Indium Corporation has earned a BISinfotech BETA award as global leader in the solder and materials category. The honour was presented during a live streaming of the awards ceremony on Wednesday, 30 November. This marks the third consecutive year Indium has received a BETA award.
The annual BETA awards, presented by Indian technology magazine BISinfotech, recognise outstanding contributions and innovations from India’s top technology enablers. The prestigious award brings together the leading personalities and organisations from across the country’s technology sector who are helping the industry achieve new milestones.
Indium continues to deliver an ever-growing suite of innovative solder and thermal materials designed to enable world-changing technologies from the 5G lifestyle to electric vehicles, mobile communications, and more. Since its founding, Indium has been driven by its curiosity to look at materials from a different perspective, transforming the ordinary into the unexpected.
Embit signs NeoMesh wireless protocol stack licensing agreement
News
The agreement enables Embit to offer fully customised module solutions with integrated NeoMesh wireless protocol stack that leverage NeoMesh’s ultra-low power consumption and exceptional scalability.
Read more...Latest European market figures
News
The latest market figures indicate a modest, but notable return to growth across the European electronic components sector.
Read more...2025 GSA award nominees
News
The Global Semiconductor Alliance recently announced the nominees in various awards categories. Winners will be revealed at a gala event on 04 December 2025.
Read more...SAPVIA hails R2bn credit guarantee fund for transmission expansion
News
Soon after the mini budget was delivered in parliament, the South African Photovoltaic Industry Association (SAPVIA) congratulated Finance Minister, Enoch Godongwana, for the announcement of a R2 billion Credit Guarantee Vehicle.
Read more...Automotive Ethernet communications EBV Electrolink
News
EBV Elektronik has expanded its automotive solutions offering with Infineon’s Marvell Automotive Ethernet portfolio.
Read more...Large platform stencil printer Techmet
Manufacturing / Production Technology, Hardware & Services
GKG’s large platform stencil printer, the P-Primo, is designed to meet customer’s ultra-large printing requirements by supporting board dimensions up to 850 x 610 mm.
Read more...A new era in wire bond inspection Techmet
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Viscom is developing a 3D wire bond inspection system that incorporates substantially improved sensors, a high image resolution, and fast image data processing.
Read more...Electronic News Digest
News
A brief synopsis of current global news relating to the electronic engineering fields with regards to company finances, general company news, and engineering technologies.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version