FEATURING: • Embedded Computing, AI & ML • Interconnect, Passive & Electromechanical • Analogue, Digital & Mixed-Signal Systems • Spotlight: Renewable Energy 30 April 2024 NB-IoT Connectivity Unbound: 5G NTN Communication Bridges Worlds
Dataweek, 30 April 2024 www.dataweek.co.za 1 TELECOMMUNICATIONS, WIRELESS, IoT, RF & MICROWAVE FEATURE 30 April 2024 Vol. 47 No. 3 News................................................................................. 3 Systems, Components, Design.........................8 General ............................................................................. 28 Hot chips......................................................................31 Open [re]sources........................................................32 QuickFind index.....................................................IBC contents on the cover features regulars Spotlight: Renewable Energy.....................................15 The ‘magic’ of photovoltaic cells. Embedded Computing, AI & ML..............................16 Architectural options for AI systems, demystifying quantum, and a variety of new boards used in AI applications. Interconnect, Passive & Electromechanical ............................................................21 Various passive components, the latest connector systems, and modular cabling options. Analogue, Digital & Mixed-Signal Systems .....................................................26 Customisable logic chips, 8-bit microcontrollers, and the latest Hailo SoM. FEATURING: • Embedded Computing, AI & ML • Interconnect, Passive & Electromechanical • Analogue, Digital & Mixed-Signal Systems • Spotlight: Renewable Energy 30 April 2024 NB-IoT Connectivity Unbound: 5G NTN Communication Bridges Worlds Fibocom, a global leader of IoT wireless solutions and wireless communication modules, has unveiled its MA510-GL Non-Terrestrial Networks (NTN) module. Compliant with the 5G 3GPP Release 17 standard, and based on the Qualcomm 9205S modem, the MA510-GL module is capable of using GEO satellite communication and LTE Cat. M1/NB2 connectivity for a range of IoT scenarios. For more information contact Altron Arrow, +27 11 923 9600, [email protected], www.altronarrow.com
Dataweek, 30 April 2024 www.dataweek.co.za 2 NEWS Disclaimer While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements, inserts and company contact details are printed as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material. Published by: Technews Publishing (Pty) Ltd Wild Fig Business Park, Block B, Unit 21, 1494 Cranberry Street, Honeydew Tel: +27 11 543 5800 [email protected] Gauteng Tracy Wolter, Tel: +27 11 543 5800, [email protected] KwaZulu-Natal Jane van der Spuy, Tel: +27 83 234 5412, [email protected] Western Cape Contact Durban or Jhb numbers for details Advertising: Print and Online Sales Manager: Malckey Tehini [email protected] Editor: Peter Howells, B.Tech (Electronic Engineering), [email protected] Subscription services For address changes, subscriptions, renewal status or missing issues call +27 11 543 5800 or [email protected] or WRITE TO: Technews Publishing (Pty) Ltd, Box 385, Pinegowrie 2123 Subscribe online: www.technews.co.za All rights reserved. No part of this publication may be reproduced, adapted, stored in a retrieval system or transmitted in any form or by any means, electronic, mechanical, photocopying, recording or otherwise, without the prior written permission of Technews Publishing (PTY) Ltd. Reg No. 2005/034598/07 ISSN 0256-8934 VOLUME 47 NO 3 30 APRIL 2024 From the editor’s desk Subscribe online: www.technews.co.za Peter There are many subjects that excite me in this world, but two of the larger technical subjects are, firstly, renewable energy, and secondly, the idea of artificial intelligence as it continues to evolve and shape the world we live in. I suppose that living in South Africa, we all have a vested interest in renewable energy in some form or other. This is largely due to the monumental failure of planning by Eskom which has seen parts of the country plunged into darkness at regular intervals. The term coined for this is loadshedding, but I suspect this is simply to make it sound more appetising. More citizens would be outraged if it were called what it actually is: deliberate power failures. We are told that this is to protect the aging and poorly maintained infrastructure that can no longer cope with the demand that South Africa puts on it, thereby preventing a total collapse of the electrical grid. And I agree, it is. But let’s not sugar coat it. Amazingly, approximately 95% of the electricity used in South Africa and 45% of the electricity used in Africa is generated by Eskom and the utility still ranks in the top 20 utilities worldwide by generation capacity. But we can surely all agree that they are battling. Of course, this is why I am so excited by the prospect of renewable energy. I firmly believe that this will be our saving grace in SA. Not because of any new infrastructure that the current government is installing, but rather what the ordinary citizens are doing, now that the government has removed a lot of the red tape. Installations of solar photovoltaic systems, which currently make up the bulk of renewable energy generation in South Africa, has increased dramatically over the last year. Solar panels are becoming cheaper as manufacturing processes get more efficient, and more and more people are spending the capital needed to keep the power on. These little marvels of electricity generation, showcased on page 15, have increased their efficiency significantly, and 500+ W panels are now commonplace. Reducing one’s reliance on the national grid has now become easier than ever before. Artificial intelligence also gets me excited. I believe everyone has heard of, if not used, ChatGPT to see what it is capable of. But this is just a drop in the ocean of systems that use AI. Almost every modern system has some form of AI behind the scenes making sure that the results are spot on; manufacturing, optical recognition, forecasting models, advanced driver assist, online shopping suggestions, humanoid robots…the list could fill up pages Exciting times ahead? if we continued. A survey from 2021 found that 56% of companies had adopted AI in at least one function within the organisation. That number is undoubtedly higher now. But what is it about AI that makes us so enamoured with it? The fact that it is able to mimic a human response. Whether that response is to a question put to it, from an optical system, or simply scouring through volumes of data to find correlations, the output is uncannily human. The next major shift in AI is going to be the widespread use of quantum computing. Quantum computers promise a level of computing power not seen before using classical computing. Combining quantum processing with AI is going to provide machine learning models with a learning capability that will surely make today’s ML systems look paltry. While quantum computers are still in their infancy, great strides are being made in this field. Many institutions believe that the winner of the race to conquer this form of computing will have benefits we cannot yet comprehend. We are certainly living in exciting times.
