30 May 2022 FEATURING: • Embedded Computing, AI &Machine Learning • Telecommunications,Wireless, IoT, RF &Microwave Complex, Reliable Sensor Processing in One Cost-Effective MCU
Dataweek, 30 May 2022 www.dataweek.co.za 1 TELECOMMUNICATIONS, WIRELESS, IoT, RF & MICROWAVE FEATURE 30 May 2022 Vol. 45 No. 4 News................................................................................. 3 Systems, components, design.......................... 8 General ............................................................................ 29 Hot chips......................................................................31 Open [re]sources ....................................................... 32 QuickFind index ......................................................33 contents on the cover features regulars Telecommunications, wireless, IoT, RF & microwave...................................................................16 Key factors when considering whether to buy a software-defined radio or build your own. Embedded computing, AI & machine learning...............................................................24 A new approach to delivering intelligent edge devices is to be found at the intersection of 5G and AIoT. 30 May 2022 FEATURING: • Embedded Computing, AI &Machine Learning • Telecommunications,Wireless, IoT, RF &Microwave Complex, Reliable Sensor Processing in One Cost-Effective MCU Part of the Darwin product family, the MAX32672 is an ultra low-power, cost-effective, highly integrated and highly reliable 32-bit MCU enabling designs with complex sensor processing, without compromising battery life. It combines a flexible and versatile power management unit with the powerful Arm Cortex-M4 processor featuring a floating-point unit. The MAX32672 also offers legacy designs an easy and cost-optimal upgrade path from 8- or 16-bit MCUs. Learn more about it on page 13. For more information contact Conrad Coetzee, Altron Arrow, +27 11 923 9600, [email protected], www.altronarrow.com
Dataweek, 30 May 2022 www.dataweek.co.za 2 NEWS Disclaimer While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements, inserts and company contact details are printed as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material. Published by: Technews Publishing (Pty) Ltd, 1st Floor Stabilitas, 265 Kent Avenue, Randburg Tel: +27 11 543 5800 [email protected] Gauteng Tracy Wolter, Tel: +27 11 543 5800, [email protected] KwaZulu-Natal Jane van der Spuy, Tel: +27 83 234 5412, [email protected] Western Cape Contact Durban or Jhb numbers for details Advertising: Print and Online Sales Manager: Malckey Tehini [email protected] Editor: Brett van den Bosch, B Eng (Electrical & Electronic) [email protected] Subscription services For address changes, subscriptions, renewal status or missing issues call +27 11 543 5800 or [email protected] or WRITE TO: Technews Publishing (Pty) Ltd, Box 385, Pinegowrie 2123 Subscribe online: www.technews.co.za All rights reserved. No part of this publication may be reproduced, adapted, stored in a retrieval system or transmitted in any form or by any means, electronic, mechanical, photocopying, recording or otherwise, without the prior written permission of Technews Publishing (PTY) Ltd. Reg No. 2005/034598/07 ISSN 0256-8934 VOLUME 45 NO 4 30 MAY 2022 From the editor’s desk Subscribe online: www.technews.co.za COVID-19 South African Resource Portal www.sacoronavirus.co.za Despite not having dabbled in cryptocurrency, I’ve found myself slightly crypto-curious of late, more as a by-product of doing some research into blockchain technology than out of an ambition for investing in it. Of particular interest is Helium, because it rewards people for creating LoRa hotspots using a Heliumcompatible gateway device. Not only can these gateways be used to mine Helium cryptocurrency, called HNT, they also serve the greater good of expanding LoRa coverage without relying on network providers to invest in building out infrastructure. Simply put, it lets people’s wallets do the talking and also provides LoRa connectivity for nodes in covered areas. I’ve therefore had half a mind (bear in mind, I only had half to begin with) to ask one of our clients if I could borrow a compatible gateway to play around with – partly to see how much a ticket into this circus costs and whether it’s worth the price of admission, but mostly to find out whether it’s overcrowded with boffins who do it for a living and act as the ringmasters of the show, leaving little to nothing to be gained for clowns like me. As it turns out, Chris Viveiros, the technical director of Otto Wireless Solutions, saved me the bother by going full-on crypto-crusader on a Helium buzz. I urge you to read his article on pages 20 and 21, where he goes into minute detail about his testing methodology and results, including pitfalls such as a clone of his gateway operating out of Croatia. It’s a thoroughly good read and well worth your time. Also, Massive Chocolate Koala. And Striped Basil Crocodile. I shan’t elaborate but leave that dangling as a cryptic enticement to read the article. A recent article by Fortune magazine suggests that the ‘utility’ value of Helium is attracting investors, over and above the financial value of the HNT currency itself, and highlights the fact that “Literally the whole world is its addressable market.” Underscoring this sentiment around Helium as something Just how high can one get on Helium? of an investment ‘unicorn’, the company raised $200 million and was valued at more than $1 billion after its latest round of funding. This latest fundraising session raised four times more money than all previous rounds combined, although it’s worth mentioning that the HNT’s value has been highly erratic over the past 12 months, rising from R194,52 in June 2021 to a high of R808,72 in November, only to sag to R120,24 as at 25 May 2022. It’s not only its market cap that’s ballooning, so too is Helium’s geographic footprint. At the time of writing, the total number of deployed Helium hotspots stands at 824 159, with 64 708 of those having come online in just the last 30 days. More than 62 000 cities and 174 countries are currently covered, including South Africa (albeit very sparsely). You can track these figures in real time through the dashboard at https://explorer.helium.com/hotspots/
Dataweek, 30 May 2022 www.dataweek.co.za 3 NEWS ELECTRONICS NEWS DIGEST EVENTS EmbeddedWorld 21-23 June 2022 Nuremberg, Germany This event provides a chance to discover the innovations of the embedded sector, meet experts and win new customers. It covers everything from components, modules and complete systems to operating systems, hardware, software and services. Register at www.embedded-world.de/en Sensors Converge 27-29 June 2022 California, USA From sensors and chips to the cloud, Sensors Converge covers the technologies and applications driving innovations of the future. The event gives attendees a chance to hear real stories and see the latest technology applications, delivering a combination of education, networking and training. Register at www.sensorsconverge.com Symposium on Counterfeit Parts and Materials 28-30 June 2022 Maryland, USA Organised in part by SMTA, this symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policymakers, contracts and legal management, security specialists and government agencies. Register at https://smta.org/mpage/counterfeit/ Design Automation Conference (DAC) 10-14 July 2022 San Francisco, USA DAC is recognised as the premier event for the design and design automation of electronic chips and systems. It offers training, education, exhibits and networking opportunities for designers, researchers, tool developers and vendors. Register at www.dac.com productronica China 13-15 July 2022 Shanghai, China Exhibition covering electronics manufacturing, SMT, automation, wire harness manufacturing, printed electronics and adhesives. Supported by forums, conferences, presentations of application examples and panel discussions. Register at www.productronica-china.com/en/ Despite the Semiconductor Industry Association (SIA) reporting a sharp decline in total unit sales during February and March for this year, total average unit sales have seen a year-on-year increase. This has resulted in many of the larger semiconductor manufacturing companies reporting an increase in revenue over the same period last year. Texas Instruments reported first quarter revenue of $4,91 billion with net income of $2,20 billion. This amounts to a 14% increase over the same quarter last year, “primarily due to growth in the industrial and automotive sectors,” according to the chairman, president and CEO of TI, Rich Templeton. He further went on to report: “Our cash flow from operations of $9,1 billion for the trailing 12 months again underscored the strength of our business model. Free cash flow for the same period was $6,5 billion and 34% of revenue. Over the past 12 months we invested $3,2 billion in R&D and SG&A, $2,6 billion in capital expenditures, and returned $5,0 billion to owners.” NXP Semiconductors also delivered record quarterly revenue of $3,14 billion, an increase of 22% year-on-year. Kurt Sievers, NXP president and CEO, announced: “The strong growth we have anticipated for 2022 is materialising. We continue to see robust customer demand, especially our company-specific accelerated growth drivers. Overall, demand continues to outstrip increased supply, and inventory across all end-markets remains very lean.” STMicroelectronics announced revenue for the 2021 financial year of $12,76 billion, driven primarily by its MEMS sensors and optical sensing, and general-purpose and secure MCU divisions. This amounts to a 10% compound annual growth rate (CAGR) for the last three years and resulted in a net income of $713 million. ams Osram reported healthy financial performance, with first-quarter revenues and operating profitability above expectations. Revenues of 1,25 billion Euros for the first quarter were announced. The company also announced that the supervisory board plans to Figure 1: Three-month moving average (3MMA) showing total unit sales for each product category. elect Dr Margarete Haase as chairwoman of the supervisory board, to succeed retiring chairman Hans Joerg Kaltenbrunner. Continued strong demand for semiconductors, despite global uncertainties, allowed Infineon Technologies to amass revenues of 3,3 billion Euros for the second quarter of the 2022 financial year. This represented a 22% year- on-year increase and a 4% increase over the preceding quarter. The outlook for the third quarter predicts revenue of around 3,4 billion Euros. onsemi announced record revenue of $1,95 billion, an increase of 31% year-on-year. “Our focused strategy has delivered sustainable results in onsemi’s margin and growth profile, with the automotive and industrial end-markets now representing 65% of our revenue. Our record quarterly results, with year-over-year growth of 31% in our first quarter revenue, highlight the strength of our business and the value of our products as we continue our transformation,” said Hassane El-Khoury, president and CEO of onsemi. Analog Devices “delivered its fifth consecutive quarter of record revenue, illustrating the unprecedented demand for our technologies and our ability to increase output in a challenging supply backdrop,” said Vincent Roche, CEO and chairperson. “Despite increasing geopolitical uncertainty and ongoing supply chain disruptions, we enter the second half from a position of strength, with increased capacity and continued bookings momentum.”The company announced revenue of $2,97 billion, with double-digit year-on-year growth across all end-markets. This represented a 79% increase in revenue. According to the SIA, the strong upward market trend is due to the growing demand for semiconductors because of increased digitalisation of the economy, growing demand for ‘smart’ products, and increased remote work, schooling and shopping. For more information and to access the SIA’s semiconductor unit sales dashboard, go to www.semiconductors.org/sia-unit-sales-dashboard/
Dataweek, 30 May 2022 www.dataweek.co.za 4 NEWS To illustrate how handy this service can be for its customers, ExecuWeb shares the following practical examples of how it has already helped customers in need. Case study 1 A large manufacturer of utility meters needed components to complete a few hundred outstanding units to complete its order. The problem at hand was that some components in the old design were now obsolete and costing thousands of Rands on the open market. ExecuWeb was approached to try and assist with the shortage, and within a week it managed to source the necessary components from a security company looking to free up storage space and get rid of its redundant stock. As a result, manufacturing could proceed on the one hand, and potentially discarded stock was converted into cash. Case study 2 An international component supplier was looking for a hard-to-find STMicroelectronics processor. It contacted a local supplier for assistance, which in turn put it in touch with ExecuWeb. ExecuWeb sourced the components from another contract manufacturer that had over-bought the required component but subsequently lost the applicable contract. The contract manufacturer was happy to recover some funds while ExecuWeb exported the required components at the highest bid. “Over and above our ever-increasing redundant stock offerings, the message that we would like to put across to the electronic engineering community is simply ‘Design around Us’. We are a reliable knowledge base for which components are readily available for your new designs. Simply send your query via our online ‘Contact us’ page (www.electroniccomponents.co.za/contact-us/) and we’ll give you the most up-to-date data available from the component OEMs. We offer accurate feedback on our stock availability as it is based on live data and automatically updates the changing stock levels in our warehouse,” said Renita Fleischer, director of ExecuWeb. “Our stock control system allows for all our stock to be live on our website 24/7. Try www.electroniccomponents.co.za to see what we have available. All our components are existing (on-hand) stock that is available within a day or two, depending on delivery or pickup arrangements. For engineers that want to have all the hassle taken out of the procurement process, we offer the services of ExecuKit which specialises in procuring entire BOMs and delivering ‘manufacturing ready kits’ to your chosen contract manufacturer.” Sponsorship of promising electronic engineering student Over and above the work put in behind the scenes implementing and optimising the ExecuWeb platform, ExecuGroup decided to sponsor one student for the full term of their studies on a year-to-year basis, in order to compensate for declining bursaries offered to electronic engineering students. The directors of the Group made a collective decision that if any of its ExecuGroup launches ExecuWeb, sponsors engineering talent Shermann van der Merwe. The ExecuGroup recently launched ExecuWeb, which specialises in supplying redundant electronic components to the EMS (electronics manufacturing services) industry. Catalogued line items are also being made available, to offer a one-stop-shop service to those browsing for obsolete or slow-moving stock online. “Over and above our ever-increasing redundant stock offerings, the message that we would like to put across to the electronic engineering community is simply ‘Design around Us’.” member companies was approached with a request to assist a student in its field of operations, they would meet the potential candidate and make their final decision. At one of the company’s annual eye test days for its employees, the optometrist made mention of a young man by the name of Shermann van der Merwe. Upon receiving his application for assistance, ExecuGroup’s directors were struck by the first quotation in his letter of introduction, which said: “As engineers, we are in a position to change the world – not just study it,” in the words of Henry Petroski. “We were impressed by this young man’s achievements: seven distinctions in matric and six distinctions in his first year of studies at North-West University Potchefstroom,” the directors explained. “His outlook on life, great work ethic and determination to rise above his circumstances were very impressive to us. “We know that Shermann is currently working very hard, and we wish him success with his studies. We meet with him every quarter just to show our support, not only on the monetary side but to build a relationship, as none of us knows what the future might bring, so we should make the best of every day.” For more information contact ExecuGroup, +27 11 791 3548, [email protected] or [email protected], www.electroniccomponents.co.za
Hie Turnkey projects and sub-assemblies • Turnkey electrical and optical interconnect harness and cable assemblies • Project management • Electrical kitting • Research, development and manufacturing of sub-assemblies Wire, sleeving and accessories • Mil Spec wire • Automotive wire • Fibre optic • High-speed data cable • Braided shielding • Conduit • Lightweight ground straps • Heatshrink boots and terminations Rectangular connectors • D-sub - high density • D-sub • Micro D • Nano D • DIN connectars • Headers ·ARINC Circular connectors Mil-Aero circular connectors for severe environments, aviation, defence and space, heavy industry (railway and mass transit, nuclear, oil and gas) and industrial equipment markets. • Mil-C-26482 • Mil-C-5015 • Mil-DTL-38999 RF connectors and cables • Comprehensive range of RF connectors up to 65 GHz • All standard series: SMA, SMP, SMPM, N, TNC, SMB, SMC, SSMC, MMCX, MCX • Blindmate: SMP, SMPM, SMPW, BMA • High-frequencyprecisionconnectors for test: 2,4 mm, SMA2.9, TNC18 • High-power antenna low PIM connectors: NEX10, 4.3-10, QLI, 7-16 • High-voltage connectors: BNC, HV/MHV, HN, SHV +27 12 661 6779 I [email protected] I www.hiconnex.co.za
Dataweek, 30 May 2022 www.dataweek.co.za 6 NEWS As one of the first digital-centric business programmes at South Africa’s highest level of education, DPhil is providing academic credibility to a subject that has long been seen as an abstract concept. The programme is in line with the JBS’ goal of becoming South Africa’s premier business school for the digital era. It is for business executives and organisational leaders who are poised to introduce and be the frontrunners of the digital transformation efforts of their organisations. For the last decade, 4IR has been a subject best left to futurists, global economic lobbying organisations, governments and the few businesses that saw emerging technologies looming. However, according to Professor Lungile Ntsalaze, the head of the JBS DPhil in Digital Transformation programme, 4IR technologies are fast becoming a part of our daily lives, and leaders will need to incorporate them into their operations. “The transformation to a digital future is happening right now. Everyone has to be prepared for the disruption that it will cause.” The DPhil programme is that very tool that will help make organisations future fit, said Ntsalaze. “The technologies are bursting out of laboratories and making their way into the world on a marketable scale. Our programme prepares students to take advantage of the new opportunities that will arise from this disruption.” Unlike traditional doctoral programmes, this particular degree is a balanced mix of theory and practice, with a supervisory panel from a diverse pool of experts to benefit students’ work. Mentors are on hand to support candidates throughout the research proposal development stages. Since digital transformation cuts across organisational functions and industries, this programme, through a highly selective admission process, is accessible to anyone with a Master’s degree from any field of study. 