FEATURING: • Electronics Manufacturing, Services & Equipment • Enclosures, Cabinets, Cabling & Panel Products • Industrial Electronics, Automation, Computing & Networking 28 March 2024 Leaders in Supply, Upgrades, Training, Repairs & Support to the electronics manufacturing and soldering sector. INSPIRE CHANGE
Dataweek, 28 March 2024 www.dataweek.co.za 1 TELECOMMUNICATIONS, WIRELESS, IoT, RF & MICROWAVE FEATURE 28 March 2024 Vol. 47 No. 2 News................................................................................. 3 Systems, Components, Design.........................8 General ............................................................................29 Hot chips......................................................................31 Open [re]sources .......................................................32 QuickFind index ....................................................IBC contents on the cover features regulars Electronics Manufacturing, Services & Equipment ....................................................15 SMT optical inspection, dispensing units and assembly. Enclosures, Cabinets, Cabling & Panel Products...................................................................22 High-density cable assemblies and distribution, and stainless steel enclosures. Industrial Electronics, Automation, Computing & Networking...............................................24 Flash memory for AI applications, industrial switches and cellular solutions, and various modules for edge computing. FEATURING: • Electronics Manufacturing, Services & Equipment • Enclosures, Cabinets, Cabling & Panel Products • Industrial Electronics, Automation, Computing & Networking 28 March 2024 Leaders in Supply, Upgrades, Training, Repairs & Support to the electronics manufacturing and soldering sector. INSPIRE CHANGE Priben, a female-owned BBBEE Level 1 organisation, provides top-tier soldering solutions and products to high-end electronics manufacturers across sub-Saharan Africa. Committed to delivering unparalleled quality, they maintain a global presence as a supplier of renowned soldering solutions, aiding in the development and accessibility of the electronics market. For more information contact Priben, +27 11 473 2149, [email protected], www.priben.co.za
Dataweek, 28 March 2024 www.dataweek.co.za 2 NEWS Disclaimer While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements, inserts and company contact details are printed as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material. Published by: Technews Publishing (Pty) Ltd Wild Fig Business Park, Block B, Unit 21, 1494 Cranberry Street, Honeydew Tel: +27 11 543 5800 [email protected] Gauteng Tracy Wolter, Tel: +27 11 543 5800, [email protected] KwaZulu-Natal Jane van der Spuy, Tel: +27 83 234 5412, [email protected] Western Cape Contact Durban or Jhb numbers for details Advertising: Print and Online Sales Manager: Malckey Tehini [email protected] Editor: Peter Howells, B.Tech (Electronic Engineering), [email protected] Subscription services For address changes, subscriptions, renewal status or missing issues call +27 11 543 5800 or [email protected] or WRITE TO: Technews Publishing (Pty) Ltd, Box 385, Pinegowrie 2123 Subscribe online: www.technews.co.za All rights reserved. No part of this publication may be reproduced, adapted, stored in a retrieval system or transmitted in any form or by any means, electronic, mechanical, photocopying, recording or otherwise, without the prior written permission of Technews Publishing (PTY) Ltd. Reg No. 2005/034598/07 ISSN 0256-8934 VOLUME 47 NO 2 28 MARCH 2024 From the editor’s desk Peter Up until a few weeks ago, our classification kingdoms were split into two parts; fauna and flora. I was amazed when I recently read that National Geographic has now changed this and has split the classification into three: fauna, flora, and funga. The term funga is dedicated to the kingdom fungi. Yes, mushrooms now have their own classification, and are regarded as neither plants nor animals. These fungal overlords have been silently shaping whole ecosystems, infiltrating our air and water supply, and sometimes even our own bodies. Fungi do not produce their own food through photosynthesis like plants. They do, however, live inside or on their food. Their cell walls are made from a cellular material called chitin which is a fibrous substance, and is the same material that an insect’s exoskeleton is made from. However, fungi don’t reproduce like animals. They use spores which are similar to seeds, and could be dispersed across large areas. What makes fungi really unique and separate from plants and animals can be found underground. Fungi are connected through a vast underground network of interconnected threads that form a mycelium. The largest known mycelial network covers approximately 9 square kilometres, making it the largest individual living organism on Earth. At this stage, you are probably thinking, “Have I received a copy of National Geographic by mistake?” No you haven’t, and let me explain. This story ties in perfectly to our electronic engineering world as these vast mycelial networks can be likened to another type of network that is manmade. The Internet of Things (IoT) is a worldwide network made up of nodes. These nodes, which range in size from large machines to IoT sensors as small as your fingernail, are interconnected wirelessly for control and data transmission. The number of devices or nodes that exist on this IoT network is estimated to be around 17 billion currently, with about two billion nodes being added each year over the last three years. This figure is staggering and amounts to more than two nodes for every living person on Earth. IoT nodes are typically made up of four components: sensors or actuators, connectivity, data processing, and user interface. And it is in the data processing that IoT has made an exciting turn. Traditionally, IoT nodes have communicated data to a server for powerful and intelligent processing, thereby providing the ‘fuel’ for artificial intelligence. This is now changing, with more power processing capabilities being included at the Funga: The unseen rulers of a new kingdom edge. Edge-AI enables data processing using artificial intelligence algorithms at the sensor. Communication of results, rather than data, is then performed once the processing is complete. This allows results to be produced faster using less power overall – a win-win situation for all. Manufacturers are rushing to release new products for this market, and all the big names are included: Silicon Labs have their EFR32BG24 series, NXP have their i.MX 95 family, and Analog Devices have their MAX78002 MCUs, to name just a few. All these microcontrollers have AI/ML hardware acceleration to enable intelligent processing at the edge. With all this technology, one would think that our lives would become simpler, less frantic. But it seems that most people have lost the idea of what it is to actually live – to slow down and take time to smell the roses. Isn’t it amazing how everything humans design seems to already exist in some form in the animal, plant, or now fungal kingdom. I, for one, am looking forward to the day when I can sit back and relax while machines do the heavy lifting for me. Who knows what we may then discover when we take the time to open our minds to the endless possibilities surrounding us in nature.
