New revision for BGA assembly standard
14 May 2008
News
The IPC has announced the release of IPC-7095B, Design and Assembly Process Implementation for BGAs.
Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents unique challenges for design, assembly, inspection and repair personnel, especially in light of recent changes in alloys and surface finishes. IPC-7095B offers practical information to anyone currently using BGAs or considering a conversion to area array packaging formats.
"The B revision of IPC-7095 was released at APEX in Vegas with 100% approval of voting members, which is an extraordinary achievement and a great tribute to the hard work of the committee," says Ray Prasad, principal of Ray Prasad Consultancy Group and committee chair.
"This version focuses on the design and assembly issues of lead-free BGAs along with applications that use both tin-lead and lead-free on the same board, including various solder ball alloys, new laminate materials for lead-free, BGA trace escape and routing considerations during board design to improve yield and reduce cost," adds Prasad. "There is also a detailed discussion of reflow solder profiling, void process indicators and ways to improve product reliability."
For more information visit www.ipc.org
Further reading:
Products of the Year 2025
News
With the electronics industry slowly rebounding after the downturn of 2024, many new and exciting products were announced across the various sectors. These are my picks for 2025.
Read more...
Embit signs NeoMesh wireless protocol stack licensing agreement
News
The agreement enables Embit to offer fully customised module solutions with integrated NeoMesh wireless protocol stack that leverage NeoMesh’s ultra-low power consumption and exceptional scalability.
Read more...
Latest European market figures
News
The latest market figures indicate a modest, but notable return to growth across the European electronic components sector.
Read more...
2025 GSA award nominees
News
The Global Semiconductor Alliance recently announced the nominees in various awards categories. Winners will be revealed at a gala event on 04 December 2025.
Read more...
Automation and AI: powering Africa’s energy future
News
Driving innovation, reliability, and digital transformation in Africa’s energy sector – a key focus at the 2026 Africa Energy Indaba.
Read more...
SAPVIA hails R2bn credit guarantee fund for transmission expansion
News
Soon after the mini budget was delivered in parliament, the South African Photovoltaic Industry Association (SAPVIA) congratulated Finance Minister, Enoch Godongwana, for the announcement of a R2 billion Credit Guarantee Vehicle.
Read more...
Automotive Ethernet communications
EBV Electrolink
News
EBV Elektronik has expanded its automotive solutions offering with Infineon’s Marvell Automotive Ethernet portfolio.
Read more...
Tronics Microsystems begins machine and asset health monitoring
News
Tronics Microsystems, a subsidiary of TDK, has announced its expansion into vibration sensor solutions, targeting process and asset monitoring to support predictive maintenance and industrial IoT applications.
Read more...
Electronic News Digest
News
A brief synopsis of current global news relating to the electronic engineering fields with regards to company finances, general company news, and engineering technologies.
Read more...
4000 A containerised DB for power project
News
Power Process Systems has successfully completed the design, fabrication, and commissioning of a 4000 A containerised distribution board for a wind/PV solar hybrid renewable energy project.
Read more...
printer friendly version