Dizzy Enterprises recently hosted two hands-on Proteus Training Conferences, bringing together electronics professionals, designers, and enthusiasts to explore the latest capabilities of the Proteus Design Suite from Labcenter Electronics.
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TDK Corporation has jointly developed a prototype of a reservoir AI chip using an analogue electronic circuit that mimics the cerebellum with Hokkaido University.
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Designed for engineers, researchers, and radio enthusiasts alike, the HackRF Pro can transmit and receive signals across a wide frequency range of 100 kHz to 6 GHz, making it a versatile tool for testing and developing modern and emerging radio technologies.
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The Fraunhofer Institute for Photonic Microsystems IPMS has developed a new 10G TSN endpoint IP Core, enabling deterministic real-time communication at data rates of up to 10 Gbit/s.
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Choosing the right battery is not simply a technical detail, but a defining factor in the longevity and cost-effectiveness of any IoT deployment.
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ioTech has introduced the io600, a next generation digital deposition platform designed to bring intelligence, precision, and scalability to modern electronics manufacturing.
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The company unveiled its next-generation portfolio featuring Cat 1 bis, satellite NTN, and advanced LTE-M/NB-IoT with edge AI, delivering secure and resilient connectivity across billions of IoT devices.
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5G, the 5th generation of wireless broadband technology, enables users to establish reliable connectivity, which in turn enables flexible, autonomous, and efficient processes from production to logistics.
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This agreement between Avent Silica and Thales covers the latter’s eSIM solutions that are compliant with GSMA SGP.22 and SGP.32 standards.
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OMRON’s BU_2SW and BU_2RWL series UPS systems are engineered to offer a robust, online type power architecture designed to safeguard sensitive AC powered systems across a wide range of industries.
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Combining low-power connectivity, edge processing, and positioning capabilities in a compact module, Nordic’s nRF9151 targets applications such as asset tracking, smart metering, industrial monitoring, and smart city infrastructure.
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Espressif Systems has expanded its wireless connectivity portfolio with the introduction of the ESP32-E22, a high-performance connectivity co-processor designed for next generation embedded and IoT systems.
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The Aurora Reflow Oven Platform from BTU International is a next generation thermal processing system engineered for modern electronics manufacturing environments.
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The new tool, Print Param Decision Assist, automatically inspects the board file when loaded to calculate ideal printing parameters and troubleshoot existing settings.
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Siemens recently announced that Inventec Corporation has adopted Siemens’ Valor NPI software and Process Preparation X solutions from the Siemens Xcelerator portfolio to strengthen its design-for-manufacturing efficiency.
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Siemens recently announced LOGO! 9, the latest generation of its compact logic controller designed for small automation projects in both industrial and building applications.
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Engineered for high-speed, high-accuracy applications, the ESE ES-FA1 solder paste printer eliminates the traditional bottlenecks of manual stencil changes and paste management, making it an ideal solution for Tier 1 EMS providers and advanced semiconductor assembly.
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The VP2200-100 vacuum inline vapour phase soldering system from ASSCON is designed for fully automated, high-volume electronics manufacturing where process consistency and solder joint quality are critical.
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