The increasing construction of large load circuits for drives and controllers results in the use of larger and higher performance electronic assemblies like IGBTs and similar devices. In these performance classes, efficient heating is only possible through forced convection making use of fan units or liquid coolers.
Fischer Elektronik is expanding its product range in the area of high-performance fan units with the LA 18 and LA 22. Measuring 184 x 93 mm and 243 x 120 mm, the fan systems have a flow-optimised hollow rib geometry allowing them to achieve particularly effective heat conduction in conjunction with axial fan motors.
The semiconductor surfaces are arranged so as to minimise heat transmission resistance and optimise component contact. A pre-chamber construction coordinated with the hollow-rib geometry for the units also reduces heat resistance (laminar airflow) and lowers fan noises.
Varistors for automotive applications Future Electronics
Circuit & System Protection
TDK Corporation has announced the addition of two new varistors to its AVRH series for automotive applications where both are characterised by the high electrostatic discharge-withstanding voltage demanded to ensure the safe operation of safety-critical automotive functions.
Read more...Centralised distribution for M8 and M12 connectors Communica
Interconnection
Amphenol LTW’s distribution boxes facilitate efficient cable management, easy installation with pre-wired configuration, and provide a centralised distribution point for M8 and M12 connectors.
Read more...Robust M12 high-temperature connector Communica
Interconnection
Amphenol LTW has released its newest connector, the HDM12, a robust M12 high-temperature offering engineered for commercial applications.
Read more...Single-phase EMC filters RS South Africa
Circuit & System Protection
TDK Corporation has expanded its portfolio of single-phase EMC filters for AC and DC applications up to 250 V and rated currents from 6 to 30 A.
Read more...High-density push-lock connector Communica
Interconnection
Amphenol LTW’s 33-pin Ultra High-Density (UHD) X-Lok mini-size push lock connector boasts compact design and high contact density, providing space efficiency and enhanced data transmission.
Read more...Clearing the Static: ESD protective packaging Actum Group
Circuit & System Protection
The primary objective of ESD protective packaging is to prevent ESD incidents within the packaging and facilitate the dissipation of charges from the outer surface.
Read more...New NeoMesh protocol stack version CST Electronics
Circuit & System Protection
NeoCortec has released an updated NeoMesh protocol stack version 1.6 firmware for its NC2400 and NC1000 module series, which now supports the new Sensirion SHT4xA temperature and humidity sensor series.
printer friendly version