Vishay has broadened its optoelectronics portfolio with the release of a new 850 nm infrared emitter featuring a parabolic lens for a very narrow ±3° angle of half intensity. Based on a unique surface emitter chip technology, the VSLY5850 offers radiant intensity of 600 mW/sr at a 100 mA drive current, optical power to 55 mW and fast 10 ns switching times.
The surface emitter technology used in the VSLY5850 represents a unique die construction in which all the light generated inside the semiconductor is emitted through the top surface of the chip. This greatly reduces side emissions out of the device’s 5 mm T1¾ plastic package, providing the user with a narrow, well-directed emission beam without disturbing fractions towards the sides.
The device is optimised for IR illumination in CMOS cameras, fire alarm systems and smoke detectors. Its fast switching times also make it ideal for use in high modulation frequency applications for long-range data transmission in road cash systems, traffic controls and licence plate flashing. The emitter offers an operating temperature from –40°C to +85°C and is suitable for high pulse current operation.
General-purpose MCU with RISC-V architecture EBV Electrolink
DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
Read more...AI-native IoT platform launched EBV Electrolink
AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.
Read more...Serial SRAM up to 4 MB EBV Electrolink
DSP, Micros & Memory
The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.
Read more...Microchip expands its mSiC solutions EBV Electrolink
Power Electronics / Power Management
The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.
Read more...Powering up the intelligent edge EBV Electrolink
DSP, Micros & Memory
STMicroelectronics is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...Mouser broadens its LED lineup
Opto-Electronics
Mouser has broadened its LED lineup with diverse solutions designed to support lighting, medical, and smart home applications.
Read more...Flash for AI EBV Electrolink
AI & ML
SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.
Read more...UFS Ver. 4.0 embedded Flash memory devices EBV Electrolink
Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.
Read more...InnoSwitch5 Offline Flyback Switcher IC EBV Electrolink
Power Electronics / Power Management
ero-voltage switching (ZVS) flyback topology and advanced SR FET control enable 95% efficiency, together with reduced power supply size and component count.
Read more...IGBT power module EBV Electrolink
Power Electronics / Power Management
The company has now released its new half-bridge IGBT power modules offered in its redesigned INT-A-PAK package.
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