Webinar: What is a good solder joint – how to test your joints

30 September 2020 Events

OEM and CEM electronics assembly companies buy components and printed circuit boards but they make solder joints, so they need to get it right first time. Design plays a key role in making a solder joint but how can we test them, what are the simple methods to give us confidence in our product or process?

Over the years we have moved from through-hole to surface-mount and more recently to area-array-bottomless-terminations. Each type needs to be tested in some way to compare alternative materials and processes and provide evidence to customers, but also to control and monitor your process.

Bob Willis will be presenting a webinar covering these topics, including a Q&A; session which provides ample time for delegates’ questions to be answered. Topics included in our webinar include solder joint test methods, soldering standards, component and pad design, typical solder joint failures, test standards and criteria and impact of soldering materials.

The webinar will run for between 60 and 90 minutes with question and answer sessions. It is limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

When: 2 November 2020 from 2:30 to 4:00 pm (UK time).

Duration: Between 60 and 90 minutes, including question and answer session.

Cost: £65

Register: www.bobwillis.co.uk/event/what-is-a-good-solder-joint-how-to-test-your-joints/

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