1 January 2018
Manufacturing / Production Technology, Hardware & Services
Kester 959T is a no-clean, non-corrosive, liquid flux that is designed for the wave soldering of conventional and surface-mount circuit board assemblies. It was developed to minimise the formation of micro-solderballs during wave soldering operations. The flux contains a small percentage of rosin (0,5%), which improves solderability, heat stability and surface insulation resistance.
959T offers the best wetting and the shiniest solder joints of any no-clean, solvent-based chemistry, and leaves evenly distributed residues for the best cosmetic appearance. It leaves no streaky, white residues and is classified as ORL0 per J-STD-004.
This flux can be applied to circuit boards by a spray, foam or dip process. Flux deposition should be 120-240 g of solids/cm². An air knife after the flux tank is recommended in a foam and wave application to remove excess flux from the circuit board and prevent dripping on the preheated surface.
Revolutionising clean air in electronics manufacturing Allan McKinnon & Associates
Manufacturing / Production Technology, Hardware & Services
Designed to prioritise clean air in the electronics manufacturing industry, the ZeroSmog Shield Pro sets a new standard for workplace health and safety.
Read more...High-speed multi-function dispensing Techmet
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The D-VIS and DL-VIS from GKG SMT printer specialists are high-speed dispensing systems that can handle multiple scenarios.
Read more...Optical inspection for SMT Techmet
Manufacturing / Production Technology, Hardware & Services
The Xpection 1860 from Scienscope is a versatile X-ray inspection machine that offers comprehensive circuit board defect detection and quality assurance for the SMT industry.
Read more...Yamaha introduces upgrades to its 3D AOI systems Truth Electronic Manufacturing
Manufacturing / Production Technology, Hardware & Services
Yamaha Robotics SMT section has revealed performance-boosting upgrades for the YRi-V 3D AOI system, including faster board handling, multi-component alignment checking, and enhanced LED coplanarity measurement.
Read more...Flexible printed electronics substrates
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New LEXAN CXT film from SABIC offers high thermal process stability and transparency for demanding printed electronics substrates.
Read more...Lead-free solder paste Techmet
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Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloys.
Read more...Analog Devices and Mouser collaborate on eBook
Manufacturing / Production Technology, Hardware & Services
Mouser has released a new eBook in collaboration with Analog Devices, that offers a detailed analysis of the technologies being used to support sustainable manufacturing practices.
Read more...Improved precision laser marking RS South Africa
Manufacturing / Production Technology, Hardware & Services
On-the-fly marking at high speeds is only one of the comprehensive features of Panasonic’s new LP-RH laser marker series.
Read more...Optimising AOI performance Rugged Interconnect Technologies
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Optimising AOI performance is now a reality with the highly integrated ADLINK MVP-6200, combined with Intel Arc GPUs.
Read more...High-mix SMT solution from Panasonic Techmet
Manufacturing / Production Technology, Hardware & Services
Only one machine is required to get production started, and adding more units and/or technologies as demand changes is easy to accomplish.
printer friendly version