NXP Semiconductors claimed a major industry milestone for 5G energy efficiency with the integration of gallium nitride (GaN) technology to its multi-chip module platform. Building on the company’s investment in its GaN fabrication plant in Arizona, the most advanced fab dedicated to RF power amplifiers in the USA, NXP boasts of being the first to announce RF solutions for 5G massive MIMO that combine the high efficiency of GaN with the compactness of multi-chip modules.
Reducing energy consumption is a major goal for telecom infrastructure, where every point of efficiency counts. The use of GaN in multi-chip modules increases lineup efficiency to 52% at 2,6 GHz – eight percentage points higher than the company’s previous module generation. NXP has further improved performance with a proprietary combination of LDMOS and GaN in a single device, delivering 400 MHz of instantaneous bandwidth that makes it possible to design wideband radios with a single power amplifier.
This energy efficiency and wideband performance are now available in the small footprint of NXP’s 5G multi-chip modules. The new portfolio will enable RF developers to reduce the size and weight of radio units, helping mobile network operators lower the cost of deploying 5G on cellular towers and rooftops. In a single package, the modules integrate a multi-stage transmit chain, 50 Ω in/out matching networks and a Doherty combiner – and NXP is now adding bias control using its latest silicon germanium (SiGe) technology. This new step in integration removes the need for a separate analog control IC and provides tighter monitoring and optimisation of power amplifier performance.
Quectel partners with GEODNET Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has partnered with GEODNET to deliver Quectel’s Real-Time Kinematic (RTK) correction services, enabling high-precision positioning for IoT applications.
Read more...Bringing Bluetooth Channel Sounding to automotive and beyond with KW47 Altron Arrow
Telecoms, Datacoms, Wireless, IoT
NXP’s new Channel Sounding-certified KW47 and MCX W72 wireless MCUs are set to help automakers with distance measurement, bringing an additional ranging solution for car access and autonomous systems, and will be utilised across a broader spectrum of applications.
Read more...Dual-band GNSS antenna RF Design
Telecoms, Datacoms, Wireless, IoT
The Taoglas Accura GVLB258.A, is a passive, dual-band GNSS L1/L5, high-performance antenna for high precision GNSS accuracy and fast positioning.
Read more...What is Wi-Fi HaLow and why choose it for IoT? iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Wi-Fi HaLow introduces a low power connectivity option that, in contrast to other Wi-Fi options, offers greater range of approximately 1 km, which opens up a raft of IoT use cases.
Read more...Wi-Fi 6 and Bluetooth LE coprocessor module Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The ST67W611M1 from STMicroelectronics boasts an all-in-one design which, together with its capabilities, contribute to making it an attractive choice for IoT edge devices requiring a single-chip solution.
Read more...Futureproofing IoT connectivity SIMcontrol
Telecoms, Datacoms, Wireless, IoT
A managed private APN assigns every device to an isolated carrier slice, producing a single ingress to the enterprise network, with traffic bypassing shared internet paths and reducing exposure.
Read more...Extra slim 2,4 GHz radio module
Telecoms, Datacoms, Wireless, IoT
The Thyone I radio module from Würth Elektronik now has a little sibling: Thyone-e, which takes up 30% less space and represents a cost-effective alternative for applications in which the long-range mode is not required.
Read more...Wi-Fi 6 plus Bluetooth LE SoC Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Silicon Labs’ SiWx917M SoC is the company’s lowest power Wi-Fi 6 SoC, ideal for ultra-low power IoT wireless devices using Wi-Fi, Bluetooth, Matter, and IP networking for secure cloud connectivity.
Read more...High-reliability isolation amplifiers EBV Electrolink
Analogue, Mixed Signal, LSI
The VIA series of isolation amplifiers from Vishay are designed to deliver exceptional thermal stability and precise measurement capabilities.
Read more...Two Bluetooth protocols – one module
Telecoms, Datacoms, Wireless, IoT
Würth Elektronik has introduced its Skoll-I, a compact wireless module that combines both Bluetooth Classic and Bluetooth Low Energy version 5.4 into a single solution.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version