Freescale Semiconductor has revealed its first plastic packaged devices designed specifically for harsh applications. The new MRFE6VP5150N/GN and MRFE6VP5300N/GN power amplifiers are the industry’s first >65:1 VSWR rated devices to be housed in over-moulded plastic packaging. Compared to ceramic RF packages, plastic packaging offers benefits not only in terms of cost, but also manufacturability and thermal impedance.
In harsh industrial environments, devices are required to not only survive, but perform optimally under varying voltages and operating conditions. With a survivability rating of >65:1 VSWR with simultaneous over-voltage and overdrive, the new chips are designed to thrive in these environments while delivering high system reliability and low maintenance costs. Target applications include FM broadcast, CO2 lasers for medical applications, and VHF and UHF base stations for public safety radio installations.
These new RF power LDMOS transistors support wide frequency range utilisation: from 1,8 and 600 MHz. The MRFE6VP5150 is capable of handling a load mismatch of >65:1 VSWR at 50 V d.c., 230 MHz at multiple phase angles; and is capable of 150 Watts CW operation. In addition, both devices incorporate integrated stability enhancements and integrated ESD protection circuitry.
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