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more information about Rugged Interconnect Technologies |
The robust panel PC, DC17, was specially developed by MEN for railway applications, and offers everything that is needed for immediate use in a train: EN 50155 conformity, an IP65-protected housing, a
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Pentek recently introduced the JadeFX Model 5983, a 3U VPX carrier board for FMC and FMC+ modules based on the high-performance Xilinx Kintex Ultrascale FPGA.
The board includes a VITA-57.4 FMC site
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In parallel with the PTXdist-based board support packages (BSP) for ARM modules, the embedded specialist, TQ, is now also making available a corresponding Yocto Metalayer. Support will initially be provided
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TEWS released a new standard single-wide PCI Mezzanine Card (PMC) compatible module designed for industrial, COTS and transportation applications.
The TPMC532 provides 16 or 8 channels of simultaneous
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EKF has developed an advanced new liquid cooling system for high-performance computers in the field of autonomous driving and robotics.
The CoolConduct system has three main features: firstly, standard
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TEWS released a new standard single-wide PCI Mezzanine Card (PMC) compatible module designed for industrial, COTS and transportation applications.
The TPMC532 provides 16 or 8 channels of simultaneous
read more
TQ-Group has developed new CPU modules based on three different ARM Cortex Axx architectures with differing market orientations. The individual CPU versions have differing specifications and support CAN
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EKF’s SC5-FESTIVAL is a rich featured, high-performance CompactPCI Serial CPU board, equipped with an Intel Xeon E3 mobile workstation processor for demanding applications. For scalability, the board
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With the embedded module TQMa57xx, TQ is planning a new Minimodule in which the processor family AM57xx is used with the basis of a Cortex A15 by Texas Instruments. A Cortex A15 Core with up to 2x 1,5
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Adlink’s new Matrix MXE-110i industrial IoT gateway, supporting Intel Gateway Solutions for the Internet of Things (IoT), provides versatile RF connectivity and fanless rugged construction, all in a more
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Open architecture embedded systems for military/aerospace applications have always relied on mezzanine or daughter cards to provide flexibility and modularity because they are very effective in handling
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ADLINK announced the release of the MVP-6000 Series, first in a new value line of fanless embedded computing platforms.
Incorporating the 6th generation Intel Core processor, the system’s price point
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