
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New LEXAN CXT film from SABIC offers high thermal process stability and transparency for demanding printed electronics substrates.
Read more...Lead-free solder paste Techmet
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Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloys.
Read more...Analog Devices and Mouser collaborate on eBook
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Mouser has released a new eBook in collaboration with Analog Devices, that offers a detailed analysis of the technologies being used to support sustainable manufacturing practices.
Read more...Improved precision laser marking RS South Africa
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On-the-fly marking at high speeds is only one of the comprehensive features of Panasonic’s new LP-RH laser marker series.
Read more...Optimising AOI performance Rugged Interconnect Technologies
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Optimising AOI performance is now a reality with the highly integrated ADLINK MVP-6200, combined with Intel Arc GPUs.
Read more...High-mix SMT solution from Panasonic Techmet
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Only one machine is required to get production started, and adding more units and/or technologies as demand changes is easy to accomplish.