4IR tech meeting global challenges head-on The World Economic Forum’s Centre for the Fourth Industrial Revolution considers emerging technologies – such as big data, blockchain, artificial intelligence, quantum Joburg Business School launches PhD in digital transformation computing, cloud computing and drone technology, among many others – as tools that can help us overcome the global challenges of inequality, climate change and food security. Ntsalaze said that turning digital transformation into a subject of study emphasises the important role organisations play in overcoming these global challenges. “Digital transformation has long been government’s rallying cry to keep South Africa relevant within the global economy. But government may not be able to transform the country as quickly as large businesses can. Corporates can adopt emerging technologies swiftly and take them to market. If business rides this wave, South Africa will remain a vital part of the global economy.” He added that it is the business sector that will be the catalyst for wholesale digital transformation. Finding innovative solutions to real-life problems While there is a gap between digitalisation and the lack of skills among the population – which has increased rates of unemployability – a key aspect often overlooked is business skills, said Ntsalaze. “In the not-so-distant past, countering unemployment meant creating jobs, upskilling employees’ digital skills or encouraging entrepreneurship. These interventions have not worked. Instead, we need digitally skilled workers with good business acumen.” He added that the government would need to address this gap as soon as possible to prevent much of the labour force from becoming irrelevant in the near future. “It is no wonder that some multinational tech companies are coming to South Africa with ready-made expat workers. South Africa needs to recognise that we need a workforce that is digitally adept and business savvy.” A worldwide survey conducted by the next-generation online university platform, Nexford University, found that 85 million jobs will be unfilled by 2030 due to skill shortages. It also stated that 87% of employers worldwide report a lack of talent. “A globalised business world runs with digital tools which demand that employees have high levels of skill. Soon enough, we will find that semi-formal – or middle-skilled – positions need to be filled by highly educated individuals,” said Ntsalaze. JBS is poised at the interface of academia, business and the public sector to have a real impact on society with DPhil, giving students conceptual knowledge and practical tools to initiate, lead and manage the digital transformation process for their organisations. Students, supported by leading researchers and industry experts, will undertake rigorous scholarly research to develop the intellectual capacity that is essential to address societal challenges. For more information visit https://jbs.ac.za/ dphil-in-digital-transformation/ Professor Lungile Ntsalaze. With the Fourth Industrial Revolution (4IR) continuing to disrupt global markets, it is time that leaders prepare themselves to meet this challenge. The Johannesburg Business School (JBS), a faculty of the University of Johannesburg, recently launched its Doctor of Philosophy (DPhil) in Digital Transformation degree which is tailored to help business executives and organisational leaders adapt to an ever-changing digital environment. “The transformation to a digital future is happening right now. Everyone has to be prepared for the disruption that it will cause.”
Dataweek, 30 May 2022 www.dataweek.co.za 7 NEWS John Kimani, programme manager for Africa developer training, posted that according to the 2021 Africa Rand Report by Google and Accenture, opportunities for software developers in Africa are at an all-time high. This has been driven primarily by the booming start-up ecosystem and the global demand for remote work. Local businesses are also contributing to this demand as they seek to hire more developers to help them build a better online presence. The report also covered ways that technology companies can accelerate access to these opportunities through education and training programmes that improve job readiness. Google has been supporting developers in Africa for over 10 years through community and training programmes, and today, there are more than 180 active developer communities in 30 countries across Africa. These local developer communities provide developers with the opportunity to Google announces Africa developer scholarship with Greg Barron, Actum Group director Clearing the Static For more information contact Actum Group on +27 11 608 3001 or email [email protected]. Actum Group is a specialised importer and distributor of industrial and electronic products in South and southern Africa. Attendees can visit the Mouser Demo Pod to experience some of the latest technologies from Mouser’s manufacturing partners, including: • Voice control for home automation using NXP’s SLN-ALEXA-IOT kit, a simple motor drive, and either voice commands or the Amazon Alexa app. • People-counting for smart buildings using the EagleEye people-counting system from Analog Devices. • Smart home environmental data monitoring using the Würth Elektronik Sensor Featherwing with Arduino Portenta H7 board, enabling rapid prototyping of smart home applications. • Indoor air quality monitoring using the Microchip PIC-BLE development board and the Mikroe Air Quality 7 Click, a compact add-on board able to monitor volatile organic compounds and CO2 variations. • Bluetooth Mesh lighting for a smart home using the Silicon Labs Thunderboard Sense 2 boards. Mouser to empower design engineers at EmbeddedWorld 2022 connect, learn and grow together. The research report showed that nearly one in every two developers in Africa has been