The B-U585I-IOT02A Discovery kit provides a complete demonstration and development platform for STMicroelectronics’ STM32U585AI microcontroller, featuring an Arm Cortex-M33 core with Arm TrustZone and Armv8-M mainline security extension, 2 MB of Flash memory and 786 KB of SRAM, as well as smart peripheral resources.
This kit enables a wide diversity of applications by exploiting low-power communication, multiway sensing and direct connection to cloud servers.
It includes Wi-Fi and Bluetooth modules, as well as microphones, temperature and humidity, magnetometer, accelerometer and gyroscope, pressure, time-of-flight and gesture-detection sensors.
Support for Arduino Uno V3, STMod+ and Pmod connectivity provides unlimited expansion capabilities with a large choice of specialised add-on boards. For even more user-friendliness, the on-board STLINK-V3E debugger provides out-of-the-box loading and debugging capabilities, as well as a USB virtual COM port bridge.
The B-U585I-IOT02A Discovery kit leverages the STM32U5 Series’ key assets to enable prototyping for a variety of wearable or sensor applications in fitness, metering, industrial or medical, with state-of-the-art energy efficiency and elevated security.
More room to scale Altron Arrow
Power Electronics / Power Management
With the latest STM32H5 lines from STMicroelectronics, you can now scale within the same platform, from a compact 1 Mbyte device to higher-memory MCUs for graphics-rich and feature-heavy designs.
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DSP, Micros & Memory
i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.
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MIKROE have continued their collaboration with Renesas by introducing support for the RL78 architecture in NECTO Studio, expanding the IDE beyond its existing MCU platforms.
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Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.
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Passive Components
Infineon Technologies has introduced the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and electromechanical relays (EMRs).
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Computer/Embedded Technology
Smaller, multi-camera platform enables scalable Ethernet architectures for NVIDIA Edge AI systems, while lowering power, cost and integration complexity.
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Telecoms, Datacoms, Wireless, IoT
Vishay Intertechnology has introduced a new series of infrared (IR) receiver modules for IR remote control applications, which feature a wide modulation frequency acceptance from 30 kHz to 68 kHz.
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UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.
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Telecoms, Datacoms, Wireless, IoT
The Havok PCS.06.A antenna, from Taoglas, is a low profile SMD LTE/cellular 4G/3G/2G embedded antenna designed for direct SMD mount on a device PCB.
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DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
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