27 February 2019Manufacturing / Production Technology, Hardware & Services
Indium has released Indium6.6HF solder paste – a new water-soluble, halogen-free solder paste that is compatible with both tin-lead and lead-free alloys. It is designed to provide enhanced stencil printing performance and minimise voiding in printed circuit board assembly applications.
Indium6.6HF exhibits optimal wetting to a variety of surface finishes, resulting in very few voids, a reduction in the size of the largest voids, and minimised overall voiding. The paste exhibits high transfer efficiency and long stencil life (up to 12 hours), excellent response-to-pause, and prints consistently at a wide range of speeds.
Its high tack value (more than 8 hours) ensures consistent component holding power, allowing high-speed component placement operation. Indium6.6HF is cleanable up to at least 72 hours after reflow.
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