through a Google developer training or community programme. For the fifth year in a row, Google will be partnering with Andela (www.andela. com) and Pluralsight (www.pluralsight.com) on this programme. Developers selected for the programme will gain access to carefully curated training content and hands-on learning experiences. They will also access a pan-African network of peer learning groups and community mentors who will guide them on the learning journey. The online scholarship application may be accessed at www.go.pluralsight.com. Interested members are also invited to attend this year’s virtual Google I/O developer conference, where the company will be sharing more about Africa’s booming developer ecosystem. As part of the company’s continuous efforts to inspire innovation, Mouser’s booth will also feature a ’spin-to-win‘ game and prize draw. The ’spin-to-win‘ game will be making a welcome return to the Mouser booth in 2022, where all visitors to the booth are welcome to spin the wheel for a chance to win one of a host of gadgets, including a high-quality miniature multi-tool and various multimeter test equipment. For the duration of Embedded World 2022, Mouser will also be offering free reusable water bottles, which can be refilled using the eco-friendly water station at the Mouser booth. Visitors to the booth will also have an opportunity to use the Customer Service Pod, where Mouser’s team will be on hand to introduce attendees to the latest services and tools on the company’s website. For more information visit https://emea. info.mouser.com/embeddedworld-2022 Google has announced an additional 30 000 Android and Google Cloud training scholarships for aspiring and professional developers, in an effort to show continuous support and commitment to Africa’s developer ecosystem. Mouser Electronicswill be exhibiting at EmbeddedWorld 2022 in Nuremberg, Germany, from 21 to 23 June 2022. Attendees can find the Mouser exhibit in Hall 4A, Booth 102. During storage and transportation outside of an ESD-protected area (EPA), it is recommended that ESD-sensitive items are enclosed in packaging that provides ESD shielding. In addition to effective static control within the workplace, safe transportation and storage are vitally important. All ESD-sensitive components should be kept safely at the same electrical potential for their entire lifecycle. Corstat and Cortronic storage boxes are ideal for safe transportation of ESD-sensitive components, such as printed circuit boards. A soft, dissipative foam lining provides safe padding and removes static. These coated boxes are made from cardboard dipped in carbon and come flat-packed to enable assembly on site. Its static-dissipative skin and buried conductive core ensure electronic components are shielded from electrostatic discharges throughout transportation. Another aspect to be aware of during product transportation or storage is humidity. It can lead to excessive moisture inside of packaging, which can potentially damage electronic components by causing corrosion and mould-attack. Desiccant bags absorb moisture inside of sealed packaging and will safeguard products during transportation or storage. Tip-n-Tell and Drop-n-Tell shippingincident and mechanical impact indicators detect all shipping irregularities without fail. If your shipping cartons need to be kept upright, these products are ideal. Safe storage and transportation of ESD-sensitive components
Dataweek, 30 May 2022 www.dataweek.co.za 8 REGULAR SYSTEMS, COMPONENTS, DESIGN Segger’s J-Link offering is among the most widely used line of debug probes on the market, having provided solid value to embedded development for over a decade. Their performance, extensive feature set, number of supported CPUs and compatibility with popular environments make these tools a popular choice. J-Link debug probes are widely used for optimising the debugging and Flash programming experience, featuring Flashloaders with up to 3 MBps RAM download speed and the ability to set an unlimited number of breakpoints in the Flash memory of MCUs. J-Link also supports a wide range of CPUs and architectures – everything from a single 8051 IC and the mass-market Arm Cortex-M, to high-end cores like Cortex-A (32- and 64-bit). J-Link enables direct interfacing of SPI Flash memory without the need for a CPU between the probe and the SPI Flash. J-Link is supported by all major IDEs, from free Eclipse-based ones (directly or via GDB) up to commercial-grade ones, including Segger Embedded Studio. J-Link makes Flash memory feel almost like RAM. Since it comes with a set of speedoptimised, built-in Flash-loaders, it can easily and quickly be downloaded into Flash memory. The J-Link software and documentation package (which is available for download) includes a significant number of tools that make a developer’s job easier and extend the capabilities of J-Link. Almost all J-Link tools have cross-platform support and run on Windows, Linux and macOS. Embrace the full power of J-Link debug probes No matter the use-case, the Segger J-Link product family has a device for each and every one. Ozone debugger and performance analyser Ozone is a full-featured graphical debugger for embedded systems. Thanks to features such as trace, code profiling and code coverage analysis, it is also a very powerful performance analyser. Ozone allows for the debugging of any embedded application at C/C++ source and assembly level, loading of applications built with any toolchain/IDE, or even debugging the target’s resident application without any source. Ozone includes all well-known debug controls and information windows, making use of the best performance of J-Link and J-Trace debug probes. The user interface is highly intuitive yet fully configurable – each window can be moved, resized and docked to fit developers’ needs. SystemView embedded systems analysis SystemView ensures that systems perform as they are designed. It is a real-time recording and visualisation tool for embedded systems that reveals the true runtime behaviour of an application, which is exactly what is needed when working with complex embedded systems. SystemView tracks down inefficiencies, shows unintended interactions and resource conflicts, and does so with a focus on the details of every single system click. Embedded Studio all-in-one solution Embedded Studio is a complete, all-in-one solution for managing, building, testing and deploying embedded applications.