Dataweek, 28 March 2024 www.dataweek.co.za 3 NEWS ELECTRONICS NEWS DIGEST EVENTS Continued on page 4 Financial • The fourth quarter revenue for the top 10 foundries were up 7,9% at a value of $30,49 billion. The annual total revenue reached $111,54 billion. This growth was largely driven by the demand for smartphone components and peripheral PMICs. TSMC’s premium 3 nm process pushed its global market share past the 60% threshold in Q4 2023. • It is reported that the global sales of EVs reached 13,03 million in 2023, a growth rate of 29,8%. This represents a significant slowdown in growth compared to 2022, which saw a growth rate of 54,2%. China remains the largest market for EVs, accounting for 60% of the global market share. Tesla continues to lead the rankings with a 19,9% market share, with Chinese company BYD a close second. • The revenue generated by NAND Flash grew 24,5% in Q4 2023, hitting $11,49 billion. This surge is attributed to a stabilisation in end-demand and an expansion in component market orders driven by price chasing. The corporate sector’s continued positive outlook and strategic stockpiling have further fuelled this growth, which is forecast to increase another 20% in the first quarter of 2024. • The market for smartphone camera optical technology is expected to have a resurgence with the help of AI-driven smartphone trends. Samsung’s AI-packed flagship phone, the S24 series, has advanced generative AI applications driving it. The embedded ProVisual Engine algorithm on which it runs promises extraordinary quality by enhancing clarity, significantly stabilising images, and removing noise and shake. • For the second consecutive year, a drop in salaries for software developers was seen. This downward trend in 2022 and 2023 came after the industry saw its peak in 2021, largely being driven by the panic caused during the COVID-19 pandemic. Data showed that senior developers and developers, with four to six years of experience, were the only categories not to experience this decline. • Global server shipments are forecast to increase by 2,05% in 2024, with AI servers accounting for 12% of them. This amounts to a total number of server shipments expected to reach 13,6 million units this year. Foxconn is expected to see the highest growth rate, with an annual increase between 5 and 7%. This is due to significant orders from the likes of Dell (16G platform), AWS (Graviton 3 and 4), Google (Genoa), and Microsoft (Gen9). • The enterprise SSD industry reached a total of $23,1 billion in revenue in Q4 2023, and this growth trend is continuing into Q1 of 2024. The third quarter last year saw suppliers dramatically cutting production, which underpinned enterprise SSD prices. The fourth quarter then saw a resurgence in contract prices, driven by a surge in buying activity and increased demand from server companies. A 20% revenue growth in this sector is expected in Q1 2024. • DRAM also saw a large growth in Q4 2023, due to rising prices and memory volume. The industry has reported a 29,6% QoQ revenue increase reaching a total of $17,46 billion. A forecasted 20% increase in DRAM prices are expected in the first quarter of 2024. Companies • The grand opening of TSMC’s Kumamoto Plant took place on 24 February. Currently, TSMC holds a dominant 60% of global foundry revenues, and this is set to increase with the new addition. This is the company’s first factory in Japan as it sets out to explore spreading its production to other countries worldwide. TSMC is expecting the new plant to produce up to 50 000 wafers per month, focusing mainly on 22/28 nm processes but with a small amount of 12/16 nm processes thrown into the mix. • Avnet ASIC has been appointed as a Value Chain Aggregator by TSMC. The appointment positions Avnet ASIC as a channel for TSMC ASIC customers, offering a full turnkey solution from design inception to layout and mass production. The collaboration signifies a landmark agreement within Avnet, enhancing the offerings by combining the strong technology of TSMC with the ASIC design and manufacturing capabilities of Avnet ASIC. • TDK Corporation was recently named a 2024 Clarivate Top 100 Global Innovator for its leadership in digital and energy transformation. Since 2012, the Top 100 Global Innovators programme has identified companies at the pinnacle of the global innovation landscape by measuring the ideation culture that produces patents and drives growth. • The company has also been awarded an A ranking in the CDP Supplier Engagement Rating for the fourth consecutive year. CDP works on environmental issues such as climate change, and provides a ranking for over 450 companies worldwide. • Andrew Mthembu has been named as executive chairman of EOH Holdings. This appointment is on an interim basis, starting on 1 April, until a replacement can be found for outgoing chief executive Stephen van Coller. Mthembu will be in the role for up to six months, after which he will return to a non-executive role in the company. • Oxford PV has set a new solar panel efficiency world record. Their next-generation tandem Electronic News Digest IPC APEX EXPO 2024 6-11 April 2024 Anaheim Convention Center, California Discover the newest innovations in the electronics manufacturing industry with the APEX Expo themed ‘What’s Next Becomes Now’. The exposition will feature a worldclass trade show, cutting-edge technical conferences, professional development