New from Avnet Silica is the HoriZone RA development kit, which is designed to enable proofs-of-concept for edge-to-cloud Internet of Things (IoT) applications requiring secure communications. Powered by Renesas Advanced (RA) microcontrollers for secure IoT endpoints and edge devices, the easy-to-use kit delivers advanced security features for resource-constrained embedded systems connected to Avnet´s IoTConnect Cloud platform based on Microsoft Azure cloud.
The turnkey multi-sensor solution is highly scalable, providing a seamless path from proof-of-concept to project through to deployment, including all the required building blocks. The kit includes sensors for humidity, temperature, ambient light, air quality and air pressure, plus microphone, digital accelerometer, digital gyroscope and inductive proximity sensor for positioning information.
The board integrates several components from Renesas, including the RA RA6M3 microcontroller, which is suitable for IoT applications that require TFT, Ethernet, security, large embedded RAM and USB High Speed. Also included are the ISL88014 voltage supervisor and ISL80102 synchronous boost converter for power management. Out of the box, engineers can quickly start developing IoT endpoint and edge devices for a broad range of applications, including industrial and building automation, metering, healthcare and home appliances.
SMT-mountable card connectors
Telecoms, Datacoms, Wireless, IoT
Würth Elektronik introduces four new SMT-mountable Nano SIM and microSD card connectors and expands its range with solutions for the smallest packages.
Read more...Module for smart city and smart utility devices iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has launched the Quectel KCM0A5S, a high-performance Wi-SUN module designed for smart applications such as street lighting, precision agriculture, industrial IoT, smart meters and smart cities.
Read more...Ultra-low-power wireless module Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The STM32WBA5MMG from STMicroelectronics is an ultra-low-power, small form factor, certified 2,4 GHz wireless module that supports Bluetooth LE, Zigbee 3.0, OpenThread, and IEEE 802.15.4 proprietary protocols.
Read more...MCX C Series development board Avnet Silica
DSP, Micros & Memory
The FRDM-MCXC444 is a compact and scalable development board for rapid prototyping of MCX C444 MCU from NXP Semiconductors.
Read more...Quectel partners with GEODNET Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has partnered with GEODNET to deliver Quectel’s Real-Time Kinematic (RTK) correction services, enabling high-precision positioning for IoT applications.
Read more...Bringing Bluetooth Channel Sounding to automotive and beyond with KW47 Altron Arrow
Telecoms, Datacoms, Wireless, IoT
NXP’s new Channel Sounding-certified KW47 and MCX W72 wireless MCUs are set to help automakers with distance measurement, bringing an additional ranging solution for car access and autonomous systems, and will be utilised across a broader spectrum of applications.
Read more...Dual-band GNSS antenna RF Design
Telecoms, Datacoms, Wireless, IoT
The Taoglas Accura GVLB258.A, is a passive, dual-band GNSS L1/L5, high-performance antenna for high precision GNSS accuracy and fast positioning.
Read more...Cutting-edge hybrid capacitors Avnet Silica
Passive Components
Panasonic Industry recently announced the launch of the ZVU Series Hybrid Capacitors, a cutting-edge solution tailored to meet the escalating demands of advanced electronic systems.
Read more...What is Wi-Fi HaLow and why choose it for IoT? iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Wi-Fi HaLow introduces a low power connectivity option that, in contrast to other Wi-Fi options, offers greater range of approximately 1 km, which opens up a raft of IoT use cases.
Read more...Wi-Fi 6 and Bluetooth LE coprocessor module Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The ST67W611M1 from STMicroelectronics boasts an all-in-one design which, together with its capabilities, contribute to making it an attractive choice for IoT edge devices requiring a single-chip solution.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version