COMBICON, Dataweek, 1.2 A4, May issue.pdf 1 2022/05/18 16:06:22 With a Visual Studio-like appearance giving embedded engineers the same intuitive usage PC developers enjoy, it is an ideal solution for embedded C programming. With Embedded Studio, developers get a powerful project generator for an easy start with common microcontrollers. Also included is a project manager, a source code editor, C/C++ compiler and integrated debugger. Discover the J-Link ecosystem J-Link doesn’t just support Segger’s own software, it also supports a host of thirdparty software which aids embedded system development. GDB Support J-Link can be used with GDB-based setups. The GNU Debugger (GBD) is the de facto debugger for development on Linux systems, however, it has now found its way into embedded development (even without Linux running on the target system). GDB provides a standardised interface/API that can be used by an IDE. It also specifies a standardised protocol (GDB remote protocol) that allows GDB to communicate with a GDBServer which knows how to handle the debug probe connected to the target. The J-Link software package comes with the J-Link GDBServer which allows the use of J-Link in GDB-based setups. LLDB support J-Link can be used with LLDB. Originally, GNU toolchains provided GCC as a compiler and GDB as a debugger. Since Clang’s introduction as a compiler, LLDB was introduced (which was essentially a successor to GDB). In terms of protocol, it is backward compatible with GDB although the API for the IDE is slightly different. The J-Link software package comes with the J-Link GDBServer, permitting the use of J-Link in LLDB-based setups. OpenOCD support J-Link can be used with OpenOCD (Open On-Chip Debugger). OpenOCD is an opensource software that can interface with virtually any debug probe. It provides a standardised API, allowing an IDE to support OpenOCD. There are several tutorials on the Internet that describe how to use J-Link with OpenOCD. It is important to note that OpenOCD is third-party software, and as such, Segger cannot provide any guarantees. Using J-Link with OpenOCD bypasses all J-Link-specific features like Flash programming, unlimited Flash breakpoints and J-Link’s high debugging speed. OpenOCD handles J-Link as a simple sequence generator, which will affect debug performance. Using J-Link with OpenOCD is not covered by the standard J-Link support, but by the OpenOCD community. Gain full insight with the J-Link Control Panel Eliminating any guesswork, the J-Link Control Panel provides full transparency about J-Link’s current activities. It is available on all platforms (Windows, Linux and macOS) with no additional utility required for installation. It is available through a standard web browser. To demonstrate its utility, consider the following scenario: an IDE has been chosen and the developer has started working with it. Then, a new and useful feature is introduced to the J-Link software, but the IDE itself hasn’t adopted it yet, or even worse, the IDE cannot be updated due to certification reasons. This is where the J-Link Control Panel provides the opportunity to make use of new J-Link features, without even touching the IDE itself. For more information contact CST Electronics, +27 11 608 0070, [email protected], www.cstelectronics.co.za
Dataweek, 30 May 2022 www.dataweek.co.za 10 REGULAR SYSTEMS, COMPONENTS, DESIGN Three compact solutions for high step-down voltage ratios System designers can be faced with the challenge of down-converting high DC input voltages to very low output voltages at high output current (such as 60 V down to 3,3 V at 3,5 A) while maintaining high efficiency, small form factor and simple design. Combining high input-to-output voltage difference with high current automatically excludes a linear regulator due to the excessive power dissipation. Consequently, the designer must opt for a switching topology under these conditions. However, even with such topologies, it is still challenging to implement a design that is sufficiently compact for space-restricted applications. Challenges faced by DC-to-DC buck converters One candidate for high step-down ratios is the buck converter because it is the topology of choice when having to step down an input voltage to a lower output voltage (such as VIN = 12 V down to VOUT = 3,3 V) in an efficient way, with a significant amount of current while also using a small footprint. However, there are conditions under which the buck converter faces serious challenges to keep its output voltage regulated. To understand these challenges, we must remember that the simplified duty cycle (D) of a buck converter operating in continuous conduction mode (CCM) is: Now, the duty cycle also relates to the switching frequency (fSW) in the following way, where the on-time (tON) is the duration over which the control FET stays on during each switching period (T): Combining Equation 1 and Equation 2 shows how tON is influenced by the step-down voltage ratio and fSW: Equation 3 tells us that the on-time decreases when the input-to-output voltage ratio (VIN/VOUT) and/or fSW increases. This means that the buck converter must be able to operate with very low on-time to regulate the output voltage in CCM under a high VIN/VOUT ratio, and it becomes even more challenging with a high fSW. Let’s consider an application with VIN(MAX) = 60 V, VOUT = 3,3 V at IOUT(MAX) = 3,5 A. By Olivier Guillemant, central applications engineer, Analog Devices. When required, we shall use values from the LT8641 regulator data sheet because a solution with the LT8641 will be provided later in this article. The required minimum on-time (tON(MIN)) corresponds to the highest input voltage (VIN(MAX)). In order to assess this tON(MIN), it is advised to make Equation 3 more accurate. By including VSW(BOT) and VSW(TOP) (the voltage drops for the two power MOSFETs of the buck converter) and replacing VIN with VIN(MAX) we obtain: Using Equation 4 with VIN(MAX), fSW = 1 MHz, we obtain a tON(MIN) of 61 ns. For VSW(BOT) and VSW(TOP), we made use of the values provided for RDS(ON)(BOT) and RDS(ON)(TOP) in the LT8641 data sheet, knowing also that VSW(BOT) = RDS(ON)(BOT) x IOUT(MAX) and VSW(TOP) = RDS(ON)(TOP) x IOUT(MAX). Buck converters can rarely guarantee a tON(MIN) with a short value of 61 ns obtained above; therefore, the system designer is forced to search for alternate topologies. There are three possible solutions for high step-down