courses taught by industry experts, and networking with business leaders in the electronics industry. The Electronic Circuits World Convention 16 (ECWC16), held every three years in different venues worldwide, will be hosted simultaneously. Register at www.ipcapexexpo.org SEMICON Southeast Asia 28-30 May 2024 Kuala Lumpur, Malaysia The pursuit of greater agility and resiliency takes centre stage at this year’s SEMICON Southeast Asia, challenging industry players to develop and implement solutions swiftly to anticipate, rather than being reactive to future disruptions. SEMICON Southeast Asia 2024 serves as the ideal platform where industry leaders, experts, and innovators from around the region can come together to share insights, discuss strategies, and unveil cutting-edge solutions to navigate the ever-evolving landscape of the semiconductor industry. Register at https://www.semiconsea.org SEMI 3D & Systems Summit 2024 12-14 June Dresden, Germany The 3D & systems summit exhibition features the most prominent names in the semiconductor industry. Join industry leaders, researchers and innovators to explore the next wave of technology advances and the future of connected technologies enabled by heterogeneous systems. The full programme will cover various topics including chiplet system architectures, hybrid bonding technologies, manufacturing innovation for 3D integration, and innovations for high-bandwidth computing. Register at https://bitly.ws/EpKH
Dataweek, 28 March 2024 www.dataweek.co.za 4 NEWS ELECTRONICS NEWS DIGEST Continued from page 3 solar panel achieves 25% efficiency. Produced in collaboration with the Fraunhofer Institute for Solar Energy Systems, the panel achieved this significant increase on the more typical 24% efficiency of commercial modules. Oxford PV, a spin-out of the University of Oxford, is a developer of perovskite-on-silicon tandem solar cells, which have a theoretical maximum efficiency of over 43%, compared to less than 30% for silicon solar cells. • NeoCortec, manufacturer of ultra-low-power bi-directional wireless mesh network modules, has recently extended its network of distributors by signing a new global distribution agreement with DigiKey, a worldwide distributor of high-service electronic components and automation products. The modules suit a broad range of applications based on IoT and Cloud-based sensor networks, including smart buildings, metering, security, and agriculture. • DesignCon 2024 recently announced its Best Paper Awards winners with six Samtec authors named alongside colleagues from other organisations. DesignCon Best Paper Awards serve to acknowledge authors as leading practitioners in semiconductor and electronic design. • Cell C has appointed El Kope as chief financial officer and executive director for finance. Kope, a chartered accountant, joined Cell C in September 2022 as the executive head for financial planning and analysis. She stepped into the Acting CFO role in August 2023 after the departure of the previous CFO. • Panasonic has extended its collaboration with Hera Group to expand its NexMeter technology. The NexMeter, launched in 2019 as a smart gas meter, has evolved to incorporate advanced safety features. It is compatible with green gas mixtures like hydrogen and biomethane. • Analog Devices has been awarded the US FDA 510 clearance for its Sensinel CPM system. The Sensinel CPM is the next-generation solution for management of cardiopulmonary diseases like heart failure. Patients self-apply the wearable device for three to five seconds in which time the device records and uploads the data to ADI’s Sensinel CPM intelligent cloud for further analysis using proprietary algorithms. Technologies • The National Institute of Standards and Technology (NIST) have delivered a small, but significant, advancement in timing technology. Compact chips have been developed that seamlessly convert light into microwaves which reduces timing jitter. This jitter, which is the small, random changes in a timing signal, has been reduced to a mere 15 femtoseconds. According to NIST, this technology could improve GPS, the quality of phone and internet connections, the accuracy of radar and sensing systems, and other technologies that rely on high-precision timing. • Researchers from Japan and Germany have developed a method to produce large crystals (> 50 mm) using a laser-based process, and without a crucible. These high-purity semiconductor crystals are required for power electronics in applications like electric cars and photovoltaics. To perform this, a team at the Fraunhofer Institute for Laser Technology ILT in Aachen has developed a process-adapted optical system for use with a 20 kW laser. The laser is initially split into five partial beams with a maximum of 4 kW each. The partial beams are then deflected via large, water-cooled mirrors to heat the crystal in the centre of the setup evenly, offset by exactly 72° • Electric vehicles could significantly increase the likelihood of pothole formation due to their relative mass in comparison to their internal combustion engine siblings. In a research paper published by the University of Leeds, it was found that EVs cause 2,24 times more stress on roads than their petrol counterparts, and 1,95 times more than comparative diesel-powered vehicles. The biggest contributor to an EV’s mass is the battery pack which, on average, comes in at around 454 kg.
