Design Automation


Altera releases new version of Quartus software

4 February 2015 Design Automation

Altera’s latest development software release - Quartus II version 14.1 - features expanded support for the company’s Arria 10 FPGAs and SoCs. It provides immediate support for the hardened floating point DSP blocks integrated in Arria 10, and gives users a choice between three unique DSP design entry flows and allows them to achieve up to 1,5 TFLOPS of DSP performance. The software also includes several optimisations that improve designer productivity by accelerating design time.

The software allows developers to tap the FPGAs’ integrated IEEE 754-compliant, floating-point DSP blocks to quickly design and deploy solutions that address a range of computationally intensive applications, in areas such as high-performance computing (HPC), radar and medical imaging. These design flows include OpenCL for software programmers, DSP Builder for model-based designers and hardware description language (HDL) flows for traditional FPGA designers.

Additional features in Quartus II Software v14.1 include:

An enhanced Design Space Explorer II (DSE II) tool for faster timing closure, which delivers real-time status and reporting data to users. The data can be used to do side-by-side comparisons of multiple compiles being generated simultaneously on compute farms.

An optimised, centralised IP catalogue and improved graphical user interface (GUI) help to store and easily find all custom IP in a single location.

Additional support for Altera’s new non-volatile MAX 10 FPGAs, which feature dual-configuration Flash, analog and embedded processing capabilities in a small-form-factor, low-cost, instant-on programmable logic device.

Enhancements to the JNEye serial link analysis tool further simplify board-level design and planning. This tool, along with Arria 10 silicon models, is able to simulate transmission line models and estimate insertion loss and cross talk parameters in Arria 10 designs.

For more information contact EBV Electrolink, +27 (0)21 402 1940, [email protected], www.ebv.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

General-purpose MCU with RISC-V architecture
EBV Electrolink DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.

Read more...
AI-native IoT platform launched
EBV Electrolink AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.

Read more...
Serial SRAM up to 4 MB
EBV Electrolink DSP, Micros & Memory
The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.

Read more...
Microchip expands its mSiC solutions
EBV Electrolink Power Electronics / Power Management
The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.

Read more...
Powering up the intelligent edge
EBV Electrolink DSP, Micros & Memory
STMicroelectronics is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.

Read more...
New Studio 6 SDK
Design Automation
New Simplicity Studio 6 SDK opens development environment, and opens developers to Series 3.

Read more...
Flash for AI
EBV Electrolink AI & ML
SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.

Read more...
UFS Ver. 4.0 embedded Flash memory devices
EBV Electrolink Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.

Read more...
InnoSwitch5 Offline Flyback Switcher IC
EBV Electrolink Power Electronics / Power Management
ero-voltage switching (ZVS) flyback topology and advanced SR FET control enable 95% efficiency, together with reduced power supply size and component count.

Read more...
IGBT power module
EBV Electrolink Power Electronics / Power Management
The company has now released its new half-bridge IGBT power modules offered in its redesigned INT-A-PAK package.

Read more...