voltage ratios. Solution 1: Using the LT3748 non-opto flyback The first option consists of using an isolated topology, where the transformer performs most of the down-conversion thanks to its N:1 turn ratio. For this case, Analog Devices offers flyback controllers such as the LT3748 that do not require a third transformer winding or opto-isolator, making the design simpler and Figure 1. A circuit solution with the LT3748 down-converting 60 V input to 3,3 V output. compact. The LT3748 solution for the given conditions is presented in Figure 1. Even though the LT3748 solution simplifies the design and saves space compared with a standard flyback design, a transformer is still required. For applications where isolation between input and output sides is not required, it is preferred to avoid this component, which adds complexity and increases the form factor versus a non-isolated solution. Solution 2: Using the LTM8073 and LTM4624 µModule devices As an alternative, the designer can downconvert in two steps. To achieve a reduced component count of only 10, two µModule devices and 8 external components can be used, as demonstrated in Figure 2. Moreover, the two µModule devices already integrate their respective power inductor, sparing the system engineer a design task that is rarely straightforward. The LTM8073 and LTM4624 both come in BGA packages, with respective dimensions of 9 x 6,25 x 3,32 mm and 6,25 x 6,25 x 5,01 mm (L x W x H), providing a solution with a small form factor. Since the LTM4624 exhibits an efficiency of 89% under these conditions, the LTM8073 supplies at most 1,1 A to the input of the LTM4624. Given that the LTM8073 can provide up to 3 A of output current, it can be used to supply other circuit rails. It is with this purpose in mind that we selected 12 V as the intermediary voltage (VINT) in Figure 2 (see page 12). Despite avoiding the use of a transformer, some designers might be reluctant to implement a solution that requires two separate Continued on page 12
Dataweek, 30 May 2022 www.dataweek.co.za 12 REGULAR SYSTEMS, COMPONENTS, DESIGN buck converters, especially if no intermediary voltage is required to supply other rails. Solution 3: Using the LT8641 buck converter Consequently, in many cases, using a single buck converter would be preferred because it provides the optimal solution to combine system efficiency, a small footprint, and design simplicity. But did we not just demonstrate that buck converters cannot cope with high VIN/VOUT combined with high fSW? This statement might apply to most buck converters, but not to all of them. The analog Devices portfolio includes buck converters such as the LT8641, which is specified with a very short minimum on-time of 35 ns typical (50 ns maximum) over the full operating temperature range. Those specifications are safely below the required minimum on-time of 61 ns previously calculated, providing us with a third possible compact solution. Figure 3 shows how simple the LT8641 circuit can be. It is also worth noting that the LT8641 solution can be the most efficient of the three. Figure 2. A circuit solution with the LTM8073 and LTM4624 down-converting 60 V input to 3,3 V output. Indeed, if efficiency must be further optimised compared with Figure 3, we can decrease fSW and select a bigger inductor size. Although fSW can also be decreased with Solution 2, the integration of the power inductors does not offer the flexibility to increase the efficiency beyond a certain point. Moreover, the use of two consecutive downconversion stages has a small negative impact on the efficiency. In the case of Solution 1, the efficiency will be very high for a flyback design, thanks to its operation in boundary mode and to all components removed with the no-opto feedback design. However, the efficiency cannot be fully optimised because there is a limited number of transformers to select from, as opposed to the broad portfolio of inductors available for Solution 3. An alternative way to check whether the LT8641 fulfils requirements In most applications, the only adjustable parameter in Equation 4 is the switching frequency. Consequently, we reformulate Equation 4 to assess the maximum permitted fSW for the LT8641 under given conditions. By doing this, we obtain Equation 5: Let’s use this equation with the following example: VIN = 48 V, VOUT = 3,3 V, IOUT(MAX) = 1,5 A, fSW = 2 MHz. An input voltage of 48 V is commonly found in automotive and industrial applications. By inserting those conditions in Equation 5, we obtain: Therefore, under the provided application conditions, the LT8641 would operate safely with fSW set as high as 2,12 MHz, confirming that the LT8641 is a good choice for this application. Conclusion Three different methods were presented above to achieve a compact design under high step-down voltage ratios. The LT3748 flyback solution does not require a bulky opto-isolator and is recommended for designs where isolation is necessary between input and output sides. The second method, which involves implementing the LTM8073 and LTM4624 µModule devices, is of particular interest when the designer is hesitant to select the optimal inductor for the application and/or when an additional intermediary rail must be supplied. The third method, a design based on the LT8641 buck converter, offers the simplest and most compact solution when the sole requirement is the steep voltage downconversion. For more information contact Conrad Coetzee, Altron Arrow, +27 11 923 9600, [email protected], www.altronarrow.com Figure 3. A circuit solution with the LT8641 down-converting 60 V input to 3,3 V output. Contiued from page 10