Dataweek, 28 March 2024 www.dataweek.co.za 5 NEWS Hiconnex is proud to announce a new partnership with Petercem Switches, a member of the Mafelec Team, and will operate as the company’s sole agency in South Africa. With over 60 years of experience in the civil, military aeronautics, and space industries, Petercem offers robust solutions for position detection and human machine interfaces. The company’s technical expertise makes it the ideal partner for microswitches intended to Hiconnex announces new partnership The Semiconductor Industry Alliance (SIA) has announced global semiconductor sales totalled $47,6 billion during the month of January, an increase of 15,2% compared to January 2023. This was a slight downturn of -2,1%, however, from the December 2023 total. “The global semiconductor market started the new year strong, with worldwide sales increasing year-to-year by the largest percentage since May 2022,” said John Neuffer, SIA president and CEO. “Market growth is projected to continue over the remainder of the year, with annual sales forecast to increase by double-digits in 2024, compared to 2023.” Regionally, year-to-year sales were up in China (26,6%), the Americas (20,3%), and Asia Pacific/All other (12,8%), but down in Japan (-6,4%) and Europe (-1,4%). Month-to-month sales were down across all markets: Asia Pacific/All Other (-1,4%), the Americas (-1,5%), China (-2,5%), Europe (-2,8%), and Japan (-3,9%). For more information visit www.semiconductors.org Global semiconductor sales increase YoY operate in severe environments such as landing gear, jet engine nacelles, or space vacuum. Petercem Switches is certified according to EN 9100:2018, and develops solutions according to DO 160, MIL-Standards and SAE-AS-7788. For more information contact Hiconnex, +27 12 661 6779, [email protected], www.hiconnex.co.za Indium Corporation was founded in Utica, NY, U.S. in 1934 by Dr. William S. Murray, who was instrumental in identifying and enabling the first commercially-viable applications for indium metal. Today, the company is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, with facilities in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S. The company’s products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. “This milestone is a testament to the hard work and dedication of our employees, the trust of our customers, and the support of our global partners,” said President and COO Ross Berntson. “True to Dr. Murray’s enduring legacy, we continue to be motivated by curiosity to view materials in new ways,” Berntson added. Indium celebrates 90 years of innovation “Fuelled by a commitment to research and development, and our industry thought leaders and cutting-edge products, Indium Corporation continues to innovate and grow.” Indium Corporation commemorated its 90th anniversary on 13 March 2024. The company’s innovative products, especially its advanced soldering solutions, are found in many common consumer electronics and high-reliability technologies such as electric vehicles, mobile devices, lifesaving medical devices, and emerging 5G technology, to name just a few. For more information on Indium products contact Techmet, +27 11 824 1427, [email protected], www.techmet.co.za
Dataweek, 28 March 2024 www.dataweek.co.za 6 NEWS The grid capacity allocation from Eskom enables Teraco to connect its planned 120 MW solar facility to the national electrical grid. The power generated will be wheeled across Eskom and municipal power networks to Teraco’s facilities across South Africa. “This allocation is a significant step towards meeting our renewable energy ambitions and those of our clients. It is also only the first phase of our longer-term renewable energy commitment. We have been on a long journey over the last few years to obtain these approvals, and our aim now is to execute quickly on the opportunity,” says Jan Hnizdo, CEO at Teraco. “In South Africa, we have various energy challenges, and this presents an incredible opportunity to meet our near-term renewable energy goals, while adding additional power capacity to a generation constrained grid. This will be a unique approach in Africa since Teraco will not only own its data centre facilities, but also a significant renewable energy source with which to power them, creating a sustainable energy path to support growth. This initiative aligns with Teraco’s long-term vision of powering the digital transformation across Africa. South Africa’s solar resource is a source of competitive advantage for data centres relative to other locations,” he adds. When fully operational, the 120 MW solar PV plant is expected to produce more than 338 000 MWh annually. “This PV project represents a massive component of our plan to achieve our 100% clean energy goal,” says Bryce Allan, head of sustainability at Teraco. “In addition to this project, over the past two years, Teraco has deployed approximately 6 MW Utility-scale solar development for local company As part of the collaboration, Arrow’s High Power Centre of Excellence has developed a 30 kW DC fast charger reference platform. This includes Infineon’s 1200 V CoolSiC Easy power modules and also hardware design, embedded firmware, bi-directional charging support, and energy metering functionality. Collab between Arrow and Infineon That sounds wonderful but there is a catch. The cheapest plan begins at $6.99 (R134.00 at the current exchange rate) per month which limits the user to a mere 20 pages on an HP Envy printer. Increasing the number of pages increases the monthly subscription: $8.99 for 50 pages and $10.99 for 100 pages. If you want a more capable printer, then the subscription again increases. If a user does reach the monthly limit and continues to print, they will be charged extra based on the number of pages printed. The subscription model is also similar to that of a mobile phone. Once subscribed, the user is locked in for two years, with a hefty Printing as a subscription “Combining Arrow’s strength in components, engineering and design services, with Infineon’s innovative products will help customers accelerate their design and speed to market in e-mobility applications,” said Murdoch Fitzgerald, vice president, global engineering and design services at Arrow. “Customers can rely on this collaboration to deliver innovative and leading-edge DC fast chargers, accelerate and derisk design cycles, and get access to a world-class support team, enabling them to plan and manage their product roadmap and lifecycles.” For more information contact Altron Arrow, +27 11 923 9600, [email protected], www.altronarrow.com of rooftop solar integrated into its facilities, and this amount is to be increased to 10 MW as new facilities become operational.” Teraco has partnered with JUWI Renewable Energies South Africa and Subsolar to develop the 120 MW solar PV plant, with JUWI appointed to design and manage the procurement, construction, and commissioning. In a first for Teraco, a green loan has been raised to finance the building of the plant. Choosing the right partners has been crucial to delivering on Teraco’s renewable energy strategy and vision. Wheeling renewable energy across electrical grids enables power to be moved from a renewable energy producer in outlying areas via existing transmission and distribution systems to end users located in urban areas. It also enables the deployment of renewable energy projects to areas with high energy yield to maximise renewable energy generation potential. For more information visit www.teraco.co.za Teraco has announced that it has secured its first grid capacity allocation from Eskom and will commence construction of a 120 MW utility-scale solar PV energy facility in the Free State province. Arrow Electronics, represented by Altron Arrow in South Africa, and its engineering services company, eInfochips, are working with Infineon Technologies to help eInfochip’s customers accelerate the development of EV chargers. HP has done the unthinkable and released its All-In Plan, a subscription-based printing solution that has many IT professionals and business users shaking their heads. The plan provides a printer – customers have a choice of three models – and a limited number of pages per month. These pages can be all in colour and the ink is free. cancellation fee should they feel that they no longer require the service. Cancelling within 12 months generates a cancellation fee of $270 (R5151) and cancelling between 12 and 24 months comes with a cancellation fee of $135. It remains to be seen whether businesses and the general public will embrace this new service with open arms or not. However, for anyone who has ever spent hours fighting with a non-functioning printer, this could seem like a godsend. For more information visit www.hp.com/us-en/all-in-plan/faq.html
Dataweek, 28 March 2024 www.dataweek.co.za 8 REGULAR SYSTEMS, COMPONENTS, DESIGN This design solution reviews a typical asset tracking solution, and shows how the MAX3864x nanopower buck converter family, with its high efficiency and small size, enables longer battery life in small portables. New, low-power data connections are sparking a proliferation of asset tracking solutions thanks to their low cost of deployment. The effects can be seen in multiple applications, particularly transportation and supply chain management. In a typical application, a sensor provides updates from a given location, transmitting data about temperature, humidity, pressure, and motion. The sensor needs to transmit only small amounts of data, which results in higher coverage and ultra-low power consumption, enabling far greater device longevity. The sensor’s battery must last from several weeks to a few years. Asset tracking, depending on the application, may require the deployment of several tracker devices. Accordingly, these asset tracker devices must also be small, portable, and cost-effective. In this design solution, we discuss the power management challenges encountered by a typical battery-operated asset tracker device, and show an example using a small, high-efficiency buck converter. Edge-to-Enterprise communication Figure 1 illustrates a typical tracking communication chain. The asset being tracked transmits the data via a beacon, which reaches a server through a dedicated cellular network. From here, the data reach the enterprise portal for asset management and analytics. Make your small asset tracker last longer By Anil Telikepalli, Nazzareno Rossetti, Simo Radovic, Analog Devices, www.analog.com NB-IoT LTE-M Units Bandwidth 180 1400 kHz Peak data rate 100 384 kbps U/D link speed 62,5 1000 Mbps Latency 10 100 ms Battery life >10 10 years Voice No Yes Table 1. Network characteristics POUT PIN + AIN 180 200 +10,8 η = = = 86% Asset tracking networks A new generation of beacons connects directly to dedicated cellular networks (LTE-M, NB-IoT), eliminating the use of Bluetooth to communicate with a gateway. These technologies can be very different, but are all characterised by low power consumption, enabling several years of battery life (table 1). Typical asset tracker system Figure 2 shows a typical asset tracker block diagram. The three-series alkaline battery supplies a charge of 2000 mAh. A step-down regulator powers the onboard controller, sensors, and radio. For demanding asset tracking applications, the system must last for a year on three alkaline batteries, drawing only 100 µA in deep sleep, and transmitting 100 mA once per day for about two minutes (figure 3). While it is true that, depending on power level and other options supported in the LTE-M or NB-IoT asset trackers, currents can be higher, for our discussion, we will stick to the 100 µA to 100 mA range. High-use performance requires careful selection of each block for minimum power consumption. The buck regulator must be efficient over a wide range from 100 µA to 100 mA. For instance, a 4% average loss of efficiency by the buck converter translates into a field deployment reduction of about two weeks. Ultra-low quiescent current The buck converter’s quiescent current is especially important since the device is in deep sleep or quiet mode most of the time, consuming only 100 µA or less. With VOUT = 1,8 V, the output power during deep sleep is POUT = 1,8 V x 100 µA = 180 µW. With η = 90%, the input power PIN is 180 µW/0,9 = 200 µW. If the buck converter is not carefully chosen, and has a typical quiescent current of 3 µA and a 3,6 V input voltage, there is an additional power dissipation AIN of 3 µA x 3,6 V = 10,8 µW. The final buck converter efficiency is: A quiescent current of 3 µA robs the buck converter of four efficiency points, draining the battery significantly faster. On the other hand, a buck converter with 300 nA quiescent current will barely reduce the efficiency, lowering it by only half a percentage point. For asset tracking applications, it is critical to select a buck converter with ultra-low quiescent current, as the system spends the majority of the time in quiet mode and relies on a battery. Figure 1. Real-time GPS tracking. Figure 2. An asset tracker block diagram. Figure 3. Asset tracker current profile. FEATURE ARTICLE
Dataweek, 28 March 2024 www.dataweek.co.za 9 REGULAR SYSTEMS, COMPONENTS, DESIGN Clearing the Static For more information contact Actum on +27 11 608 3001 or email [email protected]. Actum is a specialised importer and distributor of industrial and electronic products in southern Africa. with Greg Barron, Actum Group director Nanopower buck converter As an example of high efficiency, the nanopower ultra-low 330 nA quiescent current buck (step-down) DC-DC converter shown in figure 4 operates from a 1,8 to 5,5 V input voltage and supports load currents of up to 175 mA, with peak efficiencies of 96%. While in sleep mode, it consumes only 5 nA of shutdown current. The device is housed in a space-saving 1,42 x 0,89 mm, six-ball wafer-level package. If higher currents are desired based on the power level in the NB-IoT or LTE-M networks, sister parts can deliver higher currents. The human body is the primary source of electrostatic charge generation. To control and reduce static charge build-up and prevent electrostatic discharges (ESD) at an electronic equipment facility, grounding systems are used to ensure that all components are at the same electrical potential. Anti-static wrist bands are crucial components within an electrostatic discharge (ESD) protected area. ESD wrist straps help to disperse static electricity generated from a person safely to ground. In an environment where ESD poses a significant threat to electronic components, these wrist bands serve as a reliable grounding mechanism for personnel. By securely connecting the wearer to a designated grounding point, these bands ensure that any accumulated electrostatic charge is dissipated harmlessly, preventing the discharge from reaching and potentially damaging sensitive electronic devices. As human movement and friction generate static electricity, the consistent use of anti-static wrist bands establishes a continuous path for the safe dissipation of electrostatic charges, contributing to the overall integrity and reliability of electronic components in the ESD protected area. Types of ESD wrist straps Operators can opt for single-wire, dual-wire or disposable wrist straps, based on the application and requirement. Quality straps are manufactured from anti-allergenic materials and designed with safety in mind. Specific types include: • ESD stretch fabric wrist bands. • Stainless steel wrist bands. To ensure a wrist strap is functioning optimally, daily testing should be conducted, and the results logged. As standard, wrist straps need to maintain less than 100 V on the human body. The importance of ESD wrist straps Figure 4. An integrated buck converter. Figure 5. MAX38640 efficiency curve. Efficiency advantage Figure 5 shows the efficiency curve of the buck converter with a 3,6 V input and a 1,8 V output. Synchronous rectification at high load, and pulsed operation at light load and ultralight load, assure high efficiency across a wide operating range. An 87,5% high efficiency operation at 100 µA, and 92% efficiency at 100 mA, make the IC ideal for asset tracking applications. This buck converter has the advantage of several efficiency points compared to alternative solutions. The benefits of high efficiency and smaller footprint go hand in hand, resulting in less heat generation. This helps in designing a smaller, cooler asset tracker, easing concerns of device overheating. Conclusion Asset trackers, depending on their specific application, must operate in the field for several weeks to a few years, powered only by small batteries. This type of operation requires careful selection of each block for minimum power consumption. The buck regulator must operate efficiently over a wide input current range, from tens of microamps to hundreds of milliamps. The MAX3864x nanopower buck converter family, with its high efficiency and small size, provides an ideal power solution for asset tracking applications. For more information contact Altron Arrow, +27 11 923 9600, [email protected], www.altronarrow.com
Dataweek, 28 March 2024 www.dataweek.co.za 10 REGULAR SYSTEMS, COMPONENTS, DESIGN The electrification of everything is driving the widespread adoption of Silicon Carbide (SiC) technology in medium-to-high-voltage applications like transportation, electric grids and heavy-duty vehicles. To help developers implement SiC solutions and fast-track the development process, Microchip Technology has introduced the 3,3 kV XIFM plug-and-play mSiC gate driver with patented Augmented Switching technology. It is designed to work out-of-the-box with preconfigured module settings to significantly reduce design and evaluation time. To speed time to market, the complex development work of designing, testing and qualifying a gate driver circuit design is already completed with this plug-and-play solution. The XIFM digital gate driver is a compact solution that features digital control, an integrated power supply and a robust fibre optic interface that improves noise immunity. It incorporates 10,2 kV primary-to-secondary reinforced isolation with built-in monitoring and Microchip expands its mSiC solutions Microchip Technology has launched the PolarFire SoC Discovery Kit. By offering a user-friendly, feature-rich development kit for embedded processing and compute acceleration, Microchip is making emerging technology more accessible to engineers at all levels. PolarFire SoC Discovery Kit Kyocera AVX RF antennas meet today’s connectivity demands in the LTE, Wi-Fi, Bluetooth, GNSS, and ISM wireless bands. AVX offers the Ethertronics range, that is available in surface mount, patch, off-board, and external configurations. These antennas meet and exceed industry standards of performance, while reducing board space requirements. AVX RF Antennas are ideal for IoT, tracking, and GPS applications, and are available in three categories: • Cellular and LTE antennas with patented isolated magnetic dipole technology reduces the keep-out area requirement around antennas. • GNSS antennas, which include EtherHelix to meet GNSS enabled device requirements. • WLAN/BT/Zigbee tunable embedded antennas, that offer high functionality and performance for smaller and thinner designs. For more information contact Electrocomp, +27 11 458 9000, [email protected], www.electrocomp.co.za Antennas to meet all connectivity requirements protection functions including temperature and DC link monitoring, undervoltage lockout, overvoltage lockout, and short-circuit/overcurrent protection. This gate driver also complies with EN 50155, a key specification for railway applications. “As the silicon carbide market continues to grow and push the boundaries of higher voltage, Microchip makes it easier for power system developers to adopt wide-bandgap technology with turnkey solutions like our 3,3 kV plug-and-play mSiC gate driver,” said Clayton Pillion, vice president of Microchip’s silicon carbide business unit. “By having the gate drive circuitry preconfigured, this solution can reduce design cycle time by up to 50%, compared to a traditional analogue solution.” For more information contact EBV Electrolink, +27 21 402 1940, [email protected], www.ebv.com The open-source