Telecoms, Datacoms, Wireless, IoT


Cloud-connectable IoT development kit

17 May 2017 Telecoms, Datacoms, Wireless, IoT

The new high-connectivity STM32L4 IoT Discovery Kit (B-L475E-IOT01A) from STMicroelectronics offers flexibility for developers building IoT (Internet of Things) nodes by supporting multiple low-power wireless standards and Wi-Fi, while integrating a complete collection of motion, gesture and environmental sensors.

Designed to help promptly connect IoT devices to cloud services power efficiently and cost effectively, the development kit adds modules for Bluetooth low energy (BLE), sub-GHz RF and Wi-Fi, with a dynamic NFC-tag IC with printed antenna to a high-perform-ance, ultra-low power STM32L4 microcontroller all on the same board.

The selection of sensors, leveraging ST’s port-folio of MEMS (micro electroechanical systems) and laser-ranging devices, support both user interaction and environmental awareness. A MEMS accelerometer and gyroscope IC and MEMS magnetometer for 9-axis motion sensing, a barometric pressure sensor, temperature/humidity sensor, two omnidirectional digital microphones, as well as a FlightSense proximity and gesture sensor, are all ready to use with no extra integration effort needed.

The kit lets users take advantage of ST’s X-CUBE-AWS expansion software to quickly connect to the Amazon Web Services (AWS) IoT platform, and access tools and services in the cloud, such as device monitoring and control, data analysis and machine learning. Support for other cloud providers will be added in future, as well as software function packs that provide all the components needed to prototype end-to-end IoT solutions, including pre-integrated full application examples.

The heart of the kit is an 80 MHz STM32L475 32-bit microcontroller that combines the ARM Cortex-M4 core featuring DSP extensions, 1 MB on-chip Flash, and the company’s ultra-low-power technologies to help build smart IoT devices on a tight power budget. The combination of MCU performance with rich sensor and wireless integration on the board maximises the kit’s utility, while additional custom functionality may be added using the industry-standard Arduino and Pmod expansion connectors. These two established ecosystems give access to a large selection of expansion boards, which can be quickly connected and easily integrated.

Equipped with the ST-Link debugger/programmer on-board, the STM32L4 Discovery Kit IoT node does not need any external probe, and can be used with ARM Keil MDK-ARM, IAR EWARM, or GCC/LLVM-based integrated development environments (IDEs) including free AC6 SW4STM32, or with mbed online tools.

For more information contact Marian Ledgerwood, Future Electronics, +27 (0)21 421 8292, marian.ledgerwood@futureelectronics.com, www.futureelectronics.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Antennas to meet all connectivity requirements
Electrocomp Telecoms, Datacoms, Wireless, IoT
Kyocera AVX RF antennas meet today’s connectivity demands in the LTE, Wi-Fi, Bluetooth, GNSS, and ISM wireless bands, available in surface mount, patch or external configurations.

Read more...
Introducing SIMCom’s new A7673X series
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat 1 bis module that supports LTE-FDD, with a maximum downlink rate of 10 Mbps and an uplink rate of 5 Mbps.

Read more...
18 W monolithic microwave amplifier
RFiber Solutions Telecoms, Datacoms, Wireless, IoT
The CHA8612-QDB is a two stage, high-power amplifier operating between 7,9 and 11 GHz. The monolithic microwave amplifier can typically provide 18 W of saturated output power and 40% of power-added efficiency.

Read more...
Varistors for automotive applications
Future Electronics Circuit & System Protection
TDK Corporation has announced the addition of two new varistors to its AVRH series for automotive applications where both are characterised by the high electrostatic discharge-withstanding voltage demanded to ensure the safe operation of safety-critical automotive functions.

Read more...
LoRaWAN-certified sub-GHz module
Altron Arrow Telecoms, Datacoms, Wireless, IoT
The STM32WL5M from ST Microelectronics is the company’s first LoRaWAN-certified module which incorporates two cores, one of them being a wireless stack to optimise the creation of sub-GHz applications.

Read more...
3D depth sensing sensor
Avnet Silica Telecoms, Datacoms, Wireless, IoT
A recent announcement by STMicroelectronics has revealed an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with 2,3k resolution.

Read more...
Quectel announces module for RedCap comms
Quectel Wireless Solutions Telecoms, Datacoms, Wireless, IoT
The Quectel RG255G offers downlink performance of 220 Mbps, and uplink performance of 121 Mbps on 256QAM or 91 Mbps on 64QAM.

Read more...
Wide-Bandgap Developer Forum
Infineon Technologies Telecoms, Datacoms, Wireless, IoT
This year marks a new chapter for this exclusive event series – all specialist presentations will be broadcasting live from a studio in Munich.

Read more...
Multimode smart LTE module with GNSS
Quectel Wireless Solutions Telecoms, Datacoms, Wireless, IoT
The AW200Z LTE module is equipped with Bluetooth and Wi-Fi functionalities, and is powered by Qualcomm's advanced 64-bit quad-core Cortex-A53 processors, coupled with an integrated Adreno 702 GPU.

Read more...
LEXI-R10 series cellular module
RF Design Telecoms, Datacoms, Wireless, IoT
The LEXI-R10 Series from u-blox are LTE Cat 1 bis modules that support multi-band LTE-FDD, and are designed for size-constrained devices.

Read more...