Dataweek, 30 April 2024 www.dataweek.co.za 3 NEWS ELECTRONIC NEWS DIGEST EVENTS Continued on page 4 Electronic Digest Financial • Despite DRAM suppliers’ efforts to reduce inventories, the overall demand outlook for this year remains poor. Significant price increases by suppliers since Q4 2023 are expected to minimise inventory restocking, and as a result, prices of DRAM for the second quarter 2024 are projected to see an increase of between 3 and 8%. However, it is reported that significant capital investments have occurred in the memory sector due to the high ASP and profitability of HBM. It is predicted that by the end of 2024, HBM’s revenue share within the DRAM industry will increase to around 20%, with an annual supply growth of 260%. • The global installation volume of EV charging stations reached 7,14 million units in Q4 2023, a 12% increase from the previous quarter. This growth is largely due to the increase in EV sales, with the inverter’s main market driving force coming from battery EVs which accounted for 53% of all EV inverter installations in the fourth quarter. According to TrendForce, a key factor in this growth is the technological advancement from traditional Si-IGBTs to SiC chips in inverter power components. This shift enhances the inverters’ voltage breakdown capability and conversion efficiency, improving vehicle range, and enabling the introduction of high-voltage EV models for more efficient charging. • The installed base of wireless IIoT devices in the oil and gas industry is predicted to reach 18,8 million by 2028. This includes devices using cellular, satellite or LPWA connectivity, and represents a CAGR of 19,3%. Since many of the remote monitoring applications require limited bandwidth, it is predicted that non-3GPP LPWA technologies, such as LoRa, will have a significant influence on this sector. • Solar silicon prices in China have plunged to a three-year low due to overcapacity and fierce competition. Average prices of polysilicon, the ultra-refined form of silicon used as a key material in solar panel manufacturing, has seen a 20% drop during April. This has resulted in heavily reduced profits in the industry. • According to the latest research by Berg Insight, the smart waste sensor technology is forecast to grow at a CAGR of 22,8% until 2028. Currently the number of waste collection sites worldwide, excluding China, that are fitted with smart sensors equal 1,25 million. Using the CAGR, this number will increase to a total of 3,5 million by the year 2028. Europe accounts for 45% of this total market. Companies • China’s Longi Green Technology Energy Company, currently the world’s largest solar manufacturer, is cutting almost a third of its workforce as it tries to slash costs in an industry that is dealing with overcapacity and huge competition, according to people familiar with the matter. Longi plans to trim as much as 30% of its staff that last year totalled about 80 000 people at its peak. The move signals an acceleration of job cuts that Longi began in November 2023, when it started laying off thousands of people. • Mycronic’s Global Technologies division has signed an agreement to acquire Vanguard Automation, a company headquartered in Karlsruhe, Germany, which has developed a technology and automated equipment for 3D microfabrication of optical interconnects. Vanguard’s area of expertise is adjacent to and complementing that of the die bonding business line in the Global Technologies division. With this acquisition, Mycronic can offer a wider range of die bonding and optical packaging solutions to its customers. • Vertiv has become a Solution Advisor: Consultant partner in the NVIDIA Partner Network (NPN). This provides wider access to Vertiv’s full portfolio of power and cooling solutions. NPN provides access to a range of benefits, including technical support, training, and collaboration opportunities, helping partners deliver innovative solutions to their customers. • Nampak recently announced that it had suffered a cyberattack, where an unknown third party had gained access to its IT systems. In a statement, the company said that it had retained local and global cybersecurity experts to work with its in-house IT team. It said the SECUREX South Africa 2024 11-13 June 2024 Gallagher Convention Centre, Johannesburg Africa’s largest, most comprehensive security exhibition is now in its fourth decade of providing industry with proven and reputable security solutions. Co-located with A-OSH EXPO, Facilities Management Expo, and Firexpo 2024, Securex South Africa continues to grow in popularity. Securex South Africa is constantly evolving to incorporate products and services that provide organisations with a future proofed and sustainable business tool. Register at https://securex.co.za SEMI 3D & Systems Summit 2024 12-14 June Dresden, Germany The 3D & systems summit exhibition features the most prominent names in the semiconductor industry. Join industry leaders, researchers, and innovators to explore the next wave of technology advances and the future of connected technologies enabled by heterogeneous systems. The full programme will cover various topics including chiplet system architectures, hybrid bonding technologies, manufacturing innovation for 3D integration, and innovations for high bandwidth computing. Register at https://bitly.ws/EpKH SEMICON West 9-11 July San Francisco, USA Touted as the premier microelectronics event on the calendar, SEMICON West will explore groundbreaking technologies transforming the microelectronics sector and enabling smart applications. The show brings the incredibly diverse global electronics supply chain together to address the semiconductor ecosystem’s greatest opportunities and challenges. This is the perfect opportunity for top minds and manufacturers to connect, collaborate, and innovate. Register at https://www.semiconwest.org