development kit features a quad-core, RISC-V application-class processor that supports Linux and real-time applications, a rich set of peripherals and 95K of low-power, high-performance FPGA logic elements. This full-featured kit allows rapid testing of application concepts, developing firmware applications, programming, and debugging user code. “We are dedicated to helping support the growth of embedded systems that require low-power, high-performance FPGA fabrics. The PolarFire SoC Discovery Kit is a pivotal step in our journey towards creating more accessible, smart, secure and high-performing computing solutions for a wide range of applications,” said Shakeel Peera, vice president of marketing for Microchip’s FPGA business unit. “With the new Discovery Kit, experienced and new design engineers, and university students, will have access to a low-cost RISC-V and FPGA development platform for learning and rapid innovation.” In addition to traditional sales channels, PolarFire SoC Discovery Kits are being made available through a pilot project as part of the Microchip Academic Program in the second half of 2024. By offering the Discovery Kit at a reduced price to universities, Microchip is ensuring that the future generation of engineers have direct access to state-of-the-art technology. This approach not only enhances the practical learning experience for students, but also aligns academic studies with the latest industry trends. Microchip’s academic programme offers resources for educators, researchers, and students worldwide and helps universities incorporate advanced technology into their curriculum. For more information contact ASIC Design Services, +27 11 315 8316, [email protected], www.asic.co.za
Dataweek, 28 March 2024 www.dataweek.co.za 12 REGULAR SYSTEMS, COMPONENTS, DESIGN Introducing SIMCom’s new A7673X series Module manufacturers have, therefore, made their 2G modules end-of-life, and are now moving their low-cost 4G modules to Cat 1 bis only and doing away with the 2G Fallback. Cat 1 bis requires only one antenna instead of the two required by Cat 1 networks, allowing for a more compact and simpler design. The SIMCom strategy is no different, and the company recently released the A7673X series, a Cat 1 bis module based on the ASR1606 chipset. The module supports LTE-FDD, with a maximum downlink rate of 10 Mbps, and an uplink rate of 5 Mbps. The A7673X series adopts the LCC+LGA form factor, and is AT command compatible with the A7670 R2 series, the SIM7000/SIM7070 series, and the SIM800/SIM800F series. This enables smooth migration from 2G/NB/CATM products The 8-bit survival syndrome – part 1 Modern 4-bit devices are a modern interpretation of an original device that has enhanced architecture, performance, and overall capabilities. The reason for this fortitude is that they are not the same devices that Grandad used or programmed one word at a time. While 32-bit MCUs are getting all the attention, many embedded systems and products use 8-bit devices. Without risk to the longevity of a new design, selecting a low-pin-count 8-bit MCU that integrates a few precision analogue peripherals, configurable GPIO pins, serial interfaces, and a fast data bus architecture can accomplish a lot. The same debate that had been occurring around the 4-bit’s successor has the 8-bit device competing against the 16-bit and 32-bit replacements. 8-bit low-pin-count (LPC) microcontrollers have taken advantage of process miniaturisation to improve their features and are now able to perform in more applications than ever before at a lower cost. The core-independent approach by Microchip is an example, where a peripheral can be configured, and then perform a task or tasks in hardware with minimal interaction with the MCU core, thus freeing up processing capability. The innovation seen in 8-bit devices ensures competitiveness against a 32-bit rival. Hybrid systems are also more prevalent now where an 8-bit device handles delegated tasks requiring fewer resources or at a lower priority. While even LPC devices were becoming pad-limited by the 0,35 µm technology node, advances in architecture, motor control, smart energy management, Ethernet, and wireless connectivity requirements for home automation and control have led to a new range of applications for 8-bit MCUs. From the product scope perspective, the reasons why 8-bit devices are just not going away any time soon are the same reasons just over a decade ago that 4-bit devices were still in production from the 1970s. The following lists shows key performance and device enhancements of where 8-bit devices are continuing to innovate and either retain their established role or enhance it: • High performance with faster clock speeds • Integrated features: o Flash memory. o Internal high-speed clocks and timers. o Analogue peripherals. o Integrated touch controller. to LTE Cat 1 products, and facilitates more compatible product design for customer needs. A7673X series supports both multiple built-in network protocols and the drivers for three main operation systems – Windows, Linux and Android. The software functions and AT commands are compatible with the SIM800 Industrial standard. The modules feature interfaces for expandability such as UART, USB, I2C, and GPIO, making them suitable for IoT applications such telematics, metering, surveillance devices, and industrial routers. For more information contact Otto Wireless Solutions, +27 11 791 1033, [email protected], https://bitly.ws/3fySL o Motor control. o Wireless interface. o Wired network connectivity such as integrated CAN and Ethernet. • High reliability. • Small package size. • Low power consumption. • Low cost. • Low electromagnetic interference. • Wider operating voltage range. • Code compatibility between older and aging 8-bit devices with new variants or recommended parts. To change or not to change? Would one develop a new system using a 4-bit MCU? The answer to this is more than likely an emphatic no. However, could there be a niche opportunity? Should the application, the budget, or the system requirements meet the need, then one may consider it at the very least. There may also be a deep-pockets client who has a warehouse of them and wants to use them. For more information contact Haventechnik, +27 78 537 2098, [email protected], www.haventechnik.com Mobile operators have started shutting down 2G networks to free up frequency bands for the newer 4G and 5G communication signals. As recently as the 1970s, a 4-bit word MCU, for example the Intel 4004, would have handled critical tasks. The 4-bit microcontroller had staying power and found its way into many battery-powered devices. As recently as 2010, specific iterations were still in production, for example, Epson’s S1C060 and S1C63 families.
