Solder resists for direct imaging and high temperatures
1 January 2018
Manufacturing / Production Technology, Hardware & Services
Direct imaging technology has become state-of-the art in the PCB sector, even in small and medium-sized companies. The inconvenience of long process times that are still needed by some machine technologies can be compensated by choosing a solder resist with a high photo-reactivity. Applied by screen printing, curtain coating or spray coating, the products of the series Elpemer 2467 are alkaline-developable solder resists which combine excellent direct imaging properties with high temperature resistance.
In direct imaging, these products require no more than 60 mJ/cm², or even less, of exposure energy; they are already used for series production on common direct imaging units. Despite their reactivity, they offer a wide processing window.
The solder resists fulfil the requirement of a temperature cycling resistance of 1000 cycles at -40°C /+160°C and a continuous temperature resistance of 1000 hours at 160°C. For even higher temperature resistance, Elpemer solder resists are available that can withstand 175°C.
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