Computer/Embedded Technology


SBCs in SUMIT-ISM format

28 April 2010 Computer/Embedded Technology

Adlink has demonstrated its support for the ISM and SUMIT standards with the CoreModule range of embedded PC/104 SBCs (single board computers).ISM, short for industry standard module, is a pure 90 x 96 mm form factor (compatible with PC/104) that addresses shortcomings of existing small form factors, such as:

* Fitting circuitry without extending beyond the board outline.

* Meeting top- and bottom-side component height restrictions.

* Decoupling form factors from expansion interfaces.

* Enabling flexible expansion bus and I/O connectorisation.

* Allowing bus combinations that were previously undefined and unnamed.

SBC manufacturers have struggled to fit modern legacy-free platforms onto small form factors without protruding beyond the allowed board outlines with ‘wings’. With the ISA bus, serial ports and even the PCI bus no longer integrated into lowpower chipsets, it takes extra circuitry to meet the needs of many embedded applications. The ISM specification defines the board size, four fixed mounting holes, component height limits and flexible ‘expansion zones’ for I/O and/or bus connectors. The fixed corner mounting holes allow re-use of enclosures without modifications in the future.

ISM allows many combinations of bus and I/O connectors as long as those interfaces reside within the defined expansion zones. ISM also offers a choice of using right-angle connectors that overhang the board edges, or extending the circuit board if vertical/non-overhang connectors are used. ISM boards can be SBCs, stackable CPU and I/O cards, and even computer-on-modules (COMs). This flexibility allows easy migration from SBCs to COMs and vice versa, or from processor to processor, while preserving investments in mechanical designs.

SUMIT is one of many board-to-board expansion interfaces that are permitted with ISM. SUMIT, short for stackable unified module interconnect technology, offers PCI Express, USB, SPI, I²C and LPC Bus expansion using 52-pin, high-bandwidth, rugged Samtec Q2 series connectors. This mix of high-speed and low-speed buses simplifies the task of attaching many types of I/O without complex bridges and software.

An independent standards organisation called the Small Form Factor Special Interest Group, or SFF-SIG, creates, adopts and maintains a number of emerging standards for the low-power, small form factor market. As consumer technology is often inappropriate for the embedded market, the standards feature reusable modular building blocks, developed by embedded vendors for embedded OEMs. Many of these are optimised for ultra low-power processors and controllers, yet scale up to multicore processor environments. The ISM and SUMIT standards fall within this organisation’s purview.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

What happens when trust can no longer live only in software?
Computer/Embedded Technology Electronics Technology
[Sponsored] For years, many enterprise security architectures treated hardware primarily as the execution layer, while software handled authentication, access control and trust decisions.

Read more...
Plug-in timing module
Comtest Computer/Embedded Technology
Microchip’s MD-990-0011-B timing module redefines the role of timing, making it possible for customers to seamlessly integrate advanced synchronisation at any stage of development.

Read more...
Advanced Layer 2 industrial switches
Vepac Electronics Computer/Embedded Technology
The Raptor EP4200 and EP5200 series switches provide advanced Layer 2 switching capabilities with high performance and availability tailored for demanding critical infrastructure and energy applications.

Read more...
Reliable isolation for modern networks
ASIC Design Services Computer/Embedded Technology
The Pro-Tek5 PTI Series delivers reinforced 5 kV Ethernet isolation for applications that demand robust protection, reliable signal integrity, and full IEEE802.3 performance.

Read more...
Next-gen modules for rugged edge AI systems
Altron Arrow Computer/Embedded Technology
Designed for real-world edge deployments where systems do not sit still, SolidRun’s P100 COMx6 series targets mobile platforms as well as harsh, mission-critical environments.

Read more...
Fanless multimedia edge PC
Vepac Electronics Computer/Embedded Technology
Dual 4K display capabilities, ultra-efficient processing, and versatile mounting options make the Intelli TWL01 Edge the ultimate embedded platform for multimedia solution building.

Read more...
Advanced industrial connectivity at the edge
Future Electronics Computer/Embedded Technology
Dual 4K display capabilities, ultra-efficient processing, and versatile mounting options make the Intelli TWL01 Edge the ultimate embedded platform for multimedia solution building.

Read more...
A software-based controller for the industrial future
Phoenix Contact Computer/Embedded Technology
With Virtual PLCnext Control, Phoenix Contact is launching a software-based controller solution that enables flexible automation functions in virtualised IT environments.

Read more...
5G mobile hotspot with integrated multimodal AI capabilities
CST Electronics Computer/Embedded Technology
MeiG Smart has launched its first 5G Mobile HotSpot solution, the SRT8710, a breakthrough in mobile connectivity that combines ultra-fast 5G communications with integrated multimodal artificial intelligence functions.

Read more...
Panasonic TOUGHBOOK 33 2-in-1 detachable
Vepac Electronics Computer/Embedded Technology
The Panasonic TOUGHBOOK 33 is a fully rugged 12-inch 2-in-1 detachable notebook designed to deliver unmatched flexibility, durability, and performance for mobile professionals working in demanding environments.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved