15 November 2017
Telecoms, Datacoms, Wireless, IoT
The ESP32-PICO-D4 from Espressif Systems is a System-in-Package (SIP) module that is based on the ESP32 platform, providing complete Wi-Fi and Bluetooth functionalities. It comes in a package measuring just 7,0 x 7,0 x 0,94 mm, thus requiring minimal PCB area, and integrates 4 MB of SPI Flash.
At the core of this module is the ESP32 chip, which is a single 2,4 GHz Wi-Fi and Bluetooth combo chip designed with TSMC’s 40 nm ultra-low power technology. The SIP integrates all peripheral components seamlessly, including a crystal oscillator, Flash, filter capacitors and RF matching links in one single package. Given that no other peripheral components are involved, module welding and testing is not required either. As such, it reduces the complexity of the supply chain and improves control efficiency.
With its ultra-small size, robust performance and low energy consumption, the device is well suited for any space-limited or battery-operated applications, such as wearable electronics, medical equipment, sensors and other IoT products.
Full sensor to cloud solution CST Electronics
Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.
Read more...Long-range Wi-Fi HaLow module TRX Electronics
Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.
Read more...Quectel launches 3GPP NTN comms module Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.
Read more...SIMCom’s A7673x series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.
Read more...ESP32-P4 high-performance MCU iCorp Technologies
AI & ML
Powered by a dual-core RISC-V CPU running up to 400 MHz, ESP32-P4 also supports single-precision FPU and AI extensions, thus providing all the necessary computational resources.
Read more...Long-range connectivity module Avnet Silica
Telecoms, Datacoms, Wireless, IoT
Digi XBee XR 868 RF Modules support the deployment of long-range connectivity applications, and support point-to-point and mesh networking protocols.
Read more...4G LTE-M/NB-IoT connectivity reference design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Developed around the industry-leading Nordic nRF9160 module, the platform comes complete with a newly-developed LTE antenna, ATRIA, which is pre-certified to operate over the full LTE-M and NB-IoT bands.
Read more...Antennas to meet all connectivity requirements Electrocomp
Telecoms, Datacoms, Wireless, IoT
Kyocera AVX RF antennas meet today’s connectivity demands in the LTE, Wi-Fi, Bluetooth, GNSS, and ISM wireless bands, available in surface mount, patch or external configurations.
Read more...Introducing SIMCom’s new A7673X series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat 1 bis module that supports LTE-FDD, with a maximum downlink rate of 10 Mbps and an uplink rate of 5 Mbps.
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