Texas Instruments has expanded the availability of tiny package sizes to several new families of ultra-low power MSP430 microcontrollers (MCUs). Developers can now design smaller products with FRAM-based MSP430FR5738 and Flash-based MSP430F51x2 MCUs in wafer-level chip scale packages (WLCSP) as small as 2,0 x 2,2 x 0,3 mm. These tiny package sizes make MSP430 MCUs ideal for a variety of ultra-low power applications such as sensor hubs, digital credit cards, ingestible sensors, health and fitness products like smart watches, and consumer electronics like tablets and notebooks. A range of 1,8 V and 5 V tolerant I/O on MSP430F51x2 MCUs allow developers to interface with a broader range of components, in addition to a PWM timer for high-resolution applications.
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