NXP Semiconductors’ new software developmentkit (SDK) for Kinetis microcontrollers (MCUs) offers support for home automation applications using Apple HomeKit technology. Leveraging the performance and Bluetooth Smart connectivity of NXP’s Kinetis products, the solution streamlines development for a wide range of HomeKit compatible products.
HomeKit is a framework in iOS that lets accessories connect seamlessly so people can better manage their homes. It offers a set of common protocols which enable accessories to work together easily and securely, and allows consumers to control them simply using Siri. HomeKit is built on a secure foundation with end-to-end encryption, providing customers a secure connection between their iPhone, iPad or iPod touch and HomeKit-enabled accessories.
HomeKit software from NXP works with Kinetis K MCUs such as the K11, K22, K24 and K26, while Kinetis KW40Z or KW30Z wireless MCUs provide Bluetooth Smart functionality. Based on the ARM Cortex-M4 core, Kinetis K series MCUs incorporate an arsenal of security features such as cryptographic keys storage, software and system protection options, a hardware random number generator (RNG), and integrated system tamper detection.
The first product based on NXP Kinetis technology with HomeKit support is the Schlage Sense Smart Deadbolt from Allegion, already available in retail stores including the Apple Store. Schlage’s solution is designed to let users control door locks using an iPhone, iPad or iPod touch, as well as manage and store multiple access codes and share electronic access.
General-purpose MCU with RISC-V architecture EBV Electrolink
DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
Read more...AI-native IoT platform launched EBV Electrolink
AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.
Read more...Serial SRAM up to 4 MB EBV Electrolink
DSP, Micros & Memory
The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.
Read more...Microchip expands its mSiC solutions EBV Electrolink
Power Electronics / Power Management
The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.
Read more...Powering up the intelligent edge EBV Electrolink
DSP, Micros & Memory
STMicroelectronics is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...New Studio 6 SDK
Design Automation
New Simplicity Studio 6 SDK opens development environment, and opens developers to Series 3.
Read more...Flash for AI EBV Electrolink
AI & ML
SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.
Read more...UFS Ver. 4.0 embedded Flash memory devices EBV Electrolink
Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.
Read more...InnoSwitch5 Offline Flyback Switcher IC EBV Electrolink
Power Electronics / Power Management
ero-voltage switching (ZVS) flyback topology and advanced SR FET control enable 95% efficiency, together with reduced power supply size and component count.
Read more...IGBT power module EBV Electrolink
Power Electronics / Power Management
The company has now released its new half-bridge IGBT power modules offered in its redesigned INT-A-PAK package.
printer friendly version