TE Connectivity offers the new range of ERNI connectors suitable for a vast range of applications.
ERNI’s iBridge Ultra connectors’ design includes locating pegs and built-in position assurance. iBridge Ultra wire-to-board connectors deliver high-current density in a miniature package. This single-row cable connector system features a compact 2 mm pitch and delivers up to 8 A per contact.
ERNI’s microbridge connector series has been designed specifically for the exacting standards of the modern automotive industry. These wire-to-board connectors offer a single row with a 1,27 mm pitch and deliver up to 9 A per contact at a temperature 20°C.
The MicroSpeed connectors by ERNI are a fine-pitch miniaturised line capable of handling data transmission up to 25 Gb/s with high signal integrity and reliability. These connectors provide a versatile interconnect solution for applications requiring either two-, three- or seven-row connections.
ERNI’s MicroCon series has been designed for automotive applications and provides a board-to-board miniaturised, robust connector solution. This dual-row connector, with a pitch of 0,8 mm, delivers up to 2,3 A per contact, while at the same time allowing for communication at 3 Gb/s.
4 mm pitch power connectors Spectrum Concepts
Interconnection
Mill-Max has introduced a new line of high-reliability, 4 mm (.157”) pitch sockets and headers designed for power connections and rugged field applications.
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Engineered to deliver notable signal integrity, TE Connectivity’s high-speed, high-density 56 G MezzaWave connector family is built on an open-pin-field array platform that supports data rates up to 56 Gbps PAM4 for next-generation modular system
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Amphenol Sine Systems ATD series connectors, available from Mouser, are a compact, high density, heavy duty, thermoplastic solution with superior environmental seals and end caps for exceptional rear seal retention.
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Interconnection
Samtec has announced a new product portfolio designed for the SGeT oHFM.c standard. These connectors are based on Samtec’s proven AcceleRate HD and AcceleRate HP high-density, high-performance product families.
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Silicon Labs unveils BG2B, its lowest-power Bluetooth LE SoC with industry-leading power efficiency, security, and integration.
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As the production distribution and utilisation of hydrogen continue to scale, connectivity becomes a key enabler for efficient energy transmission, data communication, and system control.
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