The STM32C5 series from STMicroelectronics delivers an excellent balance of performance, efficiency, and affordability for embedded designs that require more capability without increasing bill of materials cost.
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Positioned as an incremental upgrade to the ESP32-H2, Espressif’s ESP32-H21 adds an integrated DC-DC converter that reduces active current draw and helps extend battery life in power-sensitive consumer and industrial devices.
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WOLF Advanced Technology’s Coyotes division focusses on designing and manufacturing compact open-systems architectures built on VNX plus, VPX, and custom form factors.
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PCI Express has become the backbone of modern high-performance systems with each new generation promising higher bandwidth, but that performance comes with a cost.
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As the production distribution and utilisation of hydrogen continue to scale, connectivity becomes a key enabler for efficient energy transmission, data communication, and system control.
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Join Sigfox South Africa for a forward-looking session exploring how AI and next-generation connectivity are reshaping the way we track, monitor, and optimise assets at scale.
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Microchip’s latest hybrid MCU SiP integrates an Arm926EJ-S processor with 512 Mb of DDR2 SDRAM and is engineered to meet the rising demand for sophisticated HMI solutions in modern vehicles.
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TDK Corporation has jointly developed a prototype of a reservoir AI chip using an analogue electronic circuit that mimics the cerebellum with Hokkaido University.
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EBV Elektronik recently introduced MOVE – Driving Robotics Forward, a new initiative designed by EBV Elektronik‘s Embedded Solutions team to support the development of next-generation robotic systems.
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Choosing the right battery is not simply a technical detail, but a defining factor in the longevity and cost-effectiveness of any IoT deployment.
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[Sponsored] Addressing this challenge requires system-level thinking and adoption with McKinsey Electronics providing the engineering and sourcing framework required to maintain system resilience despite ongoing global constraints.
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Microchip’s dsPIC33AK256MPS306 Digital Signal Controllers combine high-resolution control, high-speed analogue, and security with support for post-quantum cryptography.
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The Renesas RA8D2 group of microcontrollers delivers ultra-high performance for next-generation graphics, HMI, and vision-driven designs that demand fast response, rich visual interfaces, and embedded AI capability.
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Sundance Multiprocessor Technology has introduced the SMT135-C, an Efinix Titanium Ti135 evaluation platform designed for edge computing, real-time control, and vision-centric workloads.
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ST Microelectronics’ STDES-ST87M01IGN is a reference design for the ST87M01 NB-IoT + GNSS module, implemented on a 2-layer FR4 PCB (90 x 60 x 1,6 mm).
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The nRF54LM20B from Nordic Semiconductor is an ultra-low-power wireless SoC that combines advanced edge AI capabilities with robust radio connectivity and rich peripheral support.
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Built around the Qualcomm QCS6490 octa-core SoC, Quectel’s QuecPi Alpha delivers up to 12 TOPS of on-device AI performance.
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Designed to operate where conventional systems fall short, the TB-7145-MVS compact industrial PC supports advanced machine inferencing, real-time data handling, and high-performance graphics workloads without compromise.
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