8 October 2014Manufacturing / Production Technology, Hardware & Services
SEHO Systems’ new SelectLine selective soldering system offers high precision and solder joint quality as well as a high degree of flexibility, meaning that no changeover is required to dynamically process a variety of assemblies with short cycle times.
The machine concept is consistently modular: the fluxer module, various preheat modules and soldering modules may be equipped individually and, depending on requirements, they can be configured into a complete manufacturing line. Even the smallest version, SelectLine-C, which is designed for standalone operation in the basic configuration, may be expanded with fluxer and preheat modules at any time to be used in inline processes.
The soldering area of the SelectLine can integrate two electromagnetic soldering units for mini-wave processes. The Synchro software feature coordinates the soldering process for two PCBs in such a way that the total throughput is nearly doubled without the need for significant investment. The assemblies can enter the soldering area independently and are not linked to the same cycle.
Patented, automatic ultrasonic cleaning of the solder nozzles means that what previously had to be done manually with aggressive chemicals can be performed automatically and in a relatively environmentally friendly manner. With this cleaning unit, the liquid solder is sent into oscillation which thereby gently cleans the surface of the nozzle. Using the existing inert atmosphere, the surface is completely re-wetted and the solder nozzle is restored to its original state.
SelectLine features a complete hardware and software package for automatic process control. It monitors the fluxing process, including the actually applied amount, provides automatic position correction and z-height correction, controls the wave height and ensures MES integration. A unique feature is the possibility to integrate an AOI system for solder joint inspection directly after the soldering process.
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