As part of 5G's new frequency spectrum, FR1 frequency bands up to 7,125 GHz have been assigned as well as new FR2 frequency expansion bands like 26-30 GHz and 37-47 GHz. NXP is well prepared to serve the requirements of these bands, with significant investment in three distinct, complementary technologies.
With LDMOS, Gallium Nitride (GaN) and Silicon Germanium (SiGe) BiCMOS, NXP are in a strong position. These technologies allow NXP to create ICs to operate at frequencies well into the mm-Wave space. As a next step into 6G, exploration at Terahertz frequencies has started.
For 6G, the core communication demands are to move cellular data around for productivity, interactivity, and entertainment. Base stations will be able to offer even more than they currently do, since so many of them are installing operations at inter-site distances of less than a kilometre. This densification of network infrastructure, the base stations for 5G, can provide increased situational awareness on top of the information the many additional connected devices already bring. The infrastructure can be implemented using dual-use base stations to provide both the communications as well as the sensing capability.
NXP is at the forefront of sensor technology, and has good opportunities to improve and augment automotive safety with the advent of B5G/6G.
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Power Electronics / Power Management
With the latest STM32H5 lines from STMicroelectronics, you can now scale within the same platform, from a compact 1 Mbyte device to higher-memory MCUs for graphics-rich and feature-heavy designs.
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Espressif Systems has introduced two new members of its ESP32 wireless SoC family: the ESP32-E22, the company’s first Wi-Fi 6E connectivity chip, and the ESP32-H21, an ultra-low-power Bluetooth LE microcontroller aimed at coin-cell and battery-powered devices.
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Qorvo has introduced an X-band radar front-end solution that enables defence system designers to achieve higher performance without increasing size, weight or prime power.
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Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.
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Quectel expands 5G portfolio with new Qualcomm- and UNISOC-based modules.
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Passive Components
Infineon Technologies has introduced the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and electromechanical relays (EMRs).
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Smaller, multi-camera platform enables scalable Ethernet architectures for NVIDIA Edge AI systems, while lowering power, cost and integration complexity.
Read more...Compact RTK design: More than just the receiver iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
In practice, engineers building compact RTK products keep discovering the same thing: the hardest component in the system is no longer the receiver. It is the antenna.
Read more...Microchip advances Space-Grade timing performance ASIC Design Services
Telecoms, Datacoms, Wireless, IoT
Microchip Technology has expanded its atomic clock portfolio with the radiation-tolerant Space CSAC-SA65, a Chip Scale Atomic Clock designed to deliver precise timing for space systems.
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