Mouser Electronics has announced a new eBook in collaboration with Arduino – From Blink to Think: How Arduino UNO Q Helps Designers Go from Idea to Intelligent Product.
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UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.
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i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.
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MIKROE have continued their collaboration with Renesas by introducing support for the RL78 architecture in NECTO Studio, expanding the IDE beyond its existing MCU platforms.
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Electrostatic discharge performance is influenced by several environmental factors, with relative humidity being one of the most important. This is particularly relevant in South Africa, where seasonal changes can result in significant differences in humidity levels.
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In practice, engineers building compact RTK products keep discovering the same thing: the hardest component in the system is no longer the receiver. It is the antenna.
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The smallest part on the BOM is usually the one that holds it up. Interconnect, passive and electromechanical components rarely get attention until they are missing. That is starting to change, and it is reshaping how procurement teams think about risk.
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AMD Vivado Design Suite 2026.1 is here and features a new tiered licensing model for greater flexibility, new device support, major NoC and QoR improvements, and ease-of-use enhancements for designing with AMD Versal adaptive SoCs.
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GirlCode, in partnership with Absa Group, Truecaller, MTN, SAP Fioneer, RS South Africa and other ecosystem partners, successfully hosted the first leg of the 2026 GirlCode Hackathon.
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congatec has introduced its new COM-HPC Client Size C module with AMD Ryzen AI Embedded X100 Series processors. The application-ready aReady.COM conga-HPC/cRX1 has been specifically designed for compute-intensive physical AI applications.
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SemiQ’s half-bridge series for data centre power converters and industrial motor drives features low RDSON SiC MOSFETs and parallel SBD diodes for best-in-class power density and conversion efficiency.
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The IR315 combines 4G LTE, Wi-Fi, Ethernet, and VPN technologies into a rugged, industrial-grade platform that enables seamless connectivity across a wide range of applications.
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Conformal coating is widely used to protect electronics from moisture or other environmental hazards. It is critical to know if coatings are properly applied; covering what is meant to be covered and not covering what should be exposed.
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The AM3269 from Mercury Systems is a high-performance RF preselector module designed to improve receiver sensitivity and signal integrity in demanding electronic warfare, signals intelligence, test, and communications applications.
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The Havok PCS.06.A antenna, from Taoglas, is a low profile SMD LTE/cellular 4G/3G/2G embedded antenna designed for direct SMD mount on a device PCB.
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Quectel’s FCM266D combines single-band 2,4 GHz Wi-Fi 6 with Bluetooth LE 5.4 in an ultra-compact LCC package measuring just 20 x 18 x 2,4 mm.
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The Scienscope AXl-6100 series comprises specialised X-ray inspection systems explicitly engineered for the examination of long circuit boards.
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Introducing the CLT-FG, a new series of compact all-in-one SMT placement machines
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