19 February 2014Manufacturing / Production Technology, Hardware & Services
Rogers Corporation has launched COOLSPAN thermally and electrically conductive adhesive (TECA) film providing reliable high-temperature performance. It is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heatsink coins and RF module housings.
The adhesive can be used as an alternative to fusion bonding, sweat soldering, mechanical or press fit metal attachment. It provides both a thermally and electrically conductive bond interface. The film is supplied in sheet form on a PET carrier and is easy to handle when converting into preforms and when peeling from the carrier.
The material is able to survive lead-free solder processing and offers high chemical resistance and high temperature performance. It has been demonstrated to easily survive 5x lead-free solder exposures, 1000 hours at 85°C/85%RH, and 190°C for 10 days.
The impact of ML in robotics Yaskawa Southern Africa
Manufacturing / Production Technology, Hardware & Services
The integration of machine learning into robotics has the potential to revolutionise many industries, and particularly the manufacturing sector.
Read more...ITW EAE wins product introduction award Allan McKinnon & Associates
Manufacturing / Production Technology, Hardware & Services
ITW EAE has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines.
Read more...SiP supports LTE/NB-IoT and GNSS RF Design
DSP, Micros & Memory
The nRF9151 from Nordic Semiconductor is an integrated System-in-Package that supports LTE-M/NB-IoT, DECT NR+ and GNSS services.
Read more...Revolutionising clean air in electronics manufacturing Allan McKinnon & Associates
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Designed to prioritise clean air in the electronics manufacturing industry, the ZeroSmog Shield Pro sets a new standard for workplace health and safety.
Read more...High-speed multi-function dispensing Techmet
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The D-VIS and DL-VIS from GKG SMT printer specialists are high-speed dispensing systems that can handle multiple scenarios.
Read more...Optical inspection for SMT Techmet
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The Xpection 1860 from Scienscope is a versatile X-ray inspection machine that offers comprehensive circuit board defect detection and quality assurance for the SMT industry.
Read more...Yamaha introduces upgrades to its 3D AOI systems Truth Electronic Manufacturing
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Yamaha Robotics SMT section has revealed performance-boosting upgrades for the YRi-V 3D AOI system, including faster board handling, multi-component alignment checking, and enhanced LED coplanarity measurement.
Read more...Flexible printed electronics substrates
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New LEXAN CXT film from SABIC offers high thermal process stability and transparency for demanding printed electronics substrates.
Read more...Lead-free solder paste Techmet
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Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloys.
Read more...Nordic expands nRF91 series RF Design
DSP, Micros & Memory
Nordic Semiconductor has announced the expansion of its nRF91 series cellular IoT devices with the introduction of the nRF9151 System-in-Package (SiP).
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