The DEK TQ printing platform is superfast, with a core cycle time of only 5 to 6,5 s, and provides outstanding flexibility.

The SIPLACE SX is a leading placement platform for high-mix electronics production, where even odd-shaped components can be placed with exceptional reliability.

South African EMS specialist, Jemstech, has expanded its SMT capacities with two of ASM’s SIPLACE SX2 placement machines forming a separate production line for high-mix applications. The result is maximised ...

SolidRun and Hailo has unveiled a game-changer for engineers and AI product developers with the launch of their market-ready SoM, which packs the cutting-edge capabilities of the Hailo-15H SoC.

The PIC18-Q20 8-bit microcontrollers from Microchip easily interface with devices operating in multiple voltage domains, and the built-in I3C interface supports higher-speed and lower-power data transfers than I2C.

To help easily incorporate USB power and communication functionality into embedded systems, Microchip Technology has launched the AVR DU family of microcontrollers.

Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.

The nRF9151 from Nordic Semiconductor is an integrated System-in-Package that supports LTE-M/NB-IoT, DECT NR+ and GNSS services.

Axon’s AxoMach high-speed links were recently qualified by the European Space Agency to the ESCC 3409/001 standard, and are designed to transmit data at speeds of up to 40 Gbps for space applications.