DSP, Micros & Memory


NXP unveils advanced i.MX applications processors

26 February 2021 DSP, Micros & Memory

NXP Semiconductors announced the expansion of its EdgeVerse portfolio with its crossover applications processors, including i.MX 8ULP and i.MX 8ULP-CS (cloud secured) Microsoft Azure Sphere-certified families, as well as next-generation i.MX 9 series of high-performance, intelligent applications processors. The expansion includes new innovations with EdgeLock secure enclave to enhance edge security and Energy Flex architecture to maximise energy efficiency.

Self-managed, autonomous on-die security subsystem

Building on its strong history of providing turnkey security solutions, NXP introduced the EdgeLock secure enclave, a pre-configured security subsystem that simplifies implementation of complex security technologies and helps designers avoid costly errors. It enhances protection to the edge device by autonomous management of critical security functions, such as root of trust, run-time attestation, trust provisioning, secure boot, key management, and cryptographic services, while also simplifying the path to industry-standard security certifications.

The EdgeLock secure enclave intelligently tracks power transitions when end-user applications are running to help prevent new attack surfaces from emerging. The secure enclave will be a standard integrated feature across the i.MX 8ULP, i.MX 8ULP-CS with Azure Sphere, and i.MX 9 applications processors, providing developers with a wide range of compute scalability options to easily deploy security on thousands of edge applications.

Security peace of mind with Azure Sphere

Keeping an edge device secure long after initial deployment is a challenge that requires nonstop trusted management services. NXP partnered with Microsoft to bring this capability to its customers with Azure Sphere chip-to-cloud security in the i.MX 8ULP-CS (cloud secured) applications processor family.

The i.MX 8ULP-CS with Azure Sphere incorporates Microsoft Pluton enabled on EdgeLock secure enclave as the secured root of trust built into the silicon itself, and as a key step toward enabling highly secured devices for a vast range of IoT and industrial applications. In addition to the secured hardware, Azure Sphere includes the secured Azure Sphere OS, the cloud-based Azure Sphere Security Service, and ongoing OS updates and security improvements for over ten years. Azure Sphere chip-to-cloud security will be enabled on specific products within the i.MX 9 series, giving developers an even broader set of processor options to implement managed device security across more of their products.

Energy Flex architecture for tailored power-performance profiles

Optimising energy use at the chip level is becoming an increasingly crucial part of designing energy-efficient edge systems. NXP’s implementation of innovative Energy Flex architecture is designed to extend battery life and reduce energy wastage in portable or plugged-in devices.

In the i.MX 8ULP and i.MX 8ULP-CS families, the Energy Flex architecture delivers as much as 75% improved energy efficiency over its predecessor by uniquely combining heterogeneous domain processing, design techniques and 28 nm FD-SOI process technology.

Embedded in these processors is a programmable power management subsystem that can govern more than twenty different power mode configurations to deliver exceptional energy efficiency – from full power to as low as 30 microwatts. Using this range of flexible configurations, OEMs and developers can customise application-specific power profiles to maximise energy efficiency.

Advanced intelligent applications processors for multi-sensory data

Building on the market-proven i.MX 6 and i.MX 8 series of applications processors, NXP’s i.MX 9 series deèbuts a new generation of scalable, high-performance processors. Scalable i.MX 9 families bring together higher-performance applications cores, an independent MCU-like real-time domain, Energy Flex architecture, state-of-the art security with EdgeLock secure enclave, and dedicated multi-sensory data processing engines (graphics, image, display, audio and voice).

The i.MX 9 series integrates hardware neural processing units across the entire series for acceleration of machine learning applications. It also marks NXP’s first implementation of the Arm Ethos U-65 microNPU, which makes it possible to build low-cost, energy-efficient edge machine learning (ML).


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Memory for asset tracking
Altron Arrow DSP, Micros & Memory
The Page EEPROM, ST’s latest memory, has been designed for efficient datalogging and fast firmware upload/download in battery-operated devices.

Read more...
Engineered for high-reliability applications
Future Electronics DSP, Micros & Memory
The MCX E series of Arm Cortex-M4F and Arm Cortex-M7 microcontrollers from NXP are engineered for demanding industrial and IoT environments.

Read more...
NXP’s development platform guide
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.

Read more...
XJTAG launches two new Flash programmers
ASIC Design Services DSP, Micros & Memory
XJTAG has announced XJExpress and XJExpress-FPGA, a pair of Flash programmers perfect for development, debug and in-service applications.

Read more...
Processor offers competitive solution for advanced HMIs
Future Electronics DSP, Micros & Memory
The new RZ/A3M microprocessor from Renesas features 128 Mbytes of fast DDR3L DRAM memory for system cost reduction, and supports 1280 x 800 px video resolution at a rate of 30 frames/s.

Read more...
ESP32-C6 achieves PSA-L2
iCorp Technologies DSP, Micros & Memory
Espressif Systems recently announced that its ESP32-C6 microcontroller has achieved PSA Certified Level 2 (PSA-L2) security certification, making it the first RISC-V-based MCU to reach this level.

Read more...
Microprocessor with integrated NPU
Avnet Silica DSP, Micros & Memory
The RZ/G3E from Renesas is a microprocessor integrated with quad CPU and NPU in one chip, improving power efficiency, reliability, and security.

Read more...
Nordic Semiconductor launches nRF Connect SDK Bare Metal option for nRF54L series
Avnet Silica DSP, Micros & Memory
This is a new, RTOS-independent software solution for Bluetooth LE development, designed to ease developers’ migration from the legacy nRF5 SDK and nRF52 series to the next-generation nRF54L series.

Read more...
Dual-core support in NECTO Studio
DSP, Micros & Memory
MIKROE recently announced that version 7.3.0 of its NECTO Studio Integrated Development Environment now supports dual-core MCUs, allowing designers to program and debug each core independently.

Read more...
Post Quantum Cryptographic firmware library
DSP, Micros & Memory
The STM32 post-quantum cryptographic library enables developers to satisfy application requirements for any combination of data integrity, confidentiality, identification/authentication, and nonrepudiation.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved