Telecoms, Datacoms, Wireless, IoT


Bluetooth Smart module

12 March 2014 Telecoms, Datacoms, Wireless, IoT

TDK has produced an ultra compact Bluetooth low energy module designed for the Bluetooth 4.0 low energy (LE) specification, which is being marketed as Bluetooth Smart. With its footprint of just 4,6 x 5,6 mm and slim insertion height of 1,0 mm, the SESUB-PAN-T2541 is well suited for use in the emerging wearable devices market. The Bluetooth IC die is embedded into a thin substrate while all the peripheral circuitry, including a quartz resonator, band-pass filter and capacitors, is integrated on top. The chip’s substrate layers optimally route all of the I/Os to a BGA on the module’s bottom surface. It thus allows easy implementation of Bluetooth connectivity simply by connecting it to a power supply and antenna.



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