1 January 2015
Manufacturing / Production Technology, Hardware & Services
Panasonic’s modular NPM-D3 component mounter is equipped with all the cutting edge technology demanded of modern electronics manufacturing equipment.
The system’s lightweight, 16-nozzle head combines with a highly rigid frame and multi-recognition camera to ensure precision placement of small components. It can handle 03015 sized chips and boasts placement precision down to 0,25 μm.
Dual conveyors on the NPM-D3 can either run independently of one another to produce different boards, or productivity of one board can be boosted by running it on both conveyors simultaneously. Intuitive software allows even operators with relatively little skill to perform feeder setup quickly.
An advanced camera performs measurements in 2D and 3D while maintaining high production. High quality is achieved by upright suction, thickness detection, front and back inversion, lifted leads detection and missing solder ball detection.
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