23 April 2014Manufacturing / Production Technology, Hardware & Services
Nordson YESTECH débuted its new FX-940 AOI inline PCB inspection system at this year’s IPC APEX Expo in Las Vegas.
This is the company’s latest automated solution for the inspection of solder defects, lead defects/lifted leads, component presence and position, correct part/polarity, through-hole parts, and co-planarity of chips, BGAs and other height-sensitive devices.
Advanced 9 megapixel colour camera imaging technology offers high-speed PCB inspection with extensive defect coverage. With one top-down viewing camera, four side-viewing cameras and 3D inspection, the FX-940 inspects solder joints and verifies correct part assembly, enabling users to improve quality and increase throughput.
Configurable for all line positions, the system is equally effective for paste, pre/ post-reflow and final assembly inspection. Fast and intuitive off-line programming maximises machine utilisation and real-time SPC monitoring provides a valuable yield enhancement solution.
The FX-940 utilises a standard package library to simplify training and ensure program portability across manufacturing lines. Advanced Fusion Lighting and newly available image processing technology integrates several techniques including 3D inspection, colour inspection, normalised correlation and rule-based algorithms to provide complete inspection coverage with very low false failure rate.
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