Dataweek, 28 March 2024 www.dataweek.co.za 13 REGULAR SYSTEMS, COMPONENTS, DESIGN 18 W monolithic microwave amplifier The CHA8612-QDB from United Monolithic Semiconductors is a two stage, high-power amplifier operating between 7,9 and 11 GHz. The monolithic microwave amplifier can typically provide 18 W of saturated output power and 40% of power-added efficiency. The circuit is manufactured with a GaN HEMT process, 0,25 µm gate length, via holes through the substrate, air bridges and electron beam gate lithography. It exhibits TDK Corporation has announced the addition of two new varistors to its AVRH series for automotive applications. Both are characterised by the high electrostatic discharge (ESD) withstanding-voltage demanded to ensure the safe operation of safety-critical automotive functions that comprise advanced driver assistance systems (ADAS). Both new varistors in the series are compliant with the AEC-Q200 automotive standard and fulfil 25 kV voltage resistance requirement under IEC 61000-4-2 standard in the electrostatic discharge test. They operate within the temperature range of -55 to 150°C. They not only meet antiESD requirements, but also have minimal footprints, which is useful as automotive OEMs attempt to design and produce low-SWaP products. The percentage of electronics in the total BoM of automobiles is increasing as automotive OEMs add and refine ADAS features such as lane departure warning, collision avoidance, and adaptive cruise control. That is true of electric vehicles, hybrids, and traditional gas-fuelled vehicles alike. Auto manufacturers are also working on autonomous driving, Varistors for automotive applications a linear gain of 26 dB and has a quiescent current of 680 mA. Output return loss is measured at 10 dB. The amplifier is designed for a wide range of applications, from military to commercial radar, and communications systems. For more information contact RFiber Solutions, +27 12 667 5212, [email protected], www.rfibersolutions.com which requires the inclusion of even more sophisticated electronics. The ECUs that manage all these new electronic subsystems are particularly susceptible to damage from ESD. The problem is that even the briefest interruptions in safety-critical ADAS and autonomous driving functions are intolerable, and the potential for the problem only increases as more electronics are added to each vehicle. Varistors are fundamental circuit elements for handling severe voltage irregularities. In automotive applications, they protect delicate ECUs, and are instrumental in conforming to automotive safety standards. For more information contact Future Electronics, +27 21 421 8292, [email protected], www.futureelectronics.com
Dataweek, 28 March 2024 www.dataweek.co.za 14 REGULAR SYSTEMS, COMPONENTS, DESIGN Matchstiq’s G20 and G40 are low SWaP-C SDRs tailored for AI and ML applications. The all-in-one modules combine an RF module, SDR, FPGA, CPU, and GPU into a single transceiver platform. These modules from Matchstiq are highly flexible RF and signal processing SDR platforms, ready to enable applications with the most challenging SWaP-C requirements. Both the G20 and G40 have Epiq’s flagship SDR, the Sidekiq NV100, as a fundamental component. The Matchstiq G20 incorporates a single Sidekiq NV100, a 2 TB SSD, and an Nvidia Orin NX, enabling direct RF record, analysis, and playback. The Matchstiq G40 integrates the Orin NX with two Sidekiq’s (both NV100), enabling phasecoherent operation across four RF channels, ideal for beamforming applications or independent operation for multi-band applications. With Sidekiq NV100 at the core, the Matchstiq G20 and G40 are designed for small form factor UsX payloads and handheld and dismounted Low SWaP-C SoM for AI The STM32WL5M from ST Microelectronics is the company’s first LoRaWAN-certified module. This module is an update to the STM32WL5, which incorporated two cores, one of them being a wireless stack to optimise the creation of sub-GHz applications. The STM32WL5M integrates all components into one package to ease design and prototyping. The STM32WL5M is ST’s first module to support two output powers, thanks to its two power amplifiers. Hence, coupled with the wide frequency range supported by its STM32WL5x, the module can work in Europe, the Americas, and Asia. Despite all this, however, the device is still one of the smallest at 10 x 10 mm. Consequently, the module makes designing a sub-GHz application far more practical, as it enables engineers to enjoy a comprehensive solution in a small package without having to deal with the complexity of creating it. Why LoRaWAN? In a survey presented at the 2017 International Symposium on Signals, Circuits, and Systems, researchers established that LoRa could solve the significant challenges that plague the widespread adoption of IoT devices. Its use of sub-GHz frequencies and its Chirp Spread Spectrum modulation technique enables the transmission of small packages over long distances, while making it more resilient against interferences, and more robust overall. According to the LoRa Alliance, there were more than 225 million LoRa/LoRaWAN end nodes in March 2022. LoRa’s modulation stands up to interferences from electrical grids, and provides a methodology to optimise the implementation of smart meters. By embedding a radio, the STM32WL5 becomes LoRaWAN-certified sub-GHz module an essential step toward democratising the Long Range technology and adopting more sustainable energy consumption. Why do we need two cores? Having two cores in the STM32WL5M avoids the hassle of re-certification with every update. If the network and applications stacks are on the same core, modifying any of it forces teams to re-certify the communication protocol. Thanks to the dual-core architecture of the STM32WL5M, developers sidestep this problem by putting the network stack on the Cortex-M0+ and the application on the Cortex-M4. Another reason to provide a dual-core architecture is that is provides hardware isolation between each core. This enables authenticity verification, strong data decryption, and data integrity monitoring. The dual-core STM32WL5M also comes with many of ST’s STM32Trust features, such as secure firmware install and update. Additionally, it has two unique IDs (64-bit and 96-bit) to offer multiple protection levels against read and write operations. For more information contact Altron Arrow, +27 11 923 9600, [email protected], www.altronarrow.com The VL53L9 is a direct ToF 3D LiDAR device with a resolution of up to 2,3k zones. Integrating a dual scan flood illumination, which is unique in the market, the LiDAR can detect small objects and edges, and captures both 2D infrared (IR) images and 3D depth map information. It comes as a ready-to-use low-power module with its on-chip dToF processing, requiring no extra external components or calibration. The VL53L9 delivers state-of-the-art ranging performance from 5 cm to 10 metres. The module’s suite of features elevates camera-assist performance, supporting macro up to telephoto photography. It enables features such as laser autofocus, bokeh, and cinematic effects for still and video at 60 fps. Virtual reality systems can leverage accurate depth and 2D images to enhance spatial mapping for more immersive gaming and other VR experiences. The sensor’s ability to detect the edges of small objects at short and ultra-long ranges makes it also suitable for applications like SLAM (simultaneous localization and mapping). For more information contact Avnet Silica, [email protected], www.avnet.com/wps/portal/silica 3D depth sensing sensor applications, offering an unprecedented level of integration and performance. Both platforms are equipped with the Nvidia Orin NX 16G SoM, ideal for hosting AI and machine learning algorithms. These low SWaP-C platforms enable AI and ML capabilities to move to the RF edge, reducing data transfer speeds to the host and system power consumption. For more information contact RFiber Solutions, +27 12 667 5212, [email protected], www.rfibersolutions.com STMicroelectronics has expanded into 3D depth sensing with their latest time-of-flight sensors. A recent announcement has revealed an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with 2,3k resolution, and an early reveal for what is currently the world’s smallest 500k-pixel indirect Time-of-Flight (iToF) sensor.
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