26 May 2021Manufacturing / Production Technology, Hardware & Services
Indium continues to expand its flux portfolio with WS-823 – a one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate.
While the standard ball-attach process requires two steps, especially on a Cu-OSP substrate, WS-823 is a halogen-free, water-wash flux designed for a single-step ball-attach process that eliminates the prefluxing step in order to create reliable ball-to-pad joints.
WS-823 provides:
• Tackiness suitable for holding solder spheres in place during reflow.
• Excellent solderability on a wide range of surfaces, including AuNi and oxidised Cu-OSP.
• Uniform pin transfer over extended periods, eliminating changes in joint quality over time and uneven deposit sizes, which can lead to ‘missing ball’.
• A formula engineered for low voiding, thereby increasing joint strength.
• Good cleanability with room temperature DI water, avoiding the formation of white residue.
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