Dataweek, 30 April 2024 www.dataweek.co.za 4 NEWS ELECTRONICS NEWS DIGEST Continued from page 3 breach did not impact its manufacturing facilities and operations as it had switched over to its backup manual controls. • EOH Holdings has reported a loss per share of 11c for the six-month period ending 31 January 2024, a slight improvement over the 17c loss reported a year ago, under outgoing CEO Stephen van Coller. Group operating profit was reported as R9 million, down from R142 million for the same period last year. • Tarsus has signed a distribution deal with Samsung Electronics Co., which marks a significant advancement in its growth. Clients in southern Africa will gain easier access to items that fall under Samsung’s Brand Memory and LCD Monitor range. • Transnet National Ports Authority has awarded a R60 million contract to build a solar-powered desalination plant at the Port of East London, which it will then continue to operate for seven years. This will improve the reliability of freshwater supply to users of the port. The project contract has been awarded to a joint venture; Norland Civil Engineers and Contractors and Impact Water Solutions, trading as Sun Water East London. • Africa Data Centres has broken ground on a 12 MW solar farm in the Free State, in collaboration with DPA Southern Africa. This first phase of development will be used to power its Cape Town data centre, with subsequent phases expanding to its Johannesburg data centres, and will be used as a step in achieving the company’s goal of carbon neutrality. • Microchip recently announced the completed acquisition of VSI, a pioneer in providing high-speed, asymmetric, camera, sensor, and display connectivity technologies and products based on the Automotive SerDes Alliance open standard. This acquisition will boost Microchip’s offering of in-vehicle networking solutions. Technologies • NVIDIA’s H100 chips are currently at the forefront of AI model training and are used by nearly every AI company world-wide. NVIDIA has now announced its successor to the H100 named Blackwell. This next-generation platform uses 25% less power but are, depending on the application, between seven and 30 times faster than its predecessor. Blackwell can handle up to 20 petaflops thanks to the 208 billion transistors (compared to the 80 billion in the H100). To achieve this speed, NVIDIA interconnected two chip dies that communicate at speeds of up to 10 TB/s. • NVIDIA’s GPU Technology Conference spotlighted the Blackwell AI server architecture as 2024’s standout hardware innovation. Enhanced by the second-generation Transformer engine and fifth-generation NVLink technology, Blackwell supports AI training and real-time inferencing for models with up to 10 trillion parameters. Leveraging this foundation, NVIDIA is set to launch AI chips like the B100, B200, and GB200, prepping for a surge in advanced AI applications. • An investigation has identified that many Starlink satellite internet kits are being actively traded on the black market in areas where these internet kits are banned. This has become a problem for the company, raising questions about its control of the system, as its reach has now extended to countries that have no agreement in place to operate the system. • Anritsu has extended the functionality of its Signalling Tester MD8430A with the introduction of a protocol test solution for Non-Terrestrial Network (NTN) devices for Geostationary Earth Orbit (GEO) satellites. As a result of the upgrade, the MD8430A can now support NTN NB-IoT technologies.
Dataweek, 30 April 2024 www.dataweek.co.za 5 NEWS Microchip Technology has announced it has expanded its partnership with TSMC to enable a specialised 40 nm manufacturing capacity at Japan Advanced Semiconductor Manufacturing, Inc. (JASM), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan. This partnership is part of Microchip’s ongoing strategy to build resiliency in its supply chain. Other initiatives include investing in additional technology to boost internal manufacturing Microchip expands partnership with TSMC A standalone battery energy storage system (BESS) has won preferred bidder status under South Africa’s Energy Storage Capacity Independent Power Producer Procurement Programme (ESIPPPP). The 153 MW Red Sands project in the Northern Cape will be capable of delivering 612 MWh of energy. The completed project, situated 100 km southeast of Upington, will be the largest BESS in Africa. It will take up an area of 12 acres, connecting to the grid via Eskom’s Garona substation, which will need an upgrade to ensure that it can handle the full capacity of the batteries. The system will be owned and operated by Globeleq, and will be the company’s first large-scale BESS in South Africa. For more information visit https://globeleq.com Huge SA grid battery project Mouser Electronics has announced its sponsorship of the NXP Cup 2024 and a special online prize draw to celebrate the occasion. The NXP Cup is an EMEA-based autonomous car competition, presented by NXP Semiconductors, which is designed to provide students with real-world experiences in autonomous vehicle programming and building. Mouser has sponsored the contest since 2016. The student teams who signed up in October will need to construct, code, and race a self-driving model car, having time to hone their designs before the campus races take place in April and May across EMEA. This year’s event will feature over 150 teams representing several EMEA countries. The winning teams of the campus races will partake in the finals, which will take place in May, with the location being announced soon. Teams will compete in the ‘Speed Race’ where Mouser sponsors NCP Cup 2024 they will have to complete an undisclosed track layout in the fastest time, before completing the ‘Lap of Honour’. For this, contestants will have to slow down their cars to ensure they stop automatically within 10 cm of an obstacle placed on the racetrack. The winning teams will receive €6000, with the winners of the ‘Lap of Honour’ being presented by Mouser. “At Mouser, supporting students is rooted in the foundation of the company’s earliest days,” states Mark Patrick, director of technical content, EMEA at Mouser Electronics. “The NXP Cup serves as an exceptional platform and initial step for students beginning their engineering career. Throughout the competition, students will face real use-case challenges as a team, gaining practical engineering skills and teamwork capabilities, all while having fun.” Participants must use basic skills in embedded software programming, circuit design, and the enthusiasm