The Africa Energy Indaba will open its 2026 Conference with a high-level plenary panel addressing one of the continent’s most urgent challenges: Energy Access and Energy Poverty – Mission 300M.
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Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
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Pretoria-based electronics company Etion Create is showing a new range of innovative solutions, including cybersecurity systems at the third edition of World Defense Show (WDS2026) in Riyadh, Saudi Arabia.
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The Indaba convenes senior government leaders, utilities, regulators, project developers, financiers, DFIs, investors, and technology providers from across Africa and the world to engage directly on investment-ready energy projects, enabling policy frameworks, and the partnerships required to unlock delivery at scale.
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This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.
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The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
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ioTech recently unveiled the io600 inline digital laser material deposition system at productronica 2025.
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The company has commissioned a new dedicated IPC Class 3 facility in Somerset West. and has concluded a new investment partnership that will provide the capital and management capacity required to scale operations.
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There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
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Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
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The SIPLACE V from ASMPT marks a new era in SMT placement technology, delivering a significant performance boost for modern electronics manufacturers.
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The Hanwha Semitech XM520 is a high-performance, general-purpose chip mounter engineered for flexible, efficient SMT assembly.
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Fuji’s AIMEXR placement machine has been developed to be an all-rounder that is able to realise flexible and stable production from NPI to mass production.
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The PCBS-400V industrial linear blade PCB depaneling machine is engineered for manufacturers who demand clean separation, repeatable accuracy, and dependable throughput in high volume electronics production.
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The EMST Stallion fc - PLC is a highly capable wave soldering machine engineered for precision and productivity in electronics manufacturing.
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An ESD chair forms an integral part of grounding within the electrostatic discharge protected area to prevent potential damage to products.
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The GRS550 from Polar is a flying probe PCB repair system, designed to assist in repair and recovery of expensive boards with hard-to-find faults.
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The PBT Works HyperSWASH III is a top-tier automatic PCB cleaning system engineered for precision, high throughput, and advanced process control in modern SMT production.
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