www.dataweek.co.za SYSTEMS, COMPONENTS, DESIGN Part of the Darwin product family from Maxim Integrated Products (which is owned by Analog Devices), the MAX32672 is an ultra low-power, cost-effective, highly integrated and highly reliable 32-bit microcontroller (MCU), enabling designs with complex sensor processing without compromising battery life. It combines a flexible and versatile power management unit with the powerful Arm Cortex-M4 processor featuring a floating-point unit (FPU). The MAX32672 also offers legacy designs and an easy and cost-optimal upgrade path from 8- or 16-bit MCUs. The device integrates 1 MB of Flash and 200 Kb of SRAM to accommodate application and sensor code. Error correction coding (ECC) is implemented on the entire Flash, RAM and cache to ensure highly reliable code execution even in the harshest of environments. Brownout detection ensures proper operation during power-down and power-up events and unexpected supply transients. The Flash is organised into two equal-sized physical banks to allow execute-while-write and to facilitate ‘live upgrades’. Multiple high-speed peripherals, such as 3,4 MHz I2C, 50 MHz SPI and UART, are included to maximise communication bandwidth. In addition, a low-power UART (LPUART) is Complex, reliable sensor processing in one cost-effective MCU available for operation in the lowest power sleep modes to facilitate wake-up activity without any loss of data. A total of six timers with I/O capability are provided, including two low-power timers to enable pulse counting, capture/compare and pulse-width modulation (PWM) generation, even in the lowest-power sleep modes. An incremental/quadrature encoder interface with multiple diagnostics is included specifically for motor control applications. A 1MSps, 12-channel, 12-bit successive approximation register (SAR) ADC is integrated for the digitisation of analog sensor signals or other analog measurements. Two low-power comparators, available in all low-power modes, allow energy-efficient monitoring and wake-up on external analog signals. An elliptic curve digital signature algorithm (ECDSA)-based cryptographic secure bootloader is available in ROM. The device is available in a 5 x 5 mm, 40-pin TQFN-EP or 7 x 7 mm, 56-pin TQFN package. For more information contact Conrad Coetzee, Altron Arrow, +27 11 923 9600, [email protected], www.altronarrow.com The result is a significantly miniaturised sensor that offers space savings of more than 75% in end-products compared to competing products. Available from Mouser Electronics, the device integrates a photoacoustic transducer – including detector, infrared source and optical filter – plus a microcontroller for signal processing and algorithms, and a MOSFET to drive the infrared source. The integrated microcontroller converts the MEMS microphone output into a ppm reading, which is available either via the serial I2C, UART or PWM interface. The sensor measures a range from 0 ppm to 10 000 ppm with an accuracy of ±30 ppm or ±3% of the reading. The sensor’s direct ppm readings, surfacemounting capability and simple design allow for fast integration into low- and high-volume applications such as smart home and building Tiny CO2 sensor employs photoacoustic spectroscopy automation designs, demand-controlled ventilation, air purifiers, thermostats, weather stations and personal assistants. For more information contact TRX Electronics, +27 12 997 0504, [email protected], www.trxe.com Based on the science of photoacoustic spectroscopy (PAS), Infineon Technologies’ XENSIV PAS carbon dioxide (CO2) sensor uses a high-sensitivity MEMS microphone to detect the pressure change generated by CO2 molecules within the sensor cavity.
Dataweek, 30 May 2022 www.dataweek.co.za 14 REGULAR SYSTEMS, COMPONENTS, DESIGN To ensure quality and product safety, manufacturers specify the temperatures at which items must be transported and stored. Cold chain management and Good Distribution Practices (GDP) ensure that the correct conditions are met during every phase of the lifecycle of packaged and perishable goods. It also ensures that, should a possible deviation from the normal temperature occur, an appropriate action be taken by the operator either during transportation or during storage to make sure that minimal wastage occurs. Cold chain topologies The use of temperature sensors utilising gauges and simple analog sensors has largely been the norm. However, with advances in semiconductor technology and the fact that most cold chain management is done in the temperature range of -40° to 10°C, integrated temperature sensors are the best option for management in this range. Based on the application, there are different topologies that may be deployed. In a point-to-point topology (Figure 1), a single microcontroller unit (MCU) is connected to a temperature sensor that may have either an analog or a digital output. Texas Instruments’ TMP116 temperature sensor operates from -55°C to 125°C, and has a 0,2°C accuracy in the range -10°C to 85°C. The sensor integrates I2C and SMBusinterface communication, as well as an integrated EEPROM. Calibration is not required, and the device consumes minimal current, which minimises self-heating. With its maximum 16-bit conversion, the TMP116 is typically used in applications with a focus on high accuracy. Efficient cold chain management with highaccuracy temperature sensors This point-to-point topology is useful when monitoring a temperature-controlled container during transport, but when the application requires multiple sensors like in reefer containers, the cost of a single MCU is too high to be implemented multiple times throughout the system. In this case, the most common topologies are either a star, a daisy chain or a shared bus, where one MCU is the host controller for multiple sensors. A star topology allows for easy fault isolation and may use both analog and digital temperature sensors. This topology, however, has a higher cost of implementation as the controller peripheral count is higher. With a shared bus, the scalability can easily be addressed with a digital temperature sensor that Before reaching a consumer, perishable products like food and medicines spend a significant time in transportation, and then on shelves of large refrigeration units. It is important that these products reach the end-consumer in a fresh and viable condition, so that their nutrients and efficacy are maintained. Figure 1. Point-to-point topology. shares the line and may be individually addressed like in the case of I2C communication, or out-ofband signalling using chip select as is the case with SPI communications. This topology does, however, raise the concern for reliable power delivery and signal integrity over a long chain. The daisy chain topology (Figure 2) does not require out-of-band signalling but rather uses an in-band addressing scheme. Each stage of the chain acts as a buffer for the next stage, which maintains signal integrity over longer distances. Irrespective of which stage is being monitored, electronic systems provide a unique advantage of not only logging the temperature of the refrigeration unit, but also providing thresholds above which an alert is
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