Events
25 August 2021
News
Nepcon Vietnam
15-17 September 2021
Hanoi, Vietnam
Covers SMT, testing technologies, equipment and supporting industries for electronics manufacturing. The event will bring together technologies and solutions from over 200 brands, updating visitors on the hottest trends via on-site forums and conferences and complementary business matchmaking programmes.
Register at www.nepconvietnam.com
PCB West
5-8 October 2021
California, USA
For 30 years PCB West has trained designers, engineers, fabricators and lately, assemblers on making printed circuit boards for every product or use imaginable. More than 2500 designers, fabricators, assemblers and engineers register and more than 100 companies exhibit each year at the four-day technical conference and one-day exhibition.
Register at https://pcbwest.com
5G Antenna Systems
13 October 2021
Virtual
The conference programme will cover market opportunities, new 5G antenna technology and the endless emerging application trends. Topics will include antenna design, integration, 5G developments and insights and supporting technologies for the 5G ecosystem.
Register at www.antennasonline.com
SMTA International
1-4 November 2021
Minnesota, USA
Conference and exhibition covering SMT manufacturing equipment and technologies, featuring high-quality technical information and networking opportunities.
Register at https://smta.org/mpage/smtai
electronica India
16-18 December 2021
Bengaluru, India
Features a comprehensive range of products and services for the electronics industry, with highlighted topics including automotive, embedded systems, industrial electronics, Internet of Things, PCB, printed electronics and test and measurement.
Register at www.electronica-india.com
Further reading:
Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.
Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.
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AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).
Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.
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Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.
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Siemens acquires Canopus AI
ASIC Design Services
News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.
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Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.
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Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.
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AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.
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Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.
Read more...
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