1 January 2017
Manufacturing / Production Technology, Hardware & Services
Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg and other alloy systems favoured by the electronics industry to replace conventional lead-bearing solders. It has robust reflow properties in both nitrogen and air, and it passes J-STD-004B, the most stringent version requirement for a halogen-free solder paste, with excellent SIR results.
Indium8.9HF provides excellent pin-in-paste solderability and hole-fill, robust reflow capability, and a wide process window. By recovering quickly from a pause, it allows customers to maximise the time between wipes while maintaining a long stencil life. Consistently balanced performance enables the lowest cost of ownership to PCB assembly manufacturers, including high printing and soldering yields.
The paste is resistant to common defects known as head-in-pillow and graping, and is well suited for the automotive industry. In addition, the high probe testability of Indium8.9HF minimises false failures in in-circuit testing.
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Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloys.
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News
The company’s innovative products, especially its advanced soldering solutions, are found in many common consumer electronics and high-reliability technologies.
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