IPC revises five standards
25 March 2020
News
IPC announced the release of five newly revised standards covering several areas of the supply chain:
· IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness Assemblies.
· IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards.
· IPC-2591-Version 1.1, Connected Factory Exchange (CFX).
· IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements.
· IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards.
IPC/WHMA-A-620D provides several changes that were requested by the industry. The task group addressed the target conditions in the document by moving some conditions to acceptable criteria while other cases were moved to training. There are several new or revised graphics, the solderless wrap section was completely revised, and a new section was added for over-moulding of flexible flat ribbon.
IPC-2223E establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. Several figures have been updated, new sections and comments added on microvia stacking, and back-drilled holes and dual-row zero insertion fore (ZIF) connectors have been updated.
IPC-6012E establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. It provides new acceptance criteria for back-drilled holes, establishes new requirements for copper wrap plating of holes in new designs, and discusses reliability issues for microvia structures in Class 3 products.
IPC-2591 V1.1 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. It provides changes made to message sections, and message structure sections, adds Appendix A with a short description of all changes from V1.0, and Appendix B which provides acronyms and abbreviations.
IPC-1791A provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organisations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. The new Appendix D covers requirements for trust certification of non-US electronic design, fabrication and assembly organisations, several sections have been updated from Scope through and including 3.0 – requirements, and classifications of Class I, 2 and 3 have been added.
For more information visit www.ipc.org
Further reading:
From the editor's desk: Yes, it’s that thing everyone’s talking about
25 March 2020, Technews Publishing
, News
Call me a pessimist, but I’m absolutely, 100% certain that I’m going to catch COVID-19 (or the ‘novel coronavirus’ if you prefer to call it that) – if I haven’t done so already. At least the mortality
...
Read more...
Electronics news digest
25 March 2020
, News
Overseas Business
• ams reported record revenues and results for full year 2019, with revenues up 32% year-on-year, and fourth quarter revenues exceeding expectations with strong adjusted operating
...
Read more...
XinaBox – Reaching for the stars
25 March 2020, RS Components (SA)
, News
From collecting data in sub-zero Antarctica to rapid circuit prototyping on the International Space Station this South African company is reinventing the way we approach IoT while inspiring students to follow STEM careers.
Read more...
Electrocomp launches new website
25 March 2020, Electrocomp
, News
Electrocomp is inviting visitors to explore its new website, which has been designed to offer a user-friendly experience with improved navigation and functionality while allowing customers to see their
...
Read more...
Looking beyond radar, the car’s virtual eye
25 March 2020, Altron Arrow
, News
Faster, higher-resolution radar sensors have enabled the next generation of driver assistance technologies through improvements in vehicle safety and comfort in view.
Read more...
Disposing of e-waste in space
26 February 2020
, News
According to BBC, there are over half a million pieces of debris floating around the Earth’s orbit. Most debris within the atmosphere are lost parts from space crafts, disused rocket stages or waste from
...
Read more...
Testerion to represent ITW EAE in SA
26 February 2020, Testerion
, News
ITW EAE announced a new extended partnership agreement with Testerion South Africa to represent and distribute all ITW EAE equipment including MPM printers, Camalot dispensers, Electrovert soldering systems,
...
Read more...
Würth helps produce PCBs for ventilators
25 March 2020, Würth Elektronik eiSos
, News
The worldwide spread of the coronavirus is not only increasing the demand for personal protective equipment, but also for medical ventilators. In order to ensure the supply in Germany, the German government
...
Read more...
u-blox acquires Thingstream
25 March 2020
, News
u-blox has acquired IoT communication-as-a-service provider, Thingstream. Thingstream provides a comprehensive, end-to-end solution for global IoT connectivity using the industry standard MQTT protocol.
...
Read more...
Conical Technologies becomes official Ranatec distributor
25 March 2020, Conical Technologies
, News
Ranatec has entered a reseller agreement with Conical Technologies. The supplier of electronics components will market and sell Ranatec’s portfolio of niche RF and microwave test and measurement equipment
...
Read more...
printer friendly version