to learn to create their autonomous race cars. To outperform the other teams, students will need to refine the mechanical and electronic elements of their designs, deploying advanced NXP components such as hall effect sensors, gyroscopes, cameras, and Lidar systems. Additionally, NXP’s Mobile Robotics Suite will enable teams to create sophisticated algorithms for their vehicles. The NXP Cup, formerly known as the ‘Smart Car Race’, started in 2003 with 80 teams of students competing at the Hanyang University in the Republic of Korea. Subsequently, the contest has expanded to China, India, Malaysia, Latin America, North America, and then Europe in 2012. The growth of the competition impacts 15 000 students from more than 500 schools, every year. For more information contact www.mouser.com capabilities and capacity, and establishing more geographical diversity and redundancy with wafer fab, foundry, assembly, test and OSAT partners. “Microchip’s reputation for providing responsible and reliable supply management is enhanced with this new TSMC manufacturing path,” said Michael Finley, Microchip senior vice president of worldwide manufacturing and technology. “Customers can have confidence when designing our products into their applications and platforms, with the support of resilient and robust manufacturing capabilities.” The wafer capacity supply from JASM further strengthens Microchip’s ability to serve a broad base of global customers in a variety of markets, including automotive, industrial, and networking applications. For more information contact www.microchip.com
Dataweek, 30 April 2024 www.dataweek.co.za 6 NEWS TrinaTracker recently showcased its enhanced smart tracking solution at the 2024 Solar & Storage Live Africa event in Johannesburg, South Africa. The event is the continent’s largest renewable energy exhibition, celebrating technologies at the forefront of the transition to a greener, smarter, more decentralised energy system. The company showcased the upgraded Vanguard 1P solution at the exhibition, showing the latest improvements in the brand’s complete product range. The Vanguard 1P is designed to provide customers with trackers that combine suitability for flat terrain, together with outstanding system stability and reliability, quick installation, and flexible external compatibility. It also features state-of-the-art smart control systems renowned for their high reliability, performance and efficiency. The Middle East and Africa are crucial markets for TrinaTracker, and are expected to provide significant growth for the solar tracker market. This growth is largely a result of the region’s abundance of areas suitable for solar projects, coupled with low labour costs, high electricity prices, and the availability of affordable desert land for large-scale solar installations. TrinaTracker has completed the 55 MW solar project in Kesses, Kenya, that will produce 123 MW/h of clean energy a year, meeting the needs of 22 000 homes. In addition, TrinaTracker has commissioned two other installations in the country, with a combined capacity of 155 MW. A recent partnership with POWERCHINA Guizhou Engineering will see them supplying the Damlaagte project in Sasolburg, South Africa, with 123 MW using Vanguard 1P solar trackers. For more information visit www.trinasolar.com TrinaTracker brings its smart solar tracking to SA The additional capacity is intended to be used by private enterprises via the government’s independent power procurement programme, which encourages the signing of power-purchase agreements between private entities. Eskom then facilitates the delivery of this energy from source to destination through a wheeling framework run by local municipalities. Nordex adding 830 MW of wind generation Invertek produces its three millionth drive To that end, the company has designed an improved digital experience with users in mind – a new analog.com website and eShop. New advanced features in the eShop enable visitors to: • Research the capabilities of all ADI products and view their availability. • Order a single part or tens of thousands. Analog Devices’ digital storefront is live Concrete tower sections for this project will be built at a newly established manufacturing plant in Humansdorp, with the plant able to construct the 120 m-high towers on top of which the turbine will be housed. For more information visit www.nordex-online.com Invertek Drives, a global manufacturer of variable frequency drive (VFD) technology, has celebrated producing its three millionth VFD. The landmark arrives just three years after the two-million milestone, demonstrating rapidly growing demand for its energy-saving solutions. Its Optidrive VFDs play a crucial role in reducing energy consumption of up to 50% in some applications and associated emissions. By precisely controlling electric motors, they ensure they only use the power needed for the specific task, significantly reducing wasted energy. This technology is particularly impactful considering estimates suggest over 80 million • Get online support. • Collaborate even better with skilled ADI engineers. • Track the status of an order from the time it was placed to delivery. For more information visit www.analog.com electric motors operate globally without VFD control. Invertek’s dedication to energy efficiency extends to specialised product lines, such as its Optidrive Coolvert VFDs designed specifically for heat pump and refrigeration systems. Designed and manufactured at the company’s headquarters near Welshpool, UK, the production of the three millionth VFD represents Invertek Drives’ ongoing commitment to innovation and sustainability. For more information contact iTek Drives, +27 10 447 6923, [email protected], www.itekdrives.com Analog Devices understands the importance of design engineers being able to access relevant information timeously, and that currently, many challenges are being faced; increasingly complex designs, ambitious sustainability goals, and every-changing geopolitical headwinds. Nordex Energy South Africa will be adding 830 MW of wind energy generation capacity to the company’s already-installed 1 GW base. This 75% increase in its energy generation capacity is set to go online by the middle of 2025.
