DSP, Micros & Memory


NXP unveils advanced i.MX applications processors

26 February 2021 DSP, Micros & Memory

NXP Semiconductors announced the expansion of its EdgeVerse portfolio with its crossover applications processors, including i.MX 8ULP and i.MX 8ULP-CS (cloud secured) Microsoft Azure Sphere-certified families, as well as next-generation i.MX 9 series of high-performance, intelligent applications processors. The expansion includes new innovations with EdgeLock secure enclave to enhance edge security and Energy Flex architecture to maximise energy efficiency.

Self-managed, autonomous on-die security subsystem

Building on its strong history of providing turnkey security solutions, NXP introduced the EdgeLock secure enclave, a pre-configured security subsystem that simplifies implementation of complex security technologies and helps designers avoid costly errors. It enhances protection to the edge device by autonomous management of critical security functions, such as root of trust, run-time attestation, trust provisioning, secure boot, key management, and cryptographic services, while also simplifying the path to industry-standard security certifications.

The EdgeLock secure enclave intelligently tracks power transitions when end-user applications are running to help prevent new attack surfaces from emerging. The secure enclave will be a standard integrated feature across the i.MX 8ULP, i.MX 8ULP-CS with Azure Sphere, and i.MX 9 applications processors, providing developers with a wide range of compute scalability options to easily deploy security on thousands of edge applications.

Security peace of mind with Azure Sphere

Keeping an edge device secure long after initial deployment is a challenge that requires nonstop trusted management services. NXP partnered with Microsoft to bring this capability to its customers with Azure Sphere chip-to-cloud security in the i.MX 8ULP-CS (cloud secured) applications processor family.

The i.MX 8ULP-CS with Azure Sphere incorporates Microsoft Pluton enabled on EdgeLock secure enclave as the secured root of trust built into the silicon itself, and as a key step toward enabling highly secured devices for a vast range of IoT and industrial applications. In addition to the secured hardware, Azure Sphere includes the secured Azure Sphere OS, the cloud-based Azure Sphere Security Service, and ongoing OS updates and security improvements for over ten years. Azure Sphere chip-to-cloud security will be enabled on specific products within the i.MX 9 series, giving developers an even broader set of processor options to implement managed device security across more of their products.

Energy Flex architecture for tailored power-performance profiles

Optimising energy use at the chip level is becoming an increasingly crucial part of designing energy-efficient edge systems. NXP’s implementation of innovative Energy Flex architecture is designed to extend battery life and reduce energy wastage in portable or plugged-in devices.

In the i.MX 8ULP and i.MX 8ULP-CS families, the Energy Flex architecture delivers as much as 75% improved energy efficiency over its predecessor by uniquely combining heterogeneous domain processing, design techniques and 28 nm FD-SOI process technology.

Embedded in these processors is a programmable power management subsystem that can govern more than twenty different power mode configurations to deliver exceptional energy efficiency – from full power to as low as 30 microwatts. Using this range of flexible configurations, OEMs and developers can customise application-specific power profiles to maximise energy efficiency.

Advanced intelligent applications processors for multi-sensory data

Building on the market-proven i.MX 6 and i.MX 8 series of applications processors, NXP’s i.MX 9 series deèbuts a new generation of scalable, high-performance processors. Scalable i.MX 9 families bring together higher-performance applications cores, an independent MCU-like real-time domain, Energy Flex architecture, state-of-the art security with EdgeLock secure enclave, and dedicated multi-sensory data processing engines (graphics, image, display, audio and voice).

The i.MX 9 series integrates hardware neural processing units across the entire series for acceleration of machine learning applications. It also marks NXP’s first implementation of the Arm Ethos U-65 microNPU, which makes it possible to build low-cost, energy-efficient edge machine learning (ML).


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Redefining entry-level MCUs
NuVision Electronics DSP, Micros & Memory
The company positions the GD32C231 series as a ‘high-performance entry-level’ solution designed to offer more competitive options for multiple applications.

Read more...
High-reliability isolation amplifiers
EBV Electrolink Analogue, Mixed Signal, LSI
The VIA series of isolation amplifiers from Vishay are designed to deliver exceptional thermal stability and precise measurement capabilities.

Read more...
Microchip enhances TrustMANAGER platform
Altron Arrow DSP, Micros & Memory
Firmware over-the-air updates and remote cryptographic key management provide scalable solutions for addressing IoT security challenges.

Read more...
First NVMe SSD Built with 8th-gen BiCS FLASH
EBV Electrolink Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.

Read more...
MCU for low-power, IoT applications
NuVision Electronics DSP, Micros & Memory
Silicon Labs recently announced the PG26, a general-purpose microcontroller with a dedicated matrix vector processor to enhance AI/ML hardware accelerator speeds.

Read more...
IMU with dual-sensing capability
EBV Electrolink Analogue, Mixed Signal, LSI
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing.

Read more...
EEPROMs for industrial and military markets
Vepac Electronics DSP, Micros & Memory
Designed to ensure the data retention and the secure and safe boot of digital systems, the memory product line includes small and medium density EEPROMs from 16 kb to 1 Mb.

Read more...
PLCnext – Open, IIoT-ready industrial platform
IOT Electronics DSP, Micros & Memory
PLCnext can be used alongside an existing PLC system, collecting control system data via EtherNet/IP, PROFINET, or MODBUS, and can push this information to a cloud instance.

Read more...
ICs vs modules: Understanding the technical trade-offs for IoT applications
NuVision Electronics Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.

Read more...
Hardware quantum resistance to embedded controllers
Avnet Silica DSP, Micros & Memory
To help system architects meet evolving security demands, Microchip Technology has developed its MEC175xB embedded controllers with embedded immutable post-quantum cryptography support.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved