Manufacturing / Production Technology, Hardware & Services


Off-line X-ray inspection machine

13 July 2016 Manufacturing / Production Technology, Hardware & Services

The MXI system X8011 PCB, constructed by Viscom in Germany and sold worldwide for many years, has undergone a thorough revision. The company premiered the result, the X8011-II PCB, alongside other systems at the SMT Hybrid Packaging 2016 exhibition in Nuremberg.

The upgrade provides customers with more options for configuring the system, with valuable experiences from many years of practical application having been devoted to the improvement and enhancement of diverse software and hardware features.

The X8011-II PCB can be distinguished from the outside by its new housing, emblazoned with a large melon-yellow V. The front window is motor-driven and its new design makes loading even more convenient. Ergonomics have been significantly improved thanks to the modernised design of the operating console.

Within the system, a faster manipulator ensures more precise positioning of the inspection object. Among other benefits, this results in higher throughput. Moreover, the detector axis swivel range has been optimised to a very practical 60°.

X-ray inspection in electronics manufacturing is indispensable when, for instance, the printed circuit boards are populated with ball grid arrays (BGAs) or quad flat no lead packages (QFNs). As was already the case with its predecessor, the new X8011-II PCB boasts outstanding image quality, a resolution down to the microfocus range, as well as other features.

With its integrated 3D functionality, the system can generate sharp, clear slice or layer images from any penetration angle. It is also very well suited for accurate random testing as well as semi-automatic handling of small to medium job lots (batch operation).

The Viscom SI software takes on fully automatic evaluations. To a great extent, its analysis functions are identical to those of the in-line AXI systems from Viscom. With the Viscom Quality Uplink, the MXI system can be coupled with the SPI, AOI or even AXI systems from Viscom.

Defect detection and prevention see significant improvement with such linkage. Suspect inspection results from the line can be taken to the MXI verification station for an extensive X-ray inspection, making a decisive contribution to process optimisation.

For more information contact Techmet, +27 (0)11 824 1427, info@techmet.co.za, www.techmet.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Clean soldering tips in one second
Testerion Manufacturing / Production Technology, Hardware & Services
Weller has introduced the new WATC100 soldering tip cleaner which can clean soldering tips and desoldering tweezers quickly, efficiently and safely.

Read more...
Yamaha Robotics releases 3D hybrid AOI
Truth Electronic Manufacturing Manufacturing / Production Technology, Hardware & Services
With a 25-megapixel high-resolution camera, the AOI achieves approximately 1,6 times faster speed than previous models.

Read more...
Next gen high-speed modular mounter
Truth Electronic Manufacturing Manufacturing / Production Technology, Hardware & Services
This new addition is a next-generation, compact, high-speed modular mounter with space-saving qualities, and provides a combination of component compatibility and versatility.

Read more...
Modern vision systems in manufacturing
Manufacturing / Production Technology, Hardware & Services
Using an intelligent vision system provides a proactive approach, which helps prevent faulty products from reaching the market, thereby reducing customer complaints and minimising recall costs.

Read more...
Designing and manufacturing robust enclosures for extreme environments
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The lifecycle of robust edge devices starts with design, and all aspects, including electronic components, packaging, shipping, installation, and servicing needs to be considered at the design stage to ensure that an edge device can operate in the environment it is intended for.

Read more...
Maximising soldering iron tip life
Vepac Electronics Manufacturing / Production Technology, Hardware & Services
During the soldering process, the soldering iron tip undergoes physical changes. These changes, over time, affect the ability of the soldering iron tip to make quality solder connections, and can decrease an operator’s performance.

Read more...
White residues on the assembly
Electronic Industry Supplies Manufacturing / Production Technology, Hardware & Services
When white residues suddenly appear on assemblies for unknown reasons, the customer is often confused – and the first idea is often the same: something must be wrong with the cleaner. But this is only the cause in extremely rare cases.

Read more...
Reducing solder paste spatter during reflow
Techmet Editor's Choice Manufacturing / Production Technology, Hardware & Services
Splash is a problem that solder paste will inevitably encounter during the welding process, and distinguishing between spatter and solder ball is the first step in solving the problem.

Read more...
Issues surrounding foam when cleaning
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
Foam is a common issue in the electronic cleaning world, and this article lists the common issues and solutions to preventing foam build up.

Read more...
Clean soldering tips in one second
Allan McKinnon & Associates Manufacturing / Production Technology, Hardware & Services
Weller has introduced the new WATC100 soldering tip cleaner that can clean soldering tips and desoldering tweezers efficiently and safely in just one second.

Read more...