TE Connectivity is complementing its series of banding (BT) and Tinel ring (TXR) backshells with a braid tail backshell. The new 70 Series swept elbow backshells include a pre-terminated screenbraid sock for an overall screen, as well as constant internal radius and a smooth internal bore using investment casting. They are designed to allow for uncoupling during repairs, which helps reduce damage to the boot, resulting in a simple and fast termination option.
These parts offer designers the potential for up to 20% weight savings over traditional backshells, allowing for improved efficiency as content continues to grow in military and aerospace systems. They also offer overall 360° screening against EMI/RFI for customers in high-vibration applications using high-reliability, low-profile magna form ring termination.
The 70 Series swept elbow backshells suit a wide range of circular connectors and they are available in multiple shell sizes and plating configurations. Those include MIL-DTL-38999 series III and IV as well as MIL-DTL-26482 series II.
High current and voltage interconnect Hiconnex
Interconnection
The 972 series interconnect from Glenair ensures peak performance for the latest specification requirements in high-current, high-voltage, and high-frequency commercial aircraft applications.
Read more...M12 panel mount connectors Communica
Interconnection
Binder, a specialist in industrial circular connectors, offers a particularly wide range of M12 panel mount connectors that cover a wide variety of connection types, materials, and fastening solutions.
Read more...Low-profile tantalum chip capacitors Electrocomp
Passive Components
These general-purpose tantalum capacitors from Kyocera AVX are available in multiple case sizes with low profile options.
Read more...Compact high-performance antennas Electrocomp
Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX offers a variety of extremely compact and high-performance internal, on-board, multiprotocol 2,4 GHz antennas ideal for use in SiP applications.
Read more...Blade terminals deliver greater power density Spectrum Concepts
Interconnection
[Sponsored] Connectivity has become more important as designers pack more power into smaller spaces, all while managing thermal loads and ensuring efficiency.
Read more...Track with precision Electrocomp
Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX provides innovative antennas for cellular, LTE-M, NB-IoT, LoRa, GNSS, BLE, UWB, Wi-Fi, and future Satellite IoT.
Read more...RGBIR sensor with I2C interface Electrocomp
Opto-Electronics
Available in a miniature opaque 2,67 x 2,45 mm package, Vishay’s VEML6046X00 includes high-sensitivity photodiodes, a low noise amplifier, and a 16-bit analogue to digital converter.
Read more...New connector for Push-X technology Phoenix Contact
Interconnection
Phoenix Contact is extending the series of PCB connectors with innovative Push-X technology to include a new connector for conductor cross-sections up to 2,5 mm2.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version