Manufacturing / Production Technology, Hardware & Services


Indium introduces new ball-attach flux

26 May 2021 Manufacturing / Production Technology, Hardware & Services

Indium continues to expand its flux portfolio with WS-823 – a one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate.

While the standard ball-attach process requires two steps, especially on a Cu-OSP substrate, WS-823 is a halogen-free, water-wash flux designed for a single-step ball-attach process that eliminates the prefluxing step in order to create reliable ball-to-pad joints.

WS-823 provides:

• Tackiness suitable for holding solder spheres in place during reflow.

• Excellent solderability on a wide range of surfaces, including AuNi and oxidised Cu-OSP.

• Uniform pin transfer over extended periods, eliminating changes in joint quality over time and uneven deposit sizes, which can lead to ‘missing ball’.

• A formula engineered for low voiding, thereby increasing joint strength.

• Good cleanability with room temperature DI water, avoiding the formation of white residue.


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