Technical Literature


Book on lead-free assembly

29 July 2020 Technical Literature

Indium’s Dr Ning-Cheng Lee (pictured), vice president of technology, has co-authored ‘Assembly and Reliability of Lead-Free Solder Joints’ with Dr John H. Lau. The book is a new source on lead-free solder joints for advanced reliability across the complete food chain of electronics products.


Ning-Cheng Lee.

The first edition, published by Springer, Singapore, is currently available in print and eBook forms. It explores both principles and engineering practices, and provides a comprehensive overview of electronics products – from electronics manufacturing services (EMS) on second-level interconnects, to packaging assembly on first-level interconnects, and the semiconductor backend on 3D IC integration interconnects.

Each chapter delves into a different topic relevant to the industry, including solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterisation of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints.

To purchase a copy of the book, visit www.link.springer.com or www.amazon.com and search for “Ning-Cheng Lee.”




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