Organised by: #SecurexSA2024 www.securex.co.za Gallagher Convention Centre • JHB 11 - 13 JUNE 2024 9am - 4pm daily 01 02 03 04 EXPAND YOUR KNOWLEDGE BASE 01 EXPERIENCE PRODUCTS FIRST HAND DISCOVER NEW PRODUCTS AND SERVICES 01 02 03 04 05 06 07 RESOLVE CHALLENGES 01 CONNECT WITH YOUR INDUSTRY PEERS GREAT REASONS TO VISIT THE CO-LOCATED SHOWS: WIN PRIZES & GIVEAWAYS REGISTER ONLINE FOR FREE ENTRY #AOSHExpo2024 www.aosh.co.za #FMExpo2024 www.fmexpo.co.za #Firexpo2024 www.firexpo.co.za SOUTH AFRICA | 2024 2024 CONTACT OUR TEAM TODAY! Pamela Naidoo, Marketing Coordinator Tel: +27 (0) 10 003 3060 Email: [email protected] AFRICA’S ULTIMATE SECURITY EXPO
Dataweek, 30 April 2024 www.dataweek.co.za 8 REGULAR SYSTEMS, COMPONENTS, DESIGN Designers opt for inductor values outside the recommended range for various advantages, such as smaller output ripples, and minimising the solution’s footprint. However, selecting components with values that are too big or too small will result in unintended consequences that can lead to serious damage to the chip, together with decreased efficiency. This article will also examine what happens when proper care is not taken to ensure the load current does not exceed the maximum saturation rating of the inductor. An SMPS is a highly efficient regulator that either steps down an input voltage (buck converter), steps up an input voltage (boost converter), or can do both (buck-boost converter). Basic switching converter topologies can be seen in Figure 1. Every SMPS works by storing energy in an inductor and utilising pulse width modulation (PWM) techniques to obtain the desired output. The guiding principle of these converters is the volt second balance law, which dictates that when operating in a steady state, over one period the average current of an inductor must be zero. This means that the inductor must discharge all the current it stored in the charging stage before another period begins. Operation of buck converters This article uses only buck converters to demonstrate common design errors. Four components make up the power stage of a buck converter: the inductor, the output capacitor, the top FET as represented by a switch, and the bottom FET, which is represented by a diode (see Figure 2). The voltage across the inductor is given by: VL = L diL/dt. This voltage is the difference of the switch node from the output voltage. When the top FET is on, VL is the difference between Analysis of switch-mode power supply: inductor violations By Abe Ibraheim, Kenneth Armijo, central applications engineer, Piyu Dhaker, staff engineer, Analog Devices. the input voltage and the output voltage. When the top FET is off, the difference is 0 V minus the output, because the switch node is grounded. diL/dt (or ∆iL) is the change in inductor current over time, commonly referred to as the inductor current ripple. When the top FET is closed (and the bottom FET is open), the inductor stores energy in the form of magnetic flux as the current through the inductor increases. When the top FET is open and the magnetic field collapses, a path to ground is formed by the bottom FET, allowing current to still flow to the load as it decreases. This can be seen in the inductor current waveform shown in Figure 3. The output capacitor is used to smooth out the output ripple and help maintain the desired output voltage. The output voltage of a buck converter is given by VOUT = DVIN, where D is the duty cycle, and is defined as the percentage of the time out of the total period where the top FET is on and charging the inductor. Recommended inductor sizing When designing an SMPS, the right inductor value must be chosen to ensure an acceptable inductor current ripple (∆iL). It is recommended In this article, common switch-mode power supply (SMPS) design errors will be discussed, including their appropriate rectification. It aims to address complications that arise with the power stage design of DC-DC switching regulators, focusing on the inductor. Figure 1. Common SMPS topologies. Figure 2. Simplified buck converter stage. that the inductor ripple should be between 30 and 40% of the applied load current for buck converters. This range is considered to be optimal, as it is big enough to capture and deliver an accurate signal to the current-mode control feedback system, but not too big that the power supply goes into discontinuous conduction mode (DCM). DCM is a state where the current ripple is too large, forcing the current to go below 0 A to maintain the load current at the desired value. However, once hitting 0 A, the diode inside the FETS no longer conducts, keeping the current from decreasing below 0 A. A general way to select the correct inductor can be obtained by the formula: This formula shows that switching frequency and inductance are inversely proportional, meaning with higher frequencies, the charge time is reduced, allowing proper operation with a smaller inductor (saving footprint size and cost). Saturating the inductor One of the most common and catastrophic errors in SMPS design is neglecting the current saturation rating when selecting the power inductor. When the current through the inductor exceeds the saturation current rating, the core of the inductor saturates, meaning that the magnetic field generated will no longer increase proportionately to the current drawn. This disrupts the volt second balance law, leading to a loss of linear characteristics in both the inductor current ripple and the output voltage ripple. When the iron core saturates, it loses inductance rapidly, behaving more as a resistor than an inductor. Since the effective
