Electrovert reflow technology wins new product award
23 July 2008, News

Speedline Technologies has received the New Product Introduction award from Circuits Assembly magazine for Electrovert's Intelligent Flux Control (IFC) with RunMax technology. Presented in the reflow soldering category, the award was announced at the IPC APEX trade event in Las Vegas.

The IFC system addresses collection and management of flux volatiles within the reflow oven in a manner that does not require interruption of production for maintenance. Multiple collection boxes located strategically in the oven feature two-stage filtration with an easily-removed heat exchanger and filter cartridge. Machine software monitors and controls flux collection and the system's self-clean function.

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