Toshiba Electronic Devices & Storage Corporation has announced new power devices, the TWxxNxxxC series, its third-generation silicon carbide (SiC) MOSFETs that deliver low on-resistance and significantly reduced switching loss. Ten products, five 1200 V and five 650 V products, are available.
Compared to previous SiC MOSFETs, the new products reduce on-resistance per unit area (RDS(ON)A) up to 43%, allowing the drain-source on-resistance gate-drain charge (RDS(ON)*Qgd) to be lowered by about 80%. This cuts the switching loss by up to 20% and lowers both on-resistance and switching loss. The new products therefore contribute to higher equipment efficiency.
[Side note: The drain-source on-resistance gate-drain charge is an important index that represents the relationship between conduction loss and switching loss].
The company has accomplished this by developing a device structure that reduces on-resistance per unit area by using a structure with a built-in Schottky barrier diode originally developed for the second-generation SiC MOSFETs, and also reduces feedback in the JFET region.
Toshiba will continue to expand its lineup of power devices and to enhance its production facilities, and aims to realise a carbon-free economy by providing high-performance power devices that are easy to use.
Ideal applications for the MOSFET include switching power supplies found in servers, data centres and communication equipment, EV charging stations, photovoltaic inverters, and UPSs.
High-precision current transducer
Power Electronics / Power Management
Danisense announces its new high-precision DP12IP current transducer designed for isolated DC and AC current measurement in demanding PCB-mounted power electronics applications.
Read more...Secure holder for protected 18650 batteries
Power Electronics / Power Management
Designed for protected 18650 batteries up to 70 mm long, the holder offers secure retention for portable, industrial, and embedded applications.
Read more...More room to scale Altron Arrow
Power Electronics / Power Management
With the latest STM32H5 lines from STMicroelectronics, you can now scale within the same platform, from a compact 1 Mbyte device to higher-memory MCUs for graphics-rich and feature-heavy designs.
Read more...Surface mount power amplifier for high-power applications RF Design
Power Electronics / Power Management
The GNA-63-5W+, from Mini-Circuits, is a GaN MMIC Power Amplifier (PA) designed for demanding RF applications requiring high efficiency, excellent linearity, and a compact footprint.
Read more...1200 V QSiC modules
Power Electronics / Power Management
SemiQ Inc has launched the QSiC Dual3, a family of 1200 V half-bridge MOSFET modules for motor drives in data centre cooling systems, grid converters in energy storage systems, and industrial drivers.
Read more...UFS 5.0 flash for on-device AI EBV Electrolink
DSP, Micros & Memory
UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.
Read more...Expanded range of high-thermal-performance QSiC modules
Power Electronics / Power Management
SemiQ’s half-bridge series for data centre power converters and industrial motor drives features low RDSON SiC MOSFETs and parallel SBD diodes for best-in-class power density and conversion efficiency.
Read more...Transporting lithium batteries and IoT devices
Power Electronics / Power Management
With billions of rechargeable and non-rechargeable lithium cells and batteries powering most of the world’s consumer and industrial electronic devices, shipping them to customers through vast global logistics chains is often an overlooked topic.
Read more...Setting a new benchmark for high-power DC load testing Conical Technologies
Test & Measurement Power Electronics / Power Management
The new ITECH IT8900G/L high-speed, high-power DC electronic load offers a powerful combination of speed, scalability, precision and high-power density.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version