Dataweek, 30 April 2024 www.dataweek.co.za 9 REGULAR SYSTEMS, COMPONENTS, DESIGN Figure 3. Inductor current waveform. The current through the inductor charges when the top FET is on and discharges when the top FET is off. series resistance (ESR) of the inductor increases, and the practical inductance decreases, the change in current is forced to increase to satisfy volts second balance. The peaking observed in the saturated current waveform is due to the exponential increase in the current slope, and can be seen in Figure 4. This current peaking carries over to the output voltage, leading to more noise and voltage spikes, as seen in Figure 5. The noise and voltage spikes can potentially damage downstream components if the voltage spikes too much and exceeds a downstream component’s maximum voltage rating, and can also degrade EMI performance. Furthermore, with high current fluctuations, the inductor experiences rapid hysteresis loss, leading to excess heat dissipation of the inductor, as seen in Figure 6, and in audible noise. This excess heat can damage other nearby components, especially the regulator chip itself. To avoid running into this issue, designers should choose inductors with a current rating at least two times greater than the expected maximum current. When calculating the maximum current, it is important to account for the inductor current ripple and the load current drawn from the output. Furthermore, designers can refer to their chosen inductor data sheet to find out at what current the inductance drops by 10 to 30% of its original value, which is where saturation is defined. Choosing an inductor with the proper saturation current rating will result in normal operation of the system, as seen by a linear current through the inductor in Figure 7. The output voltage spikes will disappear, and the system will operate at a much lower temperature, stressing the device less and improving the lifetime of the device. For further reading please visit https://bitly.ws/3hYIL. For more information contact Altron Arrow, +27 11 923 9600, [email protected], www.altronarrow.com Figure 4. Saturated inductor current waveform. The waveform behaves normally until the current surpasses the saturation rating. Figure 5. Saturated inductor output ripple. Peaking is carried over to the output, which contains noise and voltage spikes. Figure 6. Saturated inductor heat dissipation is 107,78°C. Figure 7. Nominal inductor current waveform. Renesas has introduced a new series of microcontrollers called the RA8 series. This new series is part of the Renesas RA family of MCUs based on Cortex-M processors. These MCUs are the industry’s first to implement the Arm Cortex-M85 processor, producing excellent performance measured at 3000 CoreMark points, or 6,39 CoreMark points/MHz. The deterministic, low-latency, real-time operation enabled by this high performance allows system designers to use an RA MCU in applications that would previously have required a microprocessor. Existing designs built for other RA devices can easily be ported to the new RA8 devices. The new RA8 MCUs deploy Arm Helium technology, which provides up to a four times improvement in DSP and machine learning performance compared to MCUs based on the Cortex-M7 processor. This performance boost can enable designers to eliminate an additional DSP in some systems. Bridging the gap between MCUs and MPUs The combination of high CPU performance and Helium technology also provides a dramatic improvement in the MCU’s ability to perform AI and machine learning tasks. For instance, the RA8 series MCUs enable edge and endpoint devices to implement natural language processing in voice AI and predictive maintenance applications, using Helium to accelerate neural network processing. The design of AI applications is assisted by Renesas’ embedded AI and TinyML solutions for automotive, industrial, and commercial products, based on its Reality AI tools. For more information contact Future Electronics, +27 21 421 8292, [email protected], www.futureelectronics.com
Dataweek, 30 April 2024 www.dataweek.co.za 10 REGULAR SYSTEMS, COMPONENTS, DESIGN An ESD (Electrostatic Discharge) audit is the first step in establishing an ESD plan. It is important to include all areas where ESD-sensitive components are being handled. Prior to investing in new equipment, an ESD audit is instrumental in pinpointing vulnerable areas and potentially risky static zones that demand improvement. It’s imperative to encompass all areas where ESD-sensitive components are handled. Data collection The process typically begins with gathering both historical and current data records to help determine the current level of compliancy and adherence to ESD standards. It allows auditors to identify trends, patterns, and areas for improvement within the designated EPA (Electrostatic Protected Area). Workstations and personnel Personnel inspections begin with an evaluation for signs of disorder. Untidy work surfaces are significant contributors to static buildup. Additionally, it’s crucial to recognise that movement generates static, thereby potentially leading to electrostatic discharge. Consequently, at Actum, significant attention is directed towards personnel workstations. Checklist items include grounding equipment such as wrist straps, grounding cords, heel and foot grounders, ESD flooring or floor mats, ESD shoes, and antistatic clothing. Testing equipment Time is taken to review existing test equipment and procedures to determine whether it meets ESD standards. Simply having a tester in place is not sufficient. Is the data reliable, and are the measurement standards right for your application? with Greg Barron, Actum Group director Clearing the Static For more information contact Actum on +27 11 608 3001 or email [email protected] Actum is a specialised importer and distributor of industrial and electronic products in southern Africa. Understanding the significance of ESD audits Microsoft’s Windows 11 IoT offers many features focused on enhancing end user experience. New features in version 11 include USB 4.0 support, Wi-Fi 6E, and Windows Subsystem for Linux GUI (WSLg). The OS has now made a substantial advancement by expanding its compatibility to include the ARM architecture. This expansion means that the Windows IoT ecosystem can now harness the power of ARM processors, known for their energy efficiency and versatility. With ARM support, edge developers can create a broader range of devices, from battery-efficient edge sensors to powerful gateways, all running on a familiar Windows platform. This not only simplifies development but also ensures consistency, enabling a seamless experience for both developers and end users. Presently, the Windows 10 IoT Enterprise LTSC 2021 version offers support for NXP i.MX8 processors, while the Windows 11 IoT Enterprise Microsoft Windows IoT on ARM One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module. This module adheres to the IEEE 802.11ah standard and supports data rates up to 32,5 Mbps between 902 and 928 MHz using channel bandwidths of 1, 2, 4 or 8 MHz. The Morse Micro MM6108-MF08651-US boasts Long-range Wi-Fi HaLow module GAC version extends its support to Qualcomm Snapdragon processors. For more information contact Altron Arrow, +27 11 923 9600, [email protected], www.altronarrow.com Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module. The module supports 3GPP Release 17 IoT-NTN in the S and L band frequencies for satellite communications. In addition, the multi-mode BG95-S5 supports LTE Cat M1, Cat NB2, eGPRS and integrated GNSS. With a cost-effective SMT form factor measuring 23,6 x 19,9 x 2,2 mm, the BG95-S5 is ideal for space-constrained use cases that need to be able to access multiple types of network technology. With NTN satellite communication growing in popularity as constellations are built, having the capability to connect via NTN, cellular, and GNSS offers significant flexibility for designers. It ensures devices will be able to find connections regardless of their deployment Quectel launches 3GPP NTN comms module long-range capability, low power consumption, and superior RF performance. Equipped with features like ultra-long-reach PA, high-linearity LNA, T/R switch, and a 32 MHz crystal oscillator, the device simplifies Wi-Fi HaLow connections to external hosts. The module is ideal for transitioning from previous RF technology, and supports the latest WPA3 security protocols, making it perfect for a wide range of IoT applications. An integrated power management unit (PMU) supports ultra-low-power operation, making is suitable for battery-powered designs. UART, SPI and I2C communications is built in, and the unit includes PWM and GPIO for connecting to external sensors. For more information contact TRX Electronics, +27 12 997 0504, [email protected], www.trxe.com location or whether NTNs are available at the time of communication. For more information contact Quectel Wireless Solutions, +27 82 653 7458, [email protected], www.quectel.com
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Dataweek, 30 April 2024 www.dataweek.co.za 12 REGULAR SYSTEMS, COMPONENTS, DESIGN Moving ahead with the 16- and 32-bit future may have meant that a manufacturer let their 8-bit options fall from their catalogue. The net result is that those who kept up with their 8-bit product line, have a competing product for 32-bit rivals. Competing, you may wonder? While it’s true that a 32-bit microcontroller is fully capable of doing anything an 8-bit can do, can it perform with the same efficiency and cost-effectiveness? This depends… The 8-bit advantage The advantage that an 8-bit MCU has is that you only need to manipulate a small amount of data for a port to be configured or read. 8-bit devices are ideally suited and designed to interface with systems and devices that have simple input: switches, sensors, keyboards, small displays, and serial devices. Adding intelligence to a simple home appliance is the proverbial sweet spot for an 8-bit device, as the end product needs to be inexpensive, easy to use, and has a slight edge, custom or purpose-built. Moving from the planning perspective and onto the more technical scope, the following aspects of an 8-bit design trump the 16- or 32-bit equivalent: • Code density for an 8-bit device is much smaller. • 8-bit microcontrollers have a wider operating voltage from 1,8 to 5,5 V DC, whereas even with 5 V tolerant inputs, the operating range of the 16-bit or 32-bit is restricted to below 3,3 V. • 8-bit devices are more tolerant of noisy environments. The 8-bit survival syndrome – Part 2 • 8-bit devices are usually more power efficient. In general, the 32-bit microcontrollers are a better fit for applications that have a machine interface with calculation performance and software-centric designs, with an RTOS or multi-tasking. That is, they are more suited to your higher-performance applications. However, if your application meets the following requirements, then an 8-bit MCU should be on your radar and could still be the best technical solution: • Hardware-centric applications; • Deterministic behaviour; • Low sleep power consumption; • Robust electrical characteristics, and a real-world interface. This is apt for applications such as desktop coffee machines, toasters, key fobs, security tokens, security system sensors, toothbrushes, PC fan controllers, thermostats, and thousands of other applications. The 8-bit Harvard architecture advantage There are several advantages to using this architecture. The modified architecture uses a dual-bus arrangement, with data on the one and instructions on the other. This design executes instructions in a single cycle. The two-stage pipelining executes one cycle, while the next one is being accessed. This combination of architectural efficiency and ease of use enables designers to be more efficient and get more done using a PIC MCU. An ongoing advantage is that you can migrate from one PIC MCU to another when requirements change. Using the commonly used Operators are shutting down 2G networks to free up frequency bands for 4G and 5G. Module manufacturers have therefore made their 2G modules end-of-life, and are now moving their low-cost 4G modules to Cat.1bis only and doing away with the 2G fallback. SIMCom’s A7673x series peripherals and pinouts, and migrating a project from six to 100 pins and from 128 kB to 384 kB. Conclusion While the debate on 8-bit relevancy will be ongoing, the fight is between the popularity of the 32-bit devices vs the advantages an 8-bit device continues to offer. With the world moving ahead, and the tools for 32-bit development being either free or open-source, the 32-bit devices available are fully capable of replacing the 8-bits. However, 8-bit devices will put up a fight. Ultimately, 8-bit devices handle hardware-centric applications better, and 32-bit devices handle the user interface, RTOS, or advanced applications with greater ease. And therein lies the answer. They don’t necessarily replace, but rather complement each other, and this is more evident in diverse applications that are complete systems. In single stand-alone applications, the 8-bit can supplant a 32-bit with the same ease that the 32-bit device supplants the 8-bit. Build a scaled system with delegated elements and the need for both 32-bit and 8-bit modules becomes apparent. 8-bit devices introduce scaled or delegated application capacity, cost-effectiveness, ease of use, and reduced programming complexity or density. The 32-bit devices are a better fit for applications that have a machine interface with high-performance requirements. For more information contact Haventechnik, +27 78 537 2098, [email protected], www.haventechnik.com Just like the 4-bit pre-microcontroller, the 8-bit MCU has been finding ways to stick around. Their features and speeds have been improving offering competitive reasons to work with them. The SIMCom strategy is no different. They recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps. The A7673X series adopts the LCC+LGA formfactor and is AT command compatible with the A7670 R2 series, the SIM7000/SIM7070 series, and the SIM800/SIM800F series. This enables a smooth migration from 2G/NB/CATM products to LTE Cat.1 products. The A7673X series supports both multiple built-in network protocols and the drivers for three main operation systems (Windows, Linux and Android). The software functions and AT commands are compatible with the SIM800 Industrial standard interfaces, making it suitable for IoT applications such as telematics, metering, surveillance devices, industrial routers and remote diagnostics. For more information contact Otto Wireless Solutions, +27 11 791 1033, [email protected], www.otto.co.za
Driven by the increased market demands from enterprises, airlines, and telecommunication service providers, the integration of cellular and satellite communication is becoming more important for IoT industries. To this end, Fibocom recently unveiled the Non-Terrestrial Networks (NTN) module MA510-GL (NTN) at MWC Shanghai 2023. Compliant with 3GPP Release 17 standard, the Qualcomm 9205S modem-empowered module MA510-GL (NTN) is capable of exploiting the highly resilient Geostationary Earth Orbit (GEO) satellite communication and cellular connectivity to IoT scenarios such as maritime transportation, emergency communication, and scientific research in rural areas. Fibocom MA510-GL (NTN) is a high-performance NTN module, which is tailor-made for the global IoT market. The module supports GEO satellite communication and LTE Cat M/NB2/EGPRS cellular communication, that is perfectly applied for massive IoT applications. Adopting LCC+LGA form factors, MA510-GL (NTN) integrates multiple interfaces such as UART/USB/I2C/I2S for industrial applications. With integrated GNSS, and equipped with eDRX capability, the module is suitable for IoT applications with low power consumption and ultra-small size. “Expanding the network coverage in the non-terrestrial and terrestrial by utilising the cellular and NTN communication technology is a significant milestone in deploying the IoT applications even to the most unreachable areas on earth,” said Jason Zhu, general manager of MTC product management BU, Fibocom. “We are optimistic to offer a reliable, highly-resilient NTN solution to customers worldwide by launching the NTN module MA510-GL (NTN).” For more information contact Altron Arrow, +27 11 923 9600, [email protected], www.altronarrow.com Accelerating the commercialisation of the 5G IoT markets It is estimated that roughly 15% of the globe is covered by terrestrial cellular connectivity. While the implementation keeps developing, combining reliable and robust satellite communication technology with terrestrial cellular networks is an ideal method of improving the network reliability and coverage on land, on water, and in the air. On-Demand IoT SIM Links Field Networks is a lobal I T G o Connectivity olution rovider and a arket S P M Leader in SIM Technology. Our IoT SIM cards connect your device anywhere in the orld at an affordable price. W 58 Wakis Avenue, Strijdom Park, Randburg 2195 steve.kelly | www.links�eld.net @links�eld.net +27 11 791 1033 SOUTH AFRICA Networks (Pty) Ltd SoftSIM SoftSIM technology stores the connection pro�le allowingnetwork registration in a secure manner, the same way the Plastic SIM Card does, using cryptography and unique keys exchanges with the mobile operator. Software developed to safely store the M2M pro�le Components and Models already certi�ed and integrated with SoftSIM Technology Networks that are certi�ed and integrated with SoftSIM Technology Smaller and more Robust (IP6x) Allows greate resistance to temperature, humidity ... r Cost reduction on �eld trips for device service Stock management and Activation simpli�ed Anti fraud, plastic SIM Card cannot be ‘physically removed’ SoftSIM uses cutting edge technology globally www.dataweek.co.za SYSTEMS, COMPONENTS, DESIGN
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