News


5G to be implemented on Earth-orbiting satellites

27 July 2022 News

Ericsson, French aerospace company Thales, and wireless technology innovator Qualcomm Technologies are planning to take 5G out of this world and across a network of Earth-orbiting satellites. After having each conducted detailed research, which included multiple studies and simulations, the parties plan to enter testing and validation of 5G non-terrestrial networks (5G NTN).

The result could effectively mean that a future 5G enabled devices could use 5G connectivity anywhere on Earth and provide complete global coverage for wideband data services, including places normally only covered by legacy satellite phone systems with limited data connectivity capabilities. This could potentially be a game-changer for personal and automotive communication in remote areas as such widespread connectivity would boost 5G smartphone subscriber roaming service capabilities, as well as enabling global connectivity for transportation, energy and health sector 5G use cases.

The space-based network could also be used as back-up support to terrestrial networks in the event of major network outages or disasters. The expected security capabilities of 5G NTNs mean that national government communications may be a main use case, to enhance safe and secure national security and public safety government networks.

John Smee, senior vice president of engineering, Qualcomm Technologies, says, “For 5G to fulfil on the promise of ubiquitous connectivity, it is imperative that it can also deliver network coverage in areas where terrestrial cellular networks do not exist, whether that be over oceans or in remote areas. Our planned research with Ericsson and Thales will kick off an important step in making this vital technology a reality. We are looking forward to what this collaboration can accomplish.”


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Rapid IoT prototyping simplified
Future Electronics Test & Measurement
The STEVAL-MKBOXPRO from STMicroelectronics is a compact, ready-to-use wireless development kit designed to accelerate the creation of intelligent IoT and wearable applications.

Read more...
From the editor's desk: Pricing surge reshapes engineering reality
Technews Publishing News
The recent and continuing surge in memory prices has become more than a supply-chain story confined to global semiconductor markets. We have watched in disbelief as the ASP of memory has risen by over ...

Read more...
Siemens democratises EDA software access
News
This collaboration will provide streamlined access to advanced electronic design automation software for European semiconductor innovation.

Read more...
Components distribution: A promising trend
News
The European electronic components market returned to solid growth in Q1, gaining 16,9%, with broad, but uneven, momentum across the region.

Read more...
New appointment for Links Field team
Links Field Networks News
Links Field Networks is excited to welcome Jarrod Hutton to the company as a technical sales representative, bringing a powerful combination of technical expertise, creativity, and a genuine passion for innovation.

Read more...
Solar skills empower Alexandra youth
News
To support developing renewable energy skills, Yellow Door Energy launched YDE Lumen30, a programme that trained 30 young people from Alexandra township in Johannesburg.

Read more...
Advancing hydrogen mobility in South Africa
News
The hydrogen refueller was developed using South African engineering expertise and complies with 42 international and local standards.

Read more...
Cortex-M33 performance for cost-sensitive designs
Future Electronics DSP, Micros & Memory
The STM32C5 series from STMicroelectronics introduces a new generation of entry-level microcontrollers engineered to deliver enhanced processing capability, modern security, and cost-effective scalability for connected embedded applications.

Read more...
Next generation HMI processing platform
Future Electronics DSP, Micros & Memory
Microchip’s latest hybrid MCU SiP integrates an Arm926EJ-S processor with 512 Mb of DDR2 SDRAM and is engineered to meet the rising demand for sophisticated HMI solutions in modern vehicles.

Read more...
MIL-spec connector series
Future Electronics Interconnection
The MIL-HD2 connector series from Amphenol is the company’s next-generation, SOSA-aligned solution engineered to meet the most demanding requirements